User's Manual

ITM
Version 1.0
Samsung Electronics
page 1 of 8
User Manual
1. Product Description
The ITM is Bluetooth LE module with Telink TLSR8269F512, BLE wireless Soc solution. It provides the
feature and functions needed for 2.4GHz BLE standard on IOT devices, using for lighting application devices
mainly. The TLSR8269F512 chipset combines the radio frequency, digital processing, protocols stack
software and profiles for BLE standards into a single SoC.
The module supports standards and industrial alliance specifications including Bluetooth Smart(BLE4.0 and
4.2) and BLE mesh.
The module is made up of the following components:
 Telink SoC TLSR8269F512AT32 chipset
 Internal 512KB flash memory (IC embedded)
 IC embedded LDO
 12MHz Crystal
 PCB printed antenna for 2.4GHz ISM band
 10pins SMD type or 4pins header mold (optional)
 RF can-shield
Product Form Factor
 Module Size (mm): 9.5 (W) X 18.5 (L) X 2.4(H)
 PCB size (mm): 9.5 (W) X 18.5 (L) X 1.0 (H)
 Shield can (mm): 8.1 (W) X 11.5 (L) X 1.4 (H)
 Antenna Type : PCB Printed Antenna
 Weight : 0.67g
2. Key Feature
General Feature
 TLSR8269F512 Embedded 32-bit high performance MCU with clock up to 48Mhz
 Chipset embedded program memory : internal 512KB Flash
 Data memory : 32kB on-chip SRAM
 4 channels PWM
 UART with hardware flow control
 Debug interface: SWS
 TLSR8269F512 Embedded hardware AES