Specifications

深圳市芯中芯科技有限公司
SHENZHENSHI XINZHONGXIN TECHNOLOGY CO., LTD.
F-6988 V3.1
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地址：深圳市宝安区沙井东环工业区 A3 栋
ADDRESS:Block 3, Dong Huan Industrial Park, Sha Jing Town, Bao’an District, Shenzhen City, Guangdong, Province, China
公司网/WEB：WWW.C-CHIP.COM.CN
电话/TEL：[phone]/82
传真/FAX: [phone]
目录(Content)
一、产品概述 Product overview： ............................................................................................................................... 4
二、应用领域 Application area： .................................................................................................................................. 4
三、基本特性 Features： .............................................................................................................................................. 5
四、性能参数 performance parameter： ...................................................................................................................... 5
五、方框图 Module block diagram ............................................................................................................................... 6
六、模块尺寸图 The size of the module graph： ......................................................................................................... 7
七、模块的封装物料高度尺寸 Module packaging material height dimensions： ...................................................... 8
八、引脚功能说明 Pin definition： .............................................................................................................................. 9
九、电路连接注意 Design notes： ..............................................................................................................................11
十、注意事项 Note： ......................................................................................................... 11
十一、推荐回流温度 Recommended reflow temperature： ...................................................................................... 12