Rev: 001 Product Family Data Sheet LM561B - 5630 Middle Power LED for High CRI Introduction Features Beam Angle: 120˚ Precondition : JEDEC Level 2a Dimension : 5.6 x 3.0 x 0.8 mm ESD withstand Voltage : up to ± 5KV [HBM] Applications INDOOR LIGHTING : Ambient Light, LED tube, Down light, LED bulb and Ceiling Light SAMSUNG ELECTRONICS 95, Samsung2-Ro, Giheung-Gu, Yongin-City, Gyeonggi-Do 446-711, KOREA http://www.samsungled.
Contents 1. Product Code Information ----------------------- 3 2. Characteristics ----------------------- 8 3. Typical Characteristics Graph ----------------------- 9 4. Outline Drawing & Dimension ----------------------- 13 5. Reliability Test Items & Conditions ----------------------- 14 6. Solder Conditions ----------------------- 15 7. Tape & Reel ----------------------- 16 8. Label Structure ----------------------- 18 9. Packing Structure ----------------------- 19 10.
1. Product Code Information 1) Luminous Flux Bins (Ts = 25℃) Nominal CCT 2700K 3000K 3500K 4000K Product Code Flux Rank Sorting Condition lm @65mA Flux Range (Φv, lm) SPMWHT541MD7WAW☆S0 SPMWHT541MD7WAV☆S0 SPMWHT541MD7WAU☆S0 SPMWHT541MD7WAT☆S0 SY 20.0 ~ 22.0 SZ 22.0 ~ 24.0 S1 24.0 ~ 26.0 SY 20.5 ~ 22.5 SZ 22.5 ~ 24.5 S1 24.5 ~ 26.5 SY 22.0 ~ 24.0 SZ 24.0 ~ 26.0 S1 26.0 ~ 28.0 SY 23.0 ~ 25.0 SZ 25.0 ~ 27.0 S1 27.0 ~ 29.
2) Color Bins (Ts = 25℃) 2-1) Color Binning Nominal CCT 2700K 3000K 3500K 4000K Product Code Color Rank SPMWHT541MD7WAW0S0 W0(Whole bin) SPMWHT541MD7WAWHS0 WH(Half bin) SPMWHT541MD7WAWMS0 WM(Quarter bin) SPMWHT541MD7WAV0S0 V0(Whole bin) SPMWHT541MD7WAVHS0 VH(Half bin) SPMWHT541MD7WAVMS0 VM(Quarter bin) SPMWHT541MD7WAV0S0 U0(Whole bin) SPMWHT541MD7WAVHS0 UH(Half bin) SPMWHT541MD7WAVMS0 UM(Quarter bin) SPMWHT541MD7WAT0S0 T0(Whole bin) SPMWHT541MD7WATHS0 TH(Half bin) T5, T6, T7, T8
2-2) Chromaticity Region & Coordinates http://www.samsungled.
2-3) Chromaticity Region & Coordinates Region CIE X CIE Y Region CIE X CIE Y Region CIE X W rank (2700K) W1 W2 W3 W4 W5 W6 W7 W8 0.4373 0.3893 0.4418 0.3981 0.4475 CIE Y Region CIE X CIE Y V rank (3000K) 0.4465 0.4071 0.4513 0.4164 0.3994 0.4573 0.4178 0.4242 0.3919 0.4322 0.4096 0.4428 0.3906 0.4523 0.4085 0.4203 0.3833 0.4281 0.4006 0.4428 0.3906 0.4523 0.4085 0.4203 0.3833 0.4281 0.4006 0.4475 0.3994 0.4573 0.4178 0.4532 0.4008 0.4634 0.4193 0.4300 0.
2) Chromaticity Region & Coordinates (Continued) Region CIE X CIE Y Region CIE X CIE Y Region CIE X U rank (3500K) U1 U2 U3 U4 U5 U6 U7 U8 0.3889 0.3690 0.3915 0.3768 0.3981 CIE Y Region CIE X CIE Y T rank (4000K) 0.3941 0.3848 0.3968 0.3930 0.3800 0.4040 0.3966 0.3744 0.3685 0.3782 0.3837 0.3953 0.3720 0.4010 0.3882 0.3686 0.3649 0.3719 0.3797 0.3953 0.3720 0.4010 0.3882 0.3726 0.3612 0.3763 0.3760 0.3981 0.3800 0.4040 0.3966 0.4048 0.3832 0.4113 0.
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3. Typical Characteristics Graph (Ts = 25℃) 1) Spectrum Distribution [CCT : 2700K & 3000K] [CCT : 3500K & 4000K] http://www.samsungled.
2) Forward Current Characteristics [Relative Luminous Flux vs. Forward Current] [Forward Current vs. Forward Voltage] http://www.samsungled.
3) Temperature Characteristics [Relative Luminous Flux vs. Ts] (IF = 65mA) [Forward Voltage vs. Ts] (IF = 65mA) http://www.samsungled.
4) Color shift Characteristics [Color Δx, Δy vs. Forward Current] [Color Δx, Δy vs. Ts] http://www.samsungled.
5) Derating Curve 6) Beam Angle Characteristics http://www.samsungled.
4. Outline Drawing & Dimension 1. Tolerance is ±0.10 mm 2. The maximum compressing force is 15N on the body ⓐ 3. Do not place pressure on the encapsulation resin ⓑ Top View Left Side View Anode Mark ⓐ Bottom View ⓑ Cathode Anode Front View Recommended Land Pattern Notes: 1) This LED has built-in ESD protection device(s) connected in parallel to LED Chip(s). 2) Ts point & measurement method ① Measure the nearest point to the thermal pad. If necessary, remove PSR of PCB to reach Ts point.
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6. Solder Conditions 1) Reflow Conditions ( Pb Free ) Reflow Frequency : 2 times max. 2) For Manual Soldering Not more than 5 seconds @Max. 300℃, under soldering iron. http://www.samsungled.
7. Tape & Reel 1) Taping Dimension (unit : mm) Anode Mark (Cutting side) Tapping Diretion Start End More than 500㎜ Mounted with More than 100~200㎜ Leading part more than Unloaded tape LED package Unloaded tape 500㎜ http://www.samsungled.
2) Reel 1) Reel Dimension (max 2,500 pcs) (1) Quantity : The quantity/Reel to be 2,500 pcs. (2) Cumulative Tolerance : Cumulative tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at 10℃ angle to be the carrier tape. (4) Packaging : P/N, Manufacturing data code no. and quantity to be indicated on a damp proof Package. http://www.samsungled.
8. Label Structure 1) Label Structure ⓐⓑⓒⓓⓔⓕ A1★1SY SPMWHT541MD7WA★0S0 A1★1SY 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAW94001 / 1001 / 2,500 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Rank Code N.B) Denoted rank is the only example. '★' means All kind of Chromaticity Coordinate Rank. Rank Code ⓐⓑ : Forward Voltage(VF) Rank (refer to page. 7) ⓒⓓ : Chromaticity Coordinate Rank (refer to page. 5~6) : Luminous Flux(Φv, lm) Rank (refer to page.
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2) Aluminum Packing Bag A1★1SY SPMWHT541MD7WA★0S0 A1★1SY 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAW94001 / 1001 / 2,500 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Silica gel & Humidity Indicator Card in Aluminum Vinyl Bag http://www.samsungled.
10. Precaution for use 1) For over-current-proof function, customers are recommended to apply resistors to prevent sudden change of the current caused by slight shift of the voltage. 과전류 방지를 위해 전압의 미세한 이동에 의해 야기되는 전류의 순간 변화를 방지하기 위해 저항 등의 설치를 권장함. 2) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When washing is required, IPA is recommended to use. 제품은 물, 오일, 유기물과 같은 액체 타입에서의 사용은 제한되며, 세정이 필요할 시에는 IPA 사용을 권장함.
7) Devices require baking before mounting, if humidity card reading is >60% at 23±5℃. 만약 습도표시카드의 수치가 23±5℃에서 60% 이상이라면, 제품 실장 전 baking해야 함. 8) Devices must be baked for 1 hour at 60±5℃, if baking is required. 만약 baking이 필요하다면, 제품은 60±5℃에서 1시간 정도 baking 되어야 함. 9) The LEDs are sensitive to the static electricity and surge. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. LED는 정전기 및 서지에 민감한 제품이므로, LED 제품을 다룰 시에는 정전기 방지장갑이나 손목밴드를 사용하기를 권장함.
11) Risk of Sulfurization (or Tarnishing) The LED from Samsung Electronics uses a silver-plated lead frame and its surface color may change to black(or dark colored) when it is exposed to sulfur(S), chlorine (Cl) or other halogen compound. 삼성전자의 LED는 Ag(은)을 도금한 리드프레임을 사용함. 이 리드프레임의 표면이 황(S), 염소(Cl), 또는 다른 할로겐 화합물들에 노출시 Ag(은)은 검정(또는 어두운색)으로 바뀔 수 있음. Sulfurization of lead frame may cause intensity degradation, change of chromaticity coordinates and, in extreme cases, open circuit. It requires caution.
11. Hazard Substance Analysis 1) RoHS http://www.samsungled.
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2) REACH (SVHC) http://www.samsungled.
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Revision History Date No. Revision History 2013. 11. 07 01 New Version http://www.samsungled.com Writer Drawn Approved W.H Jung S.
