Service manual
4.Troubleshooting
4.Troubleshooting
4.1.Generalspec
Toolsusedforrepairingtheproduct
•SystemDiagnosticsDisk
•MS-DOSBootingDisk
•SystemDiagnosticsCard
•Screwdrivers(+,—)
•Tweezers
•Multi-meter
•Oscilloscope/LogicAnalyzer
ReplaceUnits(FRU:FieldReplaceableUnit)
•DDR3RAMModule(1slot)
•7mmHSA TA2.0HDD
•BroadcomWirelessLAN+BTComboModule/IntelWirelessLAN+BTComboModule
•Adapter
•SystemFan/Heatsink
•TouchPad
•Battery
•Speaker
•MainBoard/PWRSubBoard/3-in-1SubBoard/USB2.0SubBoard
•HarnessCable
•HarnessCable-DCinCable,SA TAHDDFPC,Main-to-PWRSubB’dFFC,USB2.0FFC,3-in-1FFC,LCDCable,
TouchpadFFC
Copyright©1995-2012SAMSUNG.Allrightsreserved.4-1










