Datasheet

- EPOXY fibre glass FR4 1.5 mm double-sided 35 µm CU (pth)
- solder and component side with chem. NI/AU surface and solder stop mask
- hole dia 1.00 mm
- adapter for 7 different SSOP
- pitch 0.65 mm / 0.635 mm
- pre-scratched rated break points for the separation of individual modules
from the board
- size 61.40 x 81.70 mm
Modul-No Pitch mil Pin/Quantity Size (mm)
RE931-01 0.65 22.5 14 5.3 (208 mil)
RE931-02 0.65 22.5 16 5.3 (208 mil)
RE931-03 0.65 22.5 20 5.3 (208 mil)
RE931-04 0.65 22.5 24 5.3 (208 mil)
RE931-05 0.65 22.5 28 5.3 (208 mil)
RE931-06 0.635 25.7 48 7.5 (300 mil)
RE931-07 0.635 25.7 56 7.5 (300 mil)
SSOP-SMD Multiadapter (shrink small outline package)
RE931

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