Datasheet

ManualsBrandsRND Components ManualsThermistorsSMD Thermistor NTC 10kOhm 3500K

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Features

• ,ŝŐŚƚĞƐƚŝŶŐƉƌĞĐŝƐŝŽŶ

• ^ƚĞĂĚǇŽƉĞƌĂƚŝŶŐĨŽƌůŽŶŐƚŝŵĞ

• ZĞĨůŽǁƐŽůĚĞƌŝŶŐƉŽƐƐŝďůĞ

• ^ŚŽƌƚƌĞƐƉŽŶƐĞƚŝŵĞ

Type

Delimeter

103

Nominal Resistance

Tolerance

3450

B Constant

RND 155QN0402: 0402

RND 155QN0603: 0603

RND 155QN0805: 0805

472 = 4.7 kΩ

103 = 10 kΩ

334 = 330 kΩ

F = ± 1%

3450 = 3450 K

3950 = 3950 K

4050 = 4050 K

4500 = 4500 K

Tolerance of B Constant

Chip NTC Thermistor

RND 155QN0402

G = ± 2%

H = ± 3%

J = ±5 %

F = ± 1%

H = ± 3%

B Constant Calculation Method

A = 25℃ & 85 ℃

B = 25℃ & 50 ℃

Electrical Characteristics

Type Resistance

@ 25 °C

B Constant

@ 25 / 50 °C

B Constant

@ 25 / 85 °C

Permissible

Operating Current

@ 25 °C

Dissipation

Factor

Thermal

Time

Constant

Rated Electric

Power @ 25 °C

Operating

Ambient

Temperature

RND 155QN0402X103F3450FB

10 kΩ ±1%

3500 K

3450 K ±1%

0.31 mA

1 mW / °C

<3 s

100 mW

40 ... 125 °C

Shape and Dimensions

Recommended PCB pattern for reflow soldering

Dimensions

Type L

0402

0603

0805

1 mm

1.6 mm

2 mm

0.5 mm

0.8 mm

1.25 mm

0.5 mm

0.8 mm

0.85 mm

0.25 mm

0.3 mm

0.5 mm

0.45 ... 0.55 mm

0.6 ... 0.8 mm

1 ... 1.1 mm

0.4 ... 0.5 mm

0.6 ... 0.7 mm



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ϬϲϬϴŵŵ

ϭ ... ϭϮ mm

Applications

PART NUMBER

Example: RND 155QN0402X103F3450FB

• dĞŵƉĞƌĂƚƵƌĞŵĞĂƐƵƌĞŵĞŶƚ

• ĂƚƚĞƌǇĐŚĂƌŐĞƌƐ

• dĞŵƉĞƌĂƚƵƌĞƐĞŶƐŝŶŐƉƌŽƚĞĐƚŝŽŶĂŶĚĐŽŵƉĞŶƐĂƚŝŽŶŝŶŝŶĚƵƐƚƌŝĂůƚĞůĞĐŽŵĂŶĚĐŽŶƐƵŵĞƌĂƉƉůŝĐĂƚŝŽŶƐ

• /ŶƌƵƐŚĐƵƌƌĞŶƚůŝŵŝƚŝŶŐĞŐŝŶƐǁŝƚĐŚͲŵŽĚĞƉŽǁĞƌƐƵƉƉůŝĞƐƐŽĨƚͲƐƚĂƌƚŵŽƚŽƌƐ



Summary of content (9 pages)

PAGE 1
Chip NTC Thermistor Features • ,ŝŐŚ ƚĞƐƚŝŶŐ ƉƌĞĐŝƐŝŽŶ • ^ƚĞĂĚǇ ŽƉĞƌĂƚŝŶŐ ĨŽƌ ůŽŶŐ ƚŝŵĞ • ZĞĨůŽǁ ƐŽůĚĞƌŝŶŐ ƉŽƐƐŝďůĞ • ^ŚŽƌƚ ƌĞƐƉŽŶƐĞ ƚŝŵĞ Applications • dĞŵƉĞƌĂƚƵƌĞ ŵĞĂƐƵƌĞŵĞŶƚ • ĂƚƚĞƌǇ ĐŚĂƌŐĞƌƐ • dĞŵƉĞƌĂƚƵƌĞ ƐĞŶƐŝŶŐ͕ ƉƌŽƚĞĐƚŝŽŶ ĂŶĚ ĐŽŵƉĞŶƐĂƚŝŽŶ ŝŶ ŝŶĚƵƐƚƌŝĂů͕ ƚĞůĞĐŽŵ ĂŶĚ ĐŽŶƐƵŵĞƌ ĂƉƉůŝĐĂƚŝŽŶƐ • /ŶƌƵƐŚ ĐƵƌƌĞŶƚ ůŝŵŝƚŝŶŐ͕ Ğ͘Ő͘ ŝŶ ƐǁŝƚĐŚͲŵŽĚĞ ƉŽǁĞƌ ƐƵƉƉůŝĞƐ͕ ƐŽĨƚͲƐƚĂƌƚ ŵŽƚŽƌƐ PART NUMBER Example: RND 155QN0402X103F3450FB RND 155QN0402 Type X 103 F 3450 F Delimeter Nominal Resistance Tolerance B Co
PAGE 2
Chip NTC Thermistor Test and Measurement Procedures Unless otherwise specified, the standard atmospheric conditions for measurement/test as • Ambient Temperature: 20±15℃ • Relative Humidity: 65±20% • Air Pressure: 86 kPa to 106 kPa If any doubt on the results, measurements/tests should be made within the following limits • Ambient Temperature: 20±2℃ • Relative Humidity: 65±5% • Air Pressure: 86 kPa to 106 kPa Inspection Equipment • Visual Examination: 20x magnifier • Resistance value test: Thermistor resist
PAGE 3
Chip NTC Thermistor Reliability Test Item Terminal Strength Standard IEC 60068-2-21 Solder the chip to the testing jig (glass epoxy board shown in the right) using eutectic solder. Then apply a force in the direction of the arrow. Size F Duration 0402, 0603 5N 10N 10 ± 1 s 0805 Resistance to Flexure IEC 60068-2-21 Requirements Test Methods and Remarks Solder the chip to the test jig (glass epoxy board shown in the right) using a eutectic solder.
PAGE 4
Chip NTC Thermistor Item Standard Solderability IEC 60068-2-58 Resistance to Soldering Heat Temperature Cycling IEC 60068-2-58 IEC 60068-2-14 Test Methods and Remarks • Solder temperature: 245 ± 5℃ • Duration: 10 ± 1s • Solder: Sn/3.0Ag/0.5Cu • Flux: 25% resin and 75% ethanol in weight 1. No visible damage • Solder temperature: 245 ± 5℃ • Duration: 10±1s • Solder: Sn/3.0Ag/0.
PAGE 5
Chip NTC Thermistor Notes & Warnings The RND 155QN series thermistors shall not be operated and stored under the following environmental conditions: • Corrosive or deoxidized atmospheres (such as chlorine, sulfurated hydrogen, ammonia, sulfuric acid, nitric oxide and so on) • Volatile or inflammable atmospheres • Dusty condition • Excessively high or low pressure condition • Humid site • Places with brine, oil, chemical liquid or organic solvent • Intense vibration • Places with analogously deleterious cond
PAGE 6
Chip NTC Thermistor R-T table Temp. (℃) R_Min (Kohm) R_Cent (Kohm) R_Max (Kohm) Res TOL. Temp. TOL.(℃) -40 195.784 203.814 212.153 4.09% 0.69 -39 185.358 192.854 200.633 4.03% 0.69 -38 175.541 182.539 189.798 3.98% 0.68 -37 166.293 172.828 179.603 3.92% 0.68 -36 157.580 163.684 170.007 3.86% 0.67 -35 149.368 155.070 160.973 3.81% 0.67 -34 141.626 146.953 152.466 3.75% 0.66 -33 134.325 139.303 144.452 3.70% 0.66 -32 127.439 132.091 136.900 3.64% 0.
PAGE 7
Chip NTC Thermistor Temp. (℃) R_Min (Kohm) R_Cent (Kohm) R_Max (Kohm) Res TOL. Temp. TOL.(℃) 2 25.157 25.651 26.153 1.96% 0.44 3 24.095 24.558 25.027 1.91% 0.43 4 23.084 23.517 23.956 1.87% 0.43 5 22.120 22.526 22.937 1.82% 0.42 6 21.202 21.582 21.966 1.78% 0.41 7 20.327 20.682 21.041 1.74% 0.40 8 19.493 19.825 20.161 1.69% 0.40 9 18.697 19.008 19.322 1.65% 0.39 10 17.938 18.229 18.522 1.61% 0.38 11 17.214 17.485 17.759 1.57% 0.37 12 16.
PAGE 8
Chip NTC Thermistor Temp. (℃) R_Min (Kohm) R_Cent (Kohm) R_Max (Kohm) Res TOL. Temp. TOL.(℃) 47 4.435 4.515 4.597 1.81% 0.54 48 4.285 4.365 4.445 1.84% 0.55 49 4.142 4.220 4.299 1.88% 0.56 50 4.004 4.081 4.159 1.91% 0.58 51 3.871 3.947 4.023 1.94% 0.59 52 3.743 3.818 3.893 1.98% 0.60 53 3.621 3.694 3.768 2.01% 0.62 54 3.502 3.574 3.647 2.04% 0.63 55 3.389 3.459 3.531 2.08% 0.65 56 3.279 3.349 3.419 2.11% 0.66 57 3.174 3.242 3.312 2.
PAGE 9
Chip NTC Thermistor Temp. (℃) R_Min (Kohm) R_Cent (Kohm) R_Max (Kohm) Res TOL. Temp. TOL.(℃) 92 1.119 1.155 1.192 3.20% 1.22 93 1.089 1.124 1.160 3.23% 1.23 94 1.060 1.094 1.130 3.26% 1.25 95 1.032 1.066 1.101 3.29% 1.27 96 1.004 1.038 1.072 3.31% 1.29 97 0.978 1.011 1.045 3.34% 1.30 98 0.952 0.985 1.018 3.37% 1.32 99 0.928 0.959 0.992 3.40% 1.34 100 0.904 0.935 0.967 3.42% 1.36 101 0.880 0.911 0.942 3.45% 1.37 102 0.858 0.888 0.918 3.