Data Sheet

R8002 Datasheet
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7. RECOMMENDED TEMPERATURE REFLOW PROFILE
Prior to any reflow, it is important to ensure the modules were packaged to prevent moisture absorption. New packages
contain desiccate (to absorb moisture) and a humidity indicator card to display the level maintained during storage and
shipment. If directed to bake units on the card, please check the below next table and follow instructions specified by
IPC/JEDEC J-STD-033.
Note: The shipping tray cannot be heated above 65°C. If baking is required at the higher temperatures displayed in the
below next table, the modules must be removed from the shipping tray.
Any modules not manufactured before exceeding their floor life should be re-packaged with fresh desiccate and a new
humidity indicator card. Floor life for MSL (Moisture Sensitivity Level) 3 devices is 168 hours in ambient environment
30°C/60%RH.
Table 10:
Recommended baking times and temperatures
MSL
125°C Baking Temp. 90°C/≤ 5%RH Baking Temp. 40°C/ ≤ 5%RH Baking Temp.
Saturated @
30°C/85%
Floor Life Limit
+ 72 hours @
30°C/60%
Saturated @
30°C/85%
Floor Life Limit
+ 72 hours @
30°C/60%
Saturated @
30°C/85%
Floor Life Limit
+ 72 hours @
30°C/60%
3
9 hours
7 hours
33 hours
23 hours
13 days 9 days
Feasycom surface mount modules are designed to be easily manufactured, including reflow soldering to a PCB.
Ultimately it is the responsibility of the customer to choose the appropriate solder paste and to ensure oven
temperatures during reflow meet the requirements of the solder paste. Feasycom surface mount modules conform to
J-STD-020D1 standards for reflow temperatures.
The soldering profile depends on various parameters necessitating a set up for each application. The data here is
given only for guidance on solder reflow.
210
217
℃
250
A
B C D
1 2
0
25
3 4 5 6
min
E
Figure 6: Typical Lead-free Re-flow
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