Datasheet

ESD Shipping Box
Description
Chip boxes manufactured from Corstat conductive corrugated
fibreboard, these chip boxes provide an ESD safe and cost effective
method of shipping chips and small electronic devices.
Features
• They can be provided with soft antistatic foam or high density
pin stick grade conductive foam to suit your specific requirement
• Available from stock for next day delivery
• If you have a requirement not catered for within the stock size range,
please contact us as specials orders can be made to any size
ELECTRICAL
Surface Resistivity
(per ASTMD257-78)
Buried Shielding Layer: <10 ohms/sq
Exterior Layer: <10 ohms/sq
Electrostatic Decay Rate:
(per Mil B 81705B, Test Method 4046 Federal TMS 101B)
Less than 2.0 seconds to theoretical
zero
ESD Shielding: 99.9% Attenuation
(Capacitive Probe Test)
Triboelectric Charge
Generation:
Approximately 0.1 C/inch std.
condition
CHEMICAL
Surface Resistivity:
Reducible Sulphur: 00035%
(.0008% non-tarnishing to silver,
solder and copper per TAPPI T-406)
Amines: None
Galvanic Reaction: None
RND is a trademark of Distrelec