Datasheet

ManualsBrandsRND Components ManualsHeat Conducting Films/FoilsThermal Gap Pad, Square, 550mW/°C, 100x100x2mm

RND is a trademark of Distrelec

Features

• Super soft, high-pressure shrank, high deformation

• Fiberglass reinforced for puncture, shear and tear resistance

• Easy release construction

• Electrically isolating

Fiberglass Thermal Pad

Super soft single side silicon tape enhanced thermal conductive pad. The product has excellent mechanical properties and insulation

performance; ultra-low hardness, good resilience and high compression ratio, is applicable to large institutional design of tolerance.

Because of its low hardness, it has smaller thermal resistance in the case of low pressure, eliminate the air between the components

and circuit boards, and full fill all kinds of rough surface at the same time. By special ultra-thin glass fiber cloth double-layer structure,

increase the operability and durability, it will not be broken and deformation when stamping, punching or deformity design

Specification

Colour

Dark Red

550 mW/°C

ΩCM

1.2 W/mk

15 KV/mm

5.5

2 g/cm

UL94-V0

-50 ... 200 ℃

Single side self-seal

20-25 Shore 00

ASTM D5470

ASTM D257

ASTM D5470

ASTM D149

ASTM D150

ASTM D792

UL94

ASTM D2240

Thermal Impedance @1mm/20Psi

Volume Resistivity

Thermal Conductivity

Withstand Voltage

Dielectric Constant @1MHz

Specific Gravity

Flammability Class

Working Temperature

Self-Adhesive

Hardness

Test Method

0.2

0.4

0.6

0.8

1.2

5 10 25 60 80 100

Thermal resistance（°C*in²/W）

Pressure（psi）

The relation curve between

pressure and thermal resistance

Summary of content (2 pages)

PAGE 1
Fiberglass Thermal Pad Super soft single side silicon tape enhanced thermal conductive pad. The product has excellent mechanical properties and insulation performance; ultra-low hardness, good resilience and high compression ratio, is applicable to large institutional design of tolerance. Because of its low hardness, it has smaller thermal resistance in the case of low pressure, eliminate the air between the components and circuit boards, and full fill all kinds of rough surface at the same time.
PAGE 2
Fiberglass Thermal Pad Compression ration ratio（%） Pressure vs. compression ratio curve 18% 16% 14% 12% 10% 8% 6% 4% 2% 0% 5 10 25 50 60 80 Pressure（psi) Art Nr. Dimensions RND 460-00123 RND 460-00124 RND 460-00130 RND 460-00136 RND 460-00140 100 x 100 x 1 mm 100 x 100 x 2 mm 100 x 100 x 0.5 mm 100 x 100 x 3.2 mm 100 x 100 x 5.