Datasheet

General
● TEST BOARD AND SPECIFICATION
▶ Soldering (for lead free type)
▷ The resistor should be fixed on PCB(printed circuit board) for testing.
- Soldering specification : JIS C 5201-1 4.18
* Soldering method : Flow type (Dipping type)
* Solder : Sn -3.0 Ag -0.5 Cu
* FLUX : ROSIN 25WT% (JIS K 5902), IPA 75WT% (JIS K 5901)
- Flow soldering condition
* FLUX dipping time : 5∼10 sec
* Pre-treatment : None
* Soldering temp : 260℃±5℃
* Soldering time : 10±1 sec
item
Permissible deviation
Test method
Resistor Jumper
Low
temperature
exposure
1. No mechanical
damage
2.
Δ
R should be
within
±
(3%+0.1
Ω
)
50m
Ω
Maximum
묤
Standard : JIS C 5201-1 4.23
묤
Test temperature : -55
±
2
℃
묤
Test time : 1000
+4 8
hours (without load)
묤
Measure : after 1 hour
묤
Test board : <Fig 11>
High
temperature
exposure
1. No mechanical
damage
2.
Δ
R should be
within
±
(3%+0.1
Ω
)
50m
Ω
Maximum
묤
Standard : JIS C 5201-1 4.23
묤
Test temperature : 1608,2012,3216 155
±
2
℃
,
Others 125
±
2
℃
묤
Test time : 1000
+4 8
hours (without load)
묤
Measure : after 1 hour
묤
Test board : <Fig 11>
Load life
1. No mechanical
damage
2.
Δ
R should be
within
<Table 13>
50m
Ω
Maximum
묤
Standard : JIS C 5201-1 4.25
묤
Test temperature : 70
±
2
℃
묤
Test voltage : rated voltage
묤
Testtime:repeat90minON,30minOFF
during 1000
+4 8
hours
묤
Test board : <Fig 11>.
<Table 13>
Range(
Ω
)
Δ
RMAX
1≤R<10 ±
5%
10 ≤ R < 1M
±(3%+0.1Ω)
1M ≤ R < 10M ±
5%