User's Manual
Reference
Manual
00809-0100-4045,
Rev
01
Hardware
Installation
December
2015
Hardware Installation
7
device
environment.
Install
the
device
to
minimize
vi
bra
t
i
o
n,
shock, and
t
e
mpe
r
a
t
ur
e
fl
uc
tu
a
t
io
n.
2.3.3 Mechanical
Location
When choosing an
installation location
and
position,
t
a
k
e
into
acc
o
un
t
the
di
rec
t
i
o
n
of
th
e
device
for
f
u
t
u
r
e
access
to
t
h
e
COMM
co
nn
ec
t
i
o
n
s
and
r
e
a
d
a
b
ili
t
y
of
t
h
e
analog
display.
Electronics
cover
The electronics cover is
tightened
so
that
polymer
c
o
n
t
a
c
t
s
polymer.
When
removing
t
h
e
electronics cover, ensure
that
there
is
no
damage done
to
the o-ring. If
damaged
replace
before
reattaching
cover, ensuring
polymer
c
o
n
t
a
c
ts
polymer
(i.e.
no
O-ring
visible).
2.3.4
E
lec
t
r
i
cal
Battery
The
R
o
se
mou
n
t
Wireless Pressure Gauge is
self-powered. The
battery
c
o
nt
a
i
n
s
appro
x
ima
t
e
l
y
5
grams
of
li
t
h
i
u
m
-
t
h
ion
y
l
chloride. Under
normal
c
o
n
d
i
t
io
ns,
the b
a
tt
e
r
y
m
a
t
e
ra
il
s
are
se
l
f
-
c
o
n
t
a
in
ed
and are
not
reactive
as
t
h
e
as
t
h
e
battery
is
m
a
in
t
a
in
ed
inside
the
enclosure
of the
device. Care should be
t
a
k
e
n
to
p
r
e
v
en
t
t
h
e
r
m
a
l
,
el
ec
t
r
i
c
a
l
,
o
r
mechanical damage. Contacts should
be pro
t
ec
t
e
d
to
pre
v
e
n
t
pre
m
a
t
ure
discharge.
Use
caution
when handling
the
ba
tt
e
r
y
,
it
may
be
damaged
if dropped.
The
battery
should be
stored in
a clean
dry
area, For
maximum battery life, storage
te
mpe
r
a
t
ur
e
should
not
exceed
86
°F
(30
°C
).
2.3.5
E
nv
i
r
o
n
m
e
nt
a
l
Verify
the operating
a
t
mo
s
p
h
e
re
of the
device is c
o
n
s
ist
e
n
t
with
t
h
e
a
ppropr
i
a
t
e
h
aza
r
dou
s
lo
ca
t
i
on
s
ce
r
t
ific
a
t
io
n
s
.
Temperature
effec
t
s
The device
will
operate
within
s
p
ecifica
t
io
ns
for
a
m
bie
n
t
te
mpe
r
a
t
u
r
es
as
outlined on page
34 in
t
h
e
s
p
ec
ific
a
t
io
n
s
sec
t
io
n.
H
e
a
t
from
t
h
e
process is transferred
to
the
device
hou
s
ing.
If the
process
t
e
m
p
e
r
a
t
ure
is
high, the
ambie
n
t
t
e
mpe
r
ature
will
need
to
be
lower
t
o
a
cc
o
un
t
for
he
a
t
transferred
to
t
h
e
device housing.
See
Temperature
limits for process
temperature d
e
rat
i
n
g
.