page 1/46 Direction des Recherches et des Développements Etablissement de VELIZY VELIZY R&D Center NOTE D'ETUDE / TECHNICAL DOCUMENT TITRE / TITLE : MO300 series module Application Note RESUME / SUMMARY This document is the application note for the MO300 series modules. Note d’étude / Technical document : URD1 – 5625.1 – 006 / 69796 Edition 03 Document Sagem Communication Reproduction et divulgation interdites Sagem Communication document.
page 2/46 Direction des Recherches et des Développements Etablissement de VELIZY VELIZY R&D Center NOTE D'ETUDE / TECHNICAL DOCUMENT FICHE RECAPITULATIVE / SUMMARY SHEET Ed Date 1 Date 24/08/2007 2 24/10/2007 3 4 5 6 13/10/2008 Observations Comments Création du document / Document creation Mise à jour / Major update FCC Updates Note d’étude / Technical document : URD1 – 5625.1 – 006 / 69796 Edition 03 Document Sagem Communication Reproduction et divulgation interdites Sagem Communication document.
page 3/46 Direction des Recherches et des Développements Etablissement de VELIZY VELIZY R&D Center MO300 M2M MODULE APPLICATION NOTE Note d’étude / Technical document : URD1 – 5625.1 – 006 / 69796 Edition 03 Document Sagem Communication Reproduction et divulgation interdites Sagem Communication document.
page 4/46 Direction des Recherches et des Développements Etablissement de VELIZY VELIZY R&D Center SOMMAIRE / CONTENTS 1 OVERVIEW ...................................................................................................................................................................6 1.1 1.2 1.3 1.4 OBJECT OF THE DOCUMENT .......................................................................................................................................6 REFERENCE DOCUMENTS ..................
page 5/46 3.17 STOPPING THE MODULE ...........................................................................................................................................28 3.17.1 Case of UART Interface..................................................................................................................................28 3.17.2 Case of USB Interface ....................................................................................................................................29 3.
page 6/46 1 Overview 1.1 Object of the document The aim of this document is to describe some examples of hardware solutions for developing some products around the SAGEM MO300 M2M Module. Most part of these solutions are not mandatory. Use them as suggestions of what should be done to have a working product and what should be avoided thanks to our experiences.
page 7/46 2 Block diagram MO300 EDGE QUAD-BANDS GSM850 / GSM900 / DCS1800 / PCS1900 6 VBAT_CNT 1 PWON* signal PWON* Power ON & Reset 1 Hardware Power Management Mod_on_state Mod_uart_state Mod_flow_state Mod_reset_state Dte_uart_state* H.P.M. 1 1 1 1 HOST U.S.B. 2.0 O.T.G. USB_ID USB_DM USB_DP VBUS Full U.S.B. 2.0 O.T.G. BUS 4 DEVICE 1 External Analog Input ADC 1 1.8/2.8V Power Supply RXD2* TXD2 * VBAT 1 2 U.A.R.T.2 TXD*, RXD*, CTS*, RTS*, DCD*, DSR*, DTR*, RI* U.A.R.
page 8/46 3 Functional integration The MO300 series modules target the M2M applications market. Following the improvement of Silicon technologies includes functionality improvement, less power consumption, low voltage and higher working frequencies clock, the MO300 module meets all these requirement and uses last high end technology. All digital I/Os at the 80 pins connector are on 1.8V domain and 1.4 V for its core. Except VREXTH (1.8V or 2.8V) and VCCSIM (and the SIM I/Os at 1.8V or 2.
page 9/46 3.1.1 SIM on the Board to Board Connector. The SIM card connection could be done in two ways: • Connector with 6 pins without SIM card detection. • Connector with 8 pins with SIM card detection. In both cases, decoupling capacitors of 10pF have to be added on SIMCLK, SIMRST, SIMVCC and SIMIO signals as close as possible to the SIM card connector to avoid EMC issues. Moreover, use ESD protection components to protect Sim card and module I/Os against Electro Static Discharges.
page 10/46 3.1.1.1 Without SIM card detection Normal SIM card case: 6 pins are used. GND MO300 SIM connector SIMVCC SIMRST VCC GND RST VPP CLK I/O SIMCLK SIMIO SIMCD* Figure 5 6 pins SIM card connection without presence detection SIM Plus card case: 8 pins are used.
page 11/46 3.1.1.2 With SIM card detection Normal SIM card case: 6 pins are used. GND SIM connector MO300 SIMVCC SIMRST SIMCLK VCC GND RST VPP CLK I/O CNT1 CNT2 SIMIO SIMCD* Figure 7 SIM card connection with presence detection SIM Plus card case: 8 pins are used.
page 12/46 3.1.2 SIM holder soldered on the back of the MO300. The MO300 module feature a soldering area on its back to mount a Sim card holder with all necessary components to protect it from EMC and ESD. For your design, if the Sim connection through the BtB connector is not required, use the following recommended schematic. As already warned: Never use both SIM card connection solutions at the same time. This is mandatory. Figure 9 SIM holder The behaviour is as described in the previous chapter. 3.
page 13/46 3.1.2.2 Placing All these components should be soldered at the following positions. Figure 11 Components for backside SIM holder Close view of the components area: Figure 12 Zoom on components area SAGEM can provide a suppliers component codes list on request Note d’étude / Technical document : URD1 – 5625.1 – 006 / 69796 Edition 03 Document Sagem Communication Reproduction et divulgation interdites Sagem Communication document.
page 14/46 3.2 HOW to connect the AUDIOS? The MO300 module feature 2 differential audio paths. A main audio path to connect a microphone and a speaker, and a second one to connect an auxiliary audio through a Jack (for example). In this following chapter examples of design will be given including protections against EMC and ESD and some notes about the routing rules to follow to avoid the TDMA noise usually present in this sensitive area of design.
page 15/46 3.2.1.1 • • • • • Notes for microphone Pay attention to the microphone device, It must not be sensitive to RF disturbances. Some microphone includes two spatial microphones inside the same shell and allow to make an electrical difference between the environment noise (received by one of the two mic.) and the active signal (received by the other mic. + noise) resulting in a very high SNR. Some resistors and capacitors should be connected as near as possible to the module as shown in the figure.
page 16/46 3.2.2 Non differential audio handset For a better rejection of the common mode it is recommend to use differential audio lines. In case, customer wants to implement a non differential solution, the figure below shows an example. The microphone can be supplied using the internal MO300 bias supply (recommended but not mandatory) or any other external bias system compliant with selected microphone within the MO300 inputs limits.
page 17/46 3.2.3 Using a mono Headset mode on the secondary audio path MO300 features a secondary audio path dedicated to be used with a Hands free kit accessory. This audio path can also be used instead of the main depending on the required audio power. An external microphone and earphone (32 ohms) can be connected to the MO300 Since the input unlink path is differential only mono headsets are supported, the speaker is connected between HSOR and HSOL.
page 18/46 3.2.6 Characteristics of the microphone and speaker recommended by SAGEM 3.2.6.1 Characteristics of the microphone recommended by SAGEM Item to be inspected Acceptance criterion Sensitivity -32 dB SPL +/- 3 dB (0 dB = 1 V/Pa @ 1kHz) or -40 dB SPL +/- 3 dB (0 dB = 1 V/Pa @ 1kHz) Frequency response Limits (relatives values) Current consumption Operating voltage S / N ratio Directivity Maximum input sound pressure level Radio frequency protection Freq.
page 19/46 If more than two LED are required, any GPIO can be used to drive a LED. A maximum of 10 GPIO are available on the MO300 Module. 3.3.1 Network LEDs connection. Green LED shall be connected to LED1, Red LED shall be connected to LED2, serial resistor shall be connected to each LED. These transistors can be found a in a single package referenced as UMDXX or PUMDXX Family.
page 20/46 3.4 Power supply The MO300 module can be supplied by battery or any DC/DC converter compliant with the module supply range 3.3Vmin and up to 5.5Vmax 2A. The PCB tracks must be well dimensioned to support 2A maximum current. Maximum serial resistance on VBAT = 170mΩ internal resistance of the battery plus tracks and contact resistance of the connectors for a new battery, or tracks & contact resistance of the connectors for a DC/DC converter.
page 21/46 An example of connection between MO300 and a PC is given below. Figure 21 Signal adaptation using Level Shifters and RS232 Transceiver. 3.5.3 Partial V24 ( RX-TX-RTS-CTS) – connection MO300 - host When using only RX/TX/RTS/CTS instead of the complete V24 link, we recommend following schematic: As we need DTR active (low electrical level), a loop DSR on DTR is sufficient because DSR is active (low electrical level) once the XS200 is switched on. DCD and RI can stay not connected and floating.
page 22/46 3.5.4 Partial V24 ( RX-TX) – connection MO300 - host When using only RX/TX instead of the complete V24 link, we recommend following schematic : We need DTR active (low electrical level), a loop DSR on DTR is sufficient because DSR is active (low electrical level) once the MO300 is switched on. We also need RTS active (low electrical level), a loop RTS on CTS is sufficient because CTS is active (low electrical level) once the MO300 is switched on. DCD and RI can stay not connected and floating.
page 23/46 USB ID USB ID VBUS VBUS CMD MO300 (device) Host D+ D+ D- DFigure 24 USB Connection between MO300 and host To use USB link between Host and MO300, specific SAGEM USB drivers are needed and available on SAGEM www site and on request. As soon as USB link is detected by the MO300 module, the AT command responses are sent on USB link and RS232 - UART1 interface is de-activated. RS232 - UART2 interface for traces is still operational.
page 24/46 3.8.2 Current consumption on the backup battery When the Main battery is removed, the current consumption which is supplied by the backup battery changes, depending on its voltage level. The following table sum up the three different states: VBACKUP (V) 2.4 < VBACKUP 2.15 < VBACKUP < 2.4 Typical value of current Consumption (µA) 50 Linear decrease from 250 (at 2.15V) to 50 (at 2.4V) Linear growth from 50 (at 1 V ) to 250 (at 2.15V) 1
page 25/46 3.8.3 Backup Battery technology recommended 3.8.3.1 Manganese Silicon Lithium-Ion rechargeable Battery Sagem does not recommend to use this kind of technology because of the following drawbacks: • the maximum discharge current is limited (Shall be compliant with the module characteristics) • the over-discharge problem: most of the Lithium Ion rechargeable batteries are not able to recover their charge when their voltage reaches a low-level voltage.
page 26/46 3.11 ADC The ADC value can be read by the specific AT command as defined in the document referenced [2]. The input limits are the following: from 0V up to 1750mV The returned value is on 10 bits converted to decimal. 3.12 Micro-wire Bus The microwire bus is available but the client has to ask SAGEM to develop the driver and the specific application related the connected device. 3.
page 27/46 3.14 Hardware Power management and multiplexing interfaces In case hardware power management and multiplexing are used, it is necessary to isolate host and module MO300 in order to not generate current re-injection when MO300 is switched-off.
page 28/46 VBAT t PWON* 31.25ms MOD_ON_STATE Figure 27 Suggested starting sequence 3.16.2 Case of USB Plugged First power up VBAT, which must be in the range 3.3V – 4.5V, and able to provide at least 2A during the TX bursts (refer to the module specification for more details). To start the module, plug an USB data cable to the PC then plug it to the module. The module detects the VBUS signal and start automatically. MOD_ON_STATE can be used as feedback to know the module state. 3.
page 29/46 3.17.2 Case of USB Interface As the module can also start when an USB cable is plugged, the sequence to stop the module needs the USB interface to be OFF or VBUS disconnected just after the command is sent and acknowledged by the module.
page 30/46 4 Mandatory points for the final tests and tuning The design of the main board (which the module is connected to) must provide an access to following signals when the final product will be completely integrated. The module's firmware can be upgrade over serial or USB links.
page 31/46 5 ESD & EMC recommendations 5.1 Standard requirements for ESD Test levels : Contact discharge Air discharge Test voltage (kV) Level Test voltage (kV) Level 2 1 2 1 4 2 4 2 6 3 8 3 8 4 15 4 Special X 1) Special X 1) 1) “X” is a level which has to be determined. This level is specified in the particular specification of the device. If higher voltages as specified are needed, special testers have to be used.
page 32/46 5.2 ESD features Using human body model from JEDEC JESD 22-A114 standard, the MO300 can hold 2kV on all MO300 pins and contact areas such as antenna pads and connector. Except for the following pins where 1kV is supported • SIM RST • SIM CLK • SIM IO • SIMPLUS DATA • SIMPLUS CLK • SIMPLUS CMD External protection with ESD diode can be added to have a stronger ESD protection. 5.
page 33/46 6 Recommended components On request, SAGEM can provide the reference part numbers for the following recommended components: Component SAGEM part MIC1 Handset microphone Handset speaker Network Led SIM connector (with detection) SIM connector (without detection) HP1 LED1 SIM1 SIM2 Note d’étude / Technical document : URD1 – 5625.1 – 006 / 69796 Edition 03 Document Sagem Communication Reproduction et divulgation interdites Sagem Communication document.
page 34/46 7 Radio integration The module antenna connection has a characteristic impedance of 50 Ohms. In order to get the best sensitivity and output power, it is recommended to implement a matching circuit between the module and the antenna: In order to design the matching circuit : - test with direct connection in the first step - adjust inductors and capacitors in a second step if needed Antenna First step: 0 Ohm First step: N.C. 50 ohm Test point First step: N.C.
page 35/46 7.1 Antenna connection MO300 module feature two ways to connect it to the GSM antenna. 7.1.1 Mini Coaxial connector A mini-coaxial connector is provided on the MO300 : Hirose U.FL-R-SMT-1 (10) 7.1.
page 36/46 7.3 Layout Warning: Isolate RF line and antenna from others bus or signals (audio, powers, digital I/O or buses ...). No signals on 50 ohms area and if that is not possible, add ground shielding using different layers. Do not add any ground layer under the antenna contact area. Be careful on the position of the network LED (sometimes situated in front of the antenna pad ...) 7.4 • • • 7.
page 37/46 8 Audio integration Audio mandatory tests for FTA are in handset mode only so a particular care must be brought to the design of audio (mechanical integration, gasket, electronic) in this mode. The audio norms which describe the audio tests are 3GPP TS 26.131 & 3GPP TS 26.132. 8.1 Mechanical Integration and Acoustics Particular care to Handset Mode : FTA • • • • • • 8.2 Design of the microphone and speaker gasket.
page 38/46 9 Recommendations on Layout of the main board 9.1 General recommendations on layout There are many different types of signals in the module, that are disturbing each other. Particularly, Audio signals are very sensitive to external signals as VBAT.... Therefore it is very important to respect some rules to avoid disruptions or abnormal behaviour. Main rules: 9.1.
page 39/46 GND Layer n+1 HSMICP Layer n GND Layer n-1 Figure 32 Adjacent layers of audio differential signals *Warning: Magnetic field generated by VBAT tracks may disturb the speaker, causing audio burst noise. In this case, one shall modify routing of the VBAT tracks to reduce the phenomena. 9.2 Example of layout for main board The layout given hereafter is only for reference for a typical modem application, 6 layers are necessary.
page 40/46 10 Mechanical integration The different points in this part deal with the mechanical specifications to ensure a correct integration of the module MO300. The constraints are about the connections (characteristics and layouts) and assembly of the module inside any housing. 10.
page 41/46 Plug MO300 board Main board Receptacle Figure 36 Board to board connection To ensure a good soldering process for the receptacle on the main board, respect the layout specification following (dimension in mm). Figure 37 Recommended layout for board to board receptacle 10.2.
page 42/46 11 Summary of integration On the following pages, you will find a sum-up of the different connectors which are assembled in the module MO300. Their references are mentioned and their specifications are available at the end of this document. 11.1 Annexe: Molex Board to Board connector Dimensions and references: Pin Number References 80 MOLEX 54150-0878 Sagem reference : 189576119 Dimension mm A 23.9 B 19.5 C 20.5 Note d’étude / Technical document : URD1 – 5625.
page 43/46 Note d’étude / Technical document : URD1 – 5625.1 – 006 / 69796 Edition 03 Document Sagem Communication Reproduction et divulgation interdites Sagem Communication document.
page 44/46 11.2 Annexe: Hirose coaxial connector Reference HIROSE U.FL-R-SMT-1 (10) Sagem reference 189492503 Note d’étude / Technical document : URD1 – 5625.1 – 006 / 69796 Edition 03 Document Sagem Communication Reproduction et divulgation interdites Sagem Communication document.
page 45/46 11.3 Annexe: Spring contact for antenna Figure 38 layer allocation for a 6 layers circuit Note d’étude / Technical document : URD1 – 5625.1 – 006 / 69796 Edition 03 Document Sagem Communication Reproduction et divulgation interdites Sagem Communication document.
page 46/46 12 LABEL The MO300 module is labelled with its own FCC ID (VW3MO300QBM) on its bottom side. When the module is installed in customer’s product, the FCC ID label on the module will not be visible. To avoid this case, an exterior label must be stuck on the surface of customer’s product signally to indicate the FCC ID of the enclosed module. This label can use wording such as the following: “Contains Transmitter module FCC ID: VW3MO300QBM” or “Contains FCC ID: VW3MO300QBM”.
