Datasheet

- 15 -
Product Guide DDR3 SDRAM Memory
Jan. 2011
78Ball FBGA Flip chip for 1Gb G-die (x4/x8)
A
B
C
D
E
F
G
H
M
N
7.50 ± 0.10
0.80 x 12 = 9.60
0.80 x 8 = 6.40
3.200.80
4.80
78 - 0.48 Solder ball
0.2 ABM
(Datum B)
(Datum A)
1.60
MOLDING AREA
#A1 INDEX MARK
B
A
11.00 ± 0.10
J
K
L
0.80
0.80
(Post Reflow 0.05 ± 0.05)
(0.30)
(0.60)
Bottom
Top
#A1
7.50 ± 0.10
11.00 ± 0.10
0.10MAX
0.50 ± 0.05
1.10 ± 0.10
0.35 ± 0.05
876543219