Datasheet
- FR4 EPOXY fibre-glass 1.50 mm double-sided 35 µm CU (pth)
- Solder and component side with chem. NI/AU surface and solder stop mask
- hole dia 1.00 mm
- adapter for 10 differents TSSOP
- pitch 0.65 mm / 0.50 mm
- pre-scratched rated break point for the separation of individual modules from the board
- size 58.90 x 120.10 mm
Modul-No Pitch mil Pin/Quantity Size (mm)
RE933-01 0.65 22.5 8 4.4 (173 mil)
RE933-02 0.65 22.5 14 4.4 (173 mil)
RE933-03 0.65 22.5 16 4.4 (173 mil)
RE933-04 0.65 22.5 20 4.4 (173 mil)
RE933-05 0.65 22.5 24 4.4 (173 mil)
RE933-06 0.65 22.5 28 4.4 (173 mil)
RE933-07 0.65 22.5 32 6.1 (240 mil)
RE933-08 0.50 19.6 38 4.4 (173 mil)
RE933-09 0.50 19.6 48 6.1 (240 mil)
RE933-10 0.50 19.6 56 6.1 (240 mil)
TSSOP-SMD Multiadapter (thin shrink small outline package)
RE933