Data Sheet

Copyright © Bridgetek Pte Ltd 57
BT81X (815/6) Advanced Embedded Video Engine Datasheet
Version 1.0
Document No.: BRT_000220 Clearance No.: BRT#126
8.2 VQFN-64 Package Dimensions
A
A1
A3
b
D
E
D2
E2
e
L
K
MIN.
0.80
0.00
0.18
7.25
7.25
0.35
0.20
NOM.
0.85
0.02
0.20
0.25
9.00
9.00
7.30
7.30
0.50
0.40
MAX.
0.90
0.05
0.30
7.35
7.35
0.45
All dimensions are in millimetres (mm)
Figure 8-1 VQFN-64 Package Dimensions
8.3 Solder Reflow Profile
The recommended solder reflow profile for the package is shown in Figure 8-2.
Figure 8-2 BT815/6 Solder Reflow Profile
The recommended values for the solder reflow profile are detailed in Figure 8-2. Values are shown for
both a completely Pb free solder process (i.e. the BT815/6 is used with Pb free solder), and for a non-Pb
free solder process (i.e. the BT815/6 is used with non-Pb free solder).
Critical Zone: when
T is in the range
T to T
Temperature, T (Degrees C)
Time, t (seconds)
25
P
T = 25º C to T
t
p
T
p
T
L
t
Preheat
S
t
L
Ramp Up
L
p
Ramp
Down
T Max
S
T Min
S