User's Manual

BMD-100 Module Datasheet
Bluetooth 4.1 LE
1/5/2014
BMD-100-DS-V0.5 PRELIMINARY Page 3 of 17
Table of Contents
1. FEATURES .................................................................................................................................................................. 1
2. ORDERING INFORMATION ........................................................................................................................................ 2
3. HARDWARE BLOCK DIAGRAM ................................................................................................................................... 2
4. SOFTWARE BLOCK DIAGRAM .................................................................................................................................... 2
5. QUICK SPECIFICATIONS ............................................................................................................................................. 4
6. PIN DESCRIPTIONS .................................................................................................................................................... 5
7. ELECTRICAL SPECIFICATIONS ..................................................................................................................................... 6
7.1. ABSOLUTE MAXIMUM RATINGS ................................................................................................................................ 6
7.2. OPERATING CONDITIONS .......................................................................................................................................... 6
7.3. SPI INTERFACE ........................................................................................................................................................... 6
7.4. CLOCKS ....................................................................................................................................................................... 6
7.5. NOTE .......................................................................................................................................................................... 7
8. APPLICATION CONTROLLER INTERFACE ..................................................................................................................... 7
9. MECHANICAL DATA ................................................................................................................................................... 8
9.1. MODULE DIMENSIONS .............................................................................................................................................. 8
9.2. RECOMMENDED PCB LAND PAD ............................................................................................................................... 8
10. MODULE MARKING ................................................................................................................................................. 9
11. RF DESIGN NOTES.................................................................................................................................................... 9
11.1. RECOMMENDED RF LAYOUT & GROUND PLANE..................................................................................................... 9
11.2. MECHANICAL ENCLOSURE ..................................................................................................................................... 10
11.3. ANTENNA PATTERN ............................................................................................................................................... 10
11.3.1. S33 SMITH CHART ........................................................................................................................................... 10
11.3.2. 3D RADIATION PATTERN ................................................................................................................................. 10
11.3.3. XY-PLANE ......................................................................................................................................................... 10
11.3.4. XZ-PLANE ......................................................................................................................................................... 10
11.3.5. YZ-PLANE ......................................................................................................................................................... 10
12. EVALUATION BOARDS ........................................................................................................................................... 10
13. CUSTOM DEVELOPMENT ....................................................................................................................................... 11
14. BLUETOOTH CERTIFICATION .................................................................................................................................. 11
15. REGULATORY STATEMENTS .................................................................................................................................. 12
15.1. FCC STATEMENT: ................................................................................................................................................... 12
15.2. FCC IMPORTANT NOTES: ....................................................................................................................................... 12
15.3. IC STATEMENT: ...................................................................................................................................................... 13
15.4. IC IMPORTANT NOTES: .......................................................................................................................................... 13
15.5. CE REGULATORY: ................................................................................................................................................... 14
16. SOLDER REFLOW TEMPERATURE-TIME PROFILE .................................................................................................... 15
17. PACKAGING AND LABELING .................................................................................................................................. 15
17.1. CARRIER TAPE DIMENSIONS .................................................................................................................................. 15
17.2. REEL PACKAGING ................................................................................................................................................... 15
17.3. PACKAGING LABEL ................................................................................................................................................. 15
18. CAUTIONS ............................................................................................................................................................. 16
19. LIFE SUPPORT POLICY ............................................................................................................................................ 16
20. DOCUMENT HISTORY ............................................................................................................................................ 16
21. RELATED DOCUMENTS .......................................................................................................................................... 17