Instruction manual

A heat treating furnace is required to harden the mold at a high
temperature (1000 F) for 30 minutes, then the mold is cooled down with a
programmable ramp (20 F / minute) toward a lower set point (200 F). Use
the dual set point / PID and ramp / dwell functions for this application.
A heat treating furnace is required to harden the mold at a high
temperature (1000 F) for 30 minutes, then the mold is cooled down with a
programmable ramp (20 F / minute) toward a lower set point (200 F). Use
the dual set point / PID and ramp / dwell functions for this application.
Example 2: Dual Set Point / PIDExample 2: Dual Set Point / PID
( 1 ) Set the following parameters in the Setup menu:( 1 ) Set the following parameters in the Setup menu:
FUNC= FULL
A1FN= TIMR
EIFN= SP.P2
PVMD= PV1
SPMD= MINR
FUNC= FULL
A1FN=
TIMR
EIFN=
SP.P2
PVMD=
PV1
SPMD=
MINR
( 2 ) Adjust the following parameters in the User menu:( 2 ) Adjust the following parameters in the User menu:
TIME= 30.0 ( Minutes )
RAMP= 20.0 ( F/Minute )
SP1= 1000 F
SP2= 200 F
PL1= 100(%)
TIME= 30.0 ( Minutes )
RAMP=
20.0 ( F/Minute )
SP1=
1000 F
SP2=
200 F
PL1=
100 ( % )
( 3 ) Set the proper values for PB1, TI1, TD1,PB2, TI2 and TD2 directly according
to the previous records. For a new system tune first PID set at SP1=800 F
and tune second PID set at SP2=400 F.
( 3 ) Set the proper values for PB1, TI1, TD1,PB2, TI2 and TD2 directly according
to
the previous records. For a new system tune first PID set at SP1=800 F
and
tune second PID set at SP2=400 F.
The circuit diagram is same as shown in Figure 5.14. The temperature profile
is shown as below:
The circuit diagram is same as shown in Figure 5.14. The temperature profile
is
shown as below:
Figure 5.16Figure 5.16
Dual Set Point /PID ProfileDual Set Point /PID Profile
30
minutes
30
minutes
40
minutes
40
minutes
1000
200
Use SP1,PID1
Use SP1,PID1 Use SP2,PID2Use SP2,PID2
F
Time ( Minutes )Time ( Minutes )