Rev: 009 ISSUE NO : Product Family Data Sheet LH351A - 3535 Ceramic LED ＠25℃ Introduction Features Package : Ceramic Substrate LED Package View Angle: 125 ˚ Precondition : JEDEC Level 2a Dimension : 3.5 x 3.5 x 1.
Contents 1. Luminous Flux Characteristics ----------------------- 3 2. Characteristics ----------------------- 6 3. Typical Characteristics Graph ----------------------- 7 4. Outline Drawing & Dimension ----------------------- 13 5. Reliability Test Items and Conditions ----------------------- 14 6. Solder Conditions ----------------------- 15 7. Tape & Reel ----------------------- 16 8. Label Structure ----------------------- 17 9. Packing Structure ----------------------- 18 10.
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2. Characteristics 1) Electro-optical Characteristics Item Unit Min Typ Max Forward voltage1) (@350 mA, Tj = 25℃) V 2.70 2.95 3.30 Forward voltage1) (@700 mA, Tj = 25℃) V 3.09 Forward voltage1) (@1000 mA, Tj = 25℃) V 3.19 Forward voltage1) (@1500 mA, Tj = 25℃) V 3.
3. Typical Characteristics Graph 1) Spectrum Distribution (Tj = 25℃) 2700K(CRI 80) & 3000K(CRI 80) 3500K(CRI 80) & 4000K(CRI 80) http://www.samsungled.
5000K(CRI 70) & 5700K(CRI 70) 6500K(CRI 70) & 7600K(CRI 68) http://www.samsungled.
2) Forward Current Characteristics (Tj = 25℃) Relative Flux vs. Forward Current Forward Current vs. Forward Voltage http://www.samsungled.
3) Temperature Characteristics Relative Flux vs. Ts(solder temp.) (IF = 350mA) Forward Voltage vs. Ts(solder temp.) (IF = 350mA) http://www.samsungled.
4) Color shift Characteristics Color x,y vs. Forward Current Color x,y vs. Substrate Temp. http://www.samsungled.
5) Derating Curve Rj-a = 25℃/W Rj-a = 20℃/W Rj-a = 15℃/W Rj-a = 10℃/W 6) Viewing angle Characteristics Viewing angle http://www.samsungled.
4. Outline Drawing & Dimension Anode Cathode Recommended Land Pattern unit : mm Tolerance : ± 0.13 * This LED has built-in ESD protection device(s) connected in parallel to LED Chip(s). * The thermal pad is electrically isolated from the anode and cathode contact pads. Ts Point & Measurement Method * Measure the nearest point to the thermal pad as shown below. If necessary, remove PSR of PCB to reach Ts point. * Thermal pad must be soldered to the PCB to dissipate heat properly.
5. Reliability Test Items and Conditions 1) Test Items and Results Test Items Test Conditions Test Hours/Cycles n Room Temperature Life Test 25℃, DC 1000 ㎃ 1000 Hr 22 High Temperature humidity Life Test 85℃, 85%, DC 1000 ㎃ 1000 Hr 22 High Temperature Life Test 85℃, DC 1000 ㎃ 1000 Hr 22 Low Temperature Life Test -40℃, DC 1000 ㎃ 1000 Hr 22 Temperature Humidity Cycle -10℃ ↔ 25℃ 95%RH ↔ 85℃ 95%RH 1000mA, 95%RH, 24hrs/1cycle 10 Cycles 11 Thermal Shock -45 ℃/15 min ↔ 125 ℃/ 15 min. Temp.
6. Solder Conditions 1) Reflow Conditions ( Pb Free ) Reflow Frequency : 2 times max. 2) For Manual Soldering Not more than 5 seconds @Max. 300℃, under soldering iron. http://www.samsungled.
7. Tape And Reel Ø15.4±1.0 Ø13±0.3 Ø180±0.3 2.0±0.2 Ø13±0.2 30° Ø60±0.1 Ø10 Ø22 Label (1) Quantity : The quantity/reel to be 1,000 pcs. (2) Cumulative Tolerance : Cumulative tolerance/10 pitches to be ±0.2 ㎜ (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at 10° angle to be the carrier tape. (4) Packaging : P/N, Manufacturing data code no. and quantity to be indicated on a damp proof package. http://www.samsungled.
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9. Packing Structure 1) Packing Process Reel E1Q1J1 SPHWHTL3D303E3QTJ4 E1Q1J1 XXXX IIIIIIIIIIIIIIIIIIIIIIIIIIII ●◎◇◆□■△△△ / I▲▲▲ / XXXXpcs IIIIIIIIIIIIIIIIIIIIIIIII Aluminum Vinyl Bag E1Q1J1 SPHWHTL3D303E3QTJ4 E1Q1J1 XXXX IIIIIIIIIIIIIIIIIIIIIIIIIIII ●◎◇◆□■△△△ / I▲▲▲ / XXXXpcs IIIIIIIIIIIIIIIIIIIIIIIII Out Box (Max.
2) Aluminum Packing Bag E1Q1J1 SPHWHTL3D303E3QTJ4 E1Q1J1 XXXX IIIIIIIIIIIIIIIIIIIIIIIIIIII ●◎◇◆□■△△△ / I▲▲▲ / XXXXpcs IIIIIIIIIIIIIIIIIIIIIIIII There are Silica Gel and Humidity Indicator Card in the Aluminum Bag http://www.samsungled.
10. Precaution for use 1) For over current-protection, customers are recommended to apply resistors connected in series with the LEDs to mitigate sudden change of the forward current caused by shift of the forward voltage. 2) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When cleaning is required, IPA is recommended as cleaning agent. Solvent-based cleaning agent such as Zestron(R) may damage the silicone resins used in the device.
11) Risk of Sulfurization (or Tarnishing) The LED from Samsung Electronics uses a silver-plated lead frame and its surface color may change to black(or dark colored) when it is exposed to sulfur (S), chlorine (Cl) or other halogen compound. Sulfurization of lead frame may cause intensity degradation, change of chromaticity coordinates and, in extreme cases, open circuit. It requires caution.
11. Hazard Substance Analysis http://www.samsungled.
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Revision History Date Revision History 2012.08.17 Writer Drawn Approved New version I.J.PYEON Y.T.KIM 2012.09.24 2nd version G.E.CHO Y.T.KIM 2012.10.26 3rd version I.J.PYEON Y.T.KIM 2013.02.22 4th version I.J.PYEON Y.T.KIM 2013.02.28 5th version I.J.PYEON Y.T.KIM 2013.04.19 6th version I.J.PYEON Y.T.KIM 2013.06.02 7th version I.J.PYEON Y.T.KIM 2013.06.27 8th version I.J.PYEON Y.T.KIM 2013.07.26 9th version I.J.PYEON Y.T.KIM http://www.samsungled.
