Datasheet

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7. Performance specification :
Dielectric No evidence of flashover 4.7 Clamped in the trough of a 90͠ metallic v-block
withstanding mechanical damage, arcing or and shall be tested at ac potential respectively specified
voltage insulation break down in the type for 60-70 seconds
4.8 Natural resistance change per temp.
degree centigrade.
R2-R1
Temperature 1~10 ± 200PPM/͠
x 10
6
(PPM/͠)
Coefficient 11~10M ± 100PPM/͠ R1(t2-t1)
R1: Resistance value at room temperature (T1)
R2: Resistance value at room temp. plus 100 ͠(T2)
Test pattern: room temp. (T1), room temp. +100͠(T2)
Resistance change rate is 4.13 Permanent resistance change after the
Short time
± 5% (2.0% + 0.1Ө) Max.
application of a potential of 2.5 times RCWV
overload
± 1% (1.0% + 0.1Ө) Max.
for 5 seconds
Wave Solder:
Test temperature of solder:
245°C ±3°C dipping time in solder : 2-3 seconds.
Refolw:
Solderability 95 % coverage Min.
4.18 Dip the resistor into a solder bath having
Soldering heat Resistance change rate is: a temperature of 260°C±3°C and hold it for 10±1
± (1.0%+0.05) Max. seconds.
4.19 Resistance change after continuous
5 cycles for duty cycle specified below :
Step Temperature Time
Temperature Resistance change rate is 1
-55к ± 3к
30 mins
cycling
± 5% (1.0% + 0.05Ө) Max.
2 Room temp.
10Д15 mins
± 1% (0.5% + 0.05Ө) Max.
3
+155к ± 2к
30 mins
4 Room temp.
10Д15 mins
High Power Thick Film Chip Resistors
Characteristics Limits
Test Methods
( JIS C 5201-1 )
Page 6.
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