Datasheet

White SMD LED,
3.2x1mm
3.6. Because different board designs use different number and types of devices, solder pastes, reflow ovens, and circuit boards,
no single temperature profile works for all possible combinations.
However, you can successfully mount your packages to the PCB by following the proper guidelines and PCB-specific
characterization
4. Drive Method
4.1. An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs connected in parallel
in an application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each
LED as shown in Circuit A below.
Circuit model A Circuit model B
LED LED
a. Recommended circuit.
b. The brightness of each LED might appear different due to the differences in the I-V characteristics of those LEDs.
5. ESD (Electrostatic Discharge):
Static Electricity or power surge will damage the LED. Suggestions to prevent ESD damage:
 Use of a conductive wrist band or anti-electrostatic glove when handling these LEDs.
 All devices, equipment, and machinery must be properly grounded.
 Work tables, storage racks, etc. should be properly grounded.
 Use ion blower to neutralize the static charge which might have built up on surface of the LED’s plastic lens as a result of
friction between LEDs during storage and handling.
ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low forward voltage, or “no
lightup” at low currents. To verify for ESD damage, check for “lightup” and Vf of the suspect LEDs at low currents. The Vf of
“good” LEDs should be >2.0V@0.1mA for InGaN product and >1.4V@0.1mA for AlInGaP product.
Art. Nr.
RND 135-00237
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