Datasheet

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Product Guide DDR3 SDRAM Memory
Jan. 2011
7. Package Dimension
78Ball FBGA for 1Gb F-die (x4/x8) / 2Gb C-die (x4/x8) / 2Gb D-die (x4/x8)
78Ball DDP for 2Gb C-die (x4/x8) / 2Gb D-die (x4/x8)
A
B
C
D
E
F
G
H
M
N
7.50 ± 0.10
0.80 x 12 = 9.60
0.80 x 8 = 6.40
3.200.80
4.80
78 - 0.45 Solder ball
0.2 ABM
(Datum B)
(Datum A)
1.60
MOLDING AREA
#A1 INDEX MARK
B
A
11.00 ± 0.10
J
K
L
0.80
0.80
(Post Reflow 0.05 ± 0.05)
(0.95)
(1.90)
Bottom
Top
#A1
7.50 ± 0.10
11.00 ± 0.10
0.10MAX
0.50 ± 0.05
1.10 ± 0.10
0.35 ± 0.05
876543219
A
B
C
D
E
F
G
H
M
N
8.00 ± 0.10
0.80 x 12 = 9.60
0.80 x 8 = 6.40
3.200.80
4.80
78 - 0.45 Solder ball
0.2 ABM
(Datum B)
(Datum A)
876543219
1.60
#A1 INDEX MARK
B
A
BOTTOM VIEW
11.00 ± 0.10
J
K
L
0.80
0.80
(Post Reflow 0.50 ± 0.05)
0.10MAX
1.40 ± 0.10
#A1
8.00 ± 0.10
11.00 ± 0.10
0.35 ± 0.05
TOP VIEW