Product guide

ManualsBrandsSamsung Manualscomputer components1GB, DDR III SDRAM, 1066MHz, CL7

December 2008

General Information DDR3 SDRAM

DDR3 SDRAM Product Guide

December 2008

Memory Division

Summary of content (15 pages)

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General Information DDR3 SDRAM DDR3 SDRAM Product Guide December 2008 Memory Division December 2008
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General Information DDR3 SDRAM 1. DDR3 SDRAM Component Ordering Information 1 2 3 4 5 6 7 8 9 10 11 K 4 B X X X X X X X - X X X X Speed SAMSUNG Memory DRAM Temp & Power DRAM Type Package Type Density Revision Interface (VDD, VDDQ) Bit Organization # of Internal Banks 1. SAMSUNG Memory : K 7. Interface ( VDD, VDDQ) 6 : SSTL (1.5V, 1.5V) 2. DRAM : 4 8. Revision 3. DRAM Type B : DDR3 SDRAM 4. Density 51 : 512Mb 1G : 1Gb 2G : 2Gb 4G : 4Gb M A B C D E F G H : 1st Gen. : 2nd Gen.
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General Information DDR3 SDRAM 2. DDR3 SDRAM Component Product Guide Density 1Gb D-die Banks 8Banks Org. PKG K4B1G0446D Part Number HC(L)F7/F8/H9 256M x 4 K4B1G0846D HC(L)F7/F8/H9 128M x 8 78 + 4 ball FBGA K4B1G1646D 1Gb E-die 2Gb B-die DDP 2Gb D-die DDP 2Gb E-die DDP 4Gb B-die 8Banks 8Banks Package & Power, Temp.
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General Information DDR3 SDRAM 3. DDR3 SDRAM Module Ordering Information 1 2 3 4 5 6 7 8 9 10 11 12 M X X X B X X X X X X X - X X X Memory Module DIMM Type Data bits Speed DRAM Component Type Temp & Power Depth PCB Revision Package # of Banks in Comp. & Interface Component Revision Bit Organization 1. Memory Module : M 8. Component Revision M : 1st Gen. B : 3rd Gen. D : 5th Gen. F : 7th Gen. 2. DIMM Type 3 : DIMM 4 : SODIMM 3.
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General Information DDR3 SDRAM 4. DDR3 SDRAM Module Product Guide 240Pin DDR3 Unbuffered DIMM Org. 128Mx 64 Density Composition Comp. Version Internal Banks Part Number Speed Rank PKG Height Avail.
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General Information DDR3 SDRAM 240Pin DDR3 Registered DIMM Org. 128Mx 72 256Mx 72 512Mx 72 1Gx 72 2Gx 72 Density Composition Comp. Version Part Number Speed M393B2873DZ1 CF7/F8/H9 128M x 8 * 9 pcs 1Gb M393B2873EH1 CF7/F8/H9 128M x 8 * 9 pcs M393B5673DZ1 CF7/F8/H9 M393B5673EH1 Internal Banks Rank PKG Height Avail.
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General Information DDR3 SDRAM 5. RDIMM RCD Information 1. RCD Identification in JEDEC Description in Module Label 2. Label Example 4GB 2Rx4 PC3 - 10600R - 09 - 10 - E1 - P0 Made in Korea M393B5170EH1-CH9 0849 3.
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General Information DDR3 SDRAM 9.00 ± 0.10 0.10MAX 78 + 4Ball FBGA for 1Gb D-die (x4/x8) A 0.80 x 10 = 8.00 1.60 #A1 INDEX MARK 4.00 #A1 11.00 ± 0.10 0.80 x 12 = 9.60 4.80 0.80 0.80 (Datum B) A B C D E F G H J K L M N 9.00 ± 0.10 B 11 10 9 8 7 6 5 4 3 2 1 0.50 ± 0.05 0.80 11.00 ± 0.10 (Datum A) 0.35 ± 0.05 (0.95) 82 - ∅0.45 Solder ball (Post Reflow ∅0.05 ± 0.05) MOLDING AREA 1.10 ± 0.10 (1.90) 0.2 M A B Top Bottom : Support Ball 9.00 ± 0.10 0.
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General Information DDR3 SDRAM 7.50 ± 0.10 0.10MAX 78 Ball FBGA for 1Gb E-die (x4/x8) A 0.80 x 8 = 6.40 #A1 INDEX MARK 3.20 #A1 11.00 ± 0.10 0.80 x 12 = 9.60 0.80 4.80 A B C D E F G H J K L M N 0.80 (Datum B) 7.50 ± 0.10 B 9 8 7 6 5 4 3 2 1 0.50 ± 0.05 0.80 1.60 11.00 ± 0.10 (Datum A) 0.35 ± 0.05 (0.95) 78 - ∅0.45 Solder ball (Post Reflow ∅0.05 ± 0.05) MOLDING AREA 1.10 ± 0.10 (1.90) 0.2 M A B Top Bottom 7.50 ± 0.10 0.10MAX 96 Ball FBGA for 1Gb E-die (x16) A 0.80 x 8 = 6.
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General Information DDR3 SDRAM 9.00 ± 0.10 0.80 A #A1 INDEX MARK 3.60 1.60 #A1 11.50 ± 0.10 0.80 0.80 x 12 = 9.60 4.80 A B C D E F G H J K L M N 0.80 (Datum B) 9.00 ± 0.10 B 9 8 7 6 5 4 3 2 1 11.50 ± 0.10 (Datum A) 0.10MAX 78Ball FBGA for 2Gb B-die (x4/x8) 0.35 ± 0.05 (0.95) 78 - ∅0.45 Solder ball (Post Reflow ∅0.50 ± 0.05) MOLDING AREA 1.10 ± 0.10 (1.90) 0.2 M A B TOP VIEW BOTTOM VIEW 9.00 ± 0.10 0.10MAX 96Ball FBGA for 2Gb B-die (x16) A #A1 INDEX MARK 0.80 1.60 3.
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General Information DDR3 SDRAM x64/x72 240pin DDR3 SDRAM Unbuffered DIMM Units : Millimeters (4X)3.00 ± 0.1 133.35 30.00 ± 0.15 128.95 N/A 9.50 (for x64) SPD ECC (2) 2.50 A 17.30 2.50 +0.1/-0 (for x72) B 47.00 71.00 4.00 N/A (for x64) ECC (for x72) 1.270 ± 0.10 2x 2.10 ± 0.15 2.50 ± 0.20 5.00 0.80 ± 0.05 3.80 2.50 1.50±0.10 Detail A 0.2 ± 0.15 1.
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General Information DDR3 SDRAM x64 204pin DDR3 SDRAM Unbuffered SODIMM Units : Millimeters 67.60 20.00 mm 30.00 mm nom. SPD Max 3.8 1.00 ± 0.10 3.00 2X 1.80 0.10 M C A B (OPTIONAL HOLES) 2X 4.00 ± 0.10 0.10 M C A B 0.60 0.45 ± 0.03 4.00 ± 0.10 1.00 ± 0.10 Detail A 2.55 0.
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General Information DDR3 SDRAM x72 240pin DDR3 SDRAM Registered DIMM Units : Millimeters 133.35 10.9 128.95 32.40 18.92 18.93 9.74 4.00 max Register 10.00 9.76 (2X)4.00 131.35 (2) 2.50 17.80 2.30 30.00 1.0 max 1.27 ± 0.10 2x 2.10 ± 0.15 2.50 ± 0.20 5.00 0.80 ± 0.05 3.80 2.50 0.2 ± 0.15 1.00 1.50±0.
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General Information DDR3 SDRAM Registered DIMM Heat Spreader Design 1. FRONT PART Outside R0 .2 4.65± 0.12 1 2 ± 0.1 2 2 2.6 ± 0.2 0.15 1.3 1 0. R 127 ± 0.12 25.6 ± 0.15 31.4 23.6 ± 0.15 11.9 29.77 25.6 ± 0.15 0.65 ± 0.2 130.45 ± 0.15 9.26 1+0/ -0.3 133.15 ± 0.2 1.3 0.4 Inside Green Line : TIM Attatch Line 7.45 Reg. pedestal line 80.78 119.29 128.5 2.
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General Information DDR3 SDRAM 3. CLIP PART 39.3 ± 0.2 Upper Bending Tilting Gap 29.77 5.8 5 1. R 6.8 ± 0.1 43.9 0.1 ~ 0.3 0.5 4. DDR3 RDIMM ASS’Y View Reference thickness total (nominal) : Mono Package : 7.55mm, DDP Package 7.71mm (With Clip thickness) 1.27 1.05 132.95 ± 133.45 39.3 ± 0.2 19 19 ± 0.1 6.8 ± 0.1 K text mark ’B’ or ’K’ punch press_stamp Clip open size 2.5~3.