DIGITAL STILL CAMERA SDC-30 SDC-33 SERVICE DIGITAL STILL CAMERA Manual CONTENTS 1. Precautions 2. Reference Information 3. Product Specifications 4. Disassembly and Reassembly MODE TIMER DELETE 5. Alignment and Adjustment POWER 6. Troubleshooting 7. Exploded View and Parts List 8. Electrical Parts List 9. Block Diagram 10. PCB Diagrams 11. Schematic Diagrams © Samsung Electronics Co., Ltd. JUN.
1. Precautions 1. Be sure that all of the built-in protective devices are replaced. Restore any missing protective shields. 2. When reinstalling the chassis and its assemblies, be sure to restore all pretective devices, including : control knobs and compartment covers. 3. Make sure that there are no cabinet openings through which people--particularly children --might insert fingers and contact dangerous voltages.
Precautions 11. High voltage is maintained within specified limits by close-tolerance, safety-related components and adjustments. If the high voltage exceeds the specified limits, check each of the special components. 12. Design Alteration Warning : Never alter or add to the mechanical or electrical design of this unit. Example : Do not add auxiliary audio or video connectors. Such alterations might create a safety hazard. Also, any design changes or additions will void the manufacturer’s warranty. 13.
2. Reference Information 2-1 Circuit description 2-1-1 DSC Digital camera(SDC-30/33), is an image-input device that connects to a PC. It’s small and light welght, supplies high quality images and has a large capacity (4MB/2MB). The digital camera consists of 3 sections: Camera, signal processing and storage. 1. Camera The camera is similar to a camcorder but adapts a scanning method of 525/30 (which can read an entire image of in one frame, whereas the camcorder’s scanning method is 525/60.
Reference Information 2. Camera power Camera power block consists of IC120 (PWM IC MB3800), Q121 (INVERTER TR DTC144EU), Q122 (SWITCHING TR KSD1621), and rectifier circuit. When CAM5V control pin of LCD MICOM 10PIN is high, it is converted at Q121 and IC 120. Pin 4 becomes low; then IC120 Pin 7 starts oscillating and the PWM output from IC120 Pin 5 switches Q122.
Reference Information 2. Lens SDC-30/33 lens uses a fixed focus method, and can take a photograph clearly at over 1 meter distance (optimal quality is between 1.5 and 3 meters). 3. Color Filter Color filter, which remove, the color information on CCD, adapts RGB method for best color characteristics and Bayer method for best. 4.
Reference Information 5. Timing Generator (MN5246) A timing generator generates each clock, synchronized signal, and CCD driving pulse for the system. Also, it receives the shutter speed information for the photo-exposure control (from the microprocessor). VDO,HDO CLK CSYNC DS1,DS2 SG CH1 Image signal ØSG ØSUB ØV4 ØV3 V3 V4 SUB V2 V1 R H2 bias H1 Signal process CDS ØV2 ØV1 CCD MN5246 VDLIDE 2fck=24.5Mhz Fig. 2-3 6.
Reference Information 7. A/D converter (KAD0228) and DRAM Controller (SMA9606) A/D converter converts the analog signal which is output from Analog processing IC to the 8-bit digital signal (24.54Mhz). DRAM Controller is synchronized with Vsync, converts the 8-bit data which is output from A/D converter to 16-bit data, and stores it in DRAM (controlled by the 32-bit microprocessor). MODE AE Data Detect.
Reference Information 2-1-5 Digital Section 1. Overview 8-6 CONV DRAM CTRL Camera Ctrl Flash Memory 16Mb/32Mb DRAM 4Mb S/W DSCP S/W JPEG Memory Ctrl LCD Micom LCD Pannel PC I/F 32bit RISC MICROPROCESSOR Power Control Fig. 2-6 2. DRAM (KM416C256BLT) and flash memory (TC5832FT/TC5816FT) DRAM stores the image signal temporarily and enables the microprocessor to process the signal. Flash memory (nonvolatile) records various system information and the compressed image. 3.
Reference Information 2-1-6 Sytem control Dual controller (MICOM) is located in DSC : A RISC chip controls the signal processing, and is the 4-bit MICOM controls the LCD, timer, and switch. Fig. 2-7 1. 4-bit MICOM; Functions and connections 1) PIN connection status - RISC is connected to the 4-bit MICOM (total 7 lines). - Pins 98, 130, and 108 and SCI No. 1 are used. - Pins 132, 133, 134, and 136 are used for communication with 4-bit MICOM. - Synchronized communication is used with 4-bit MICOM.
Reference Information - Mode change: When the mode is input by the PC key (or main body), 4-bit MICOM signals the RISC. When the mode is changed, 4-bit MICOM displays it on LCD, and changes the RISC to standby mode. - Delete execution: When the delete instruction is input by the PC key (or main body), 4-bit MICOM signal the RISC and changes the RISC to standby mode. - LCD display: DSC status is displayed. - Error handling: When an error occurs, (or RISC) the error message is displayed on LCD.
Reference Information 2-2 IC Blocks 2-2-1 IC301 (SMA9606) Samsung Electronics 2-9
Reference Information 2-2-2 IC302 (KM416C256BLT) 2-10 Samsung Electronics
Reference Information 2-2-3 IC304 (HD6477043) Samsung Electronics 2-11
Reference Information 2-2-4 IC307 (TC5832FT) 2-12 Samsung Electronics
Reference Information 2-2-5 IC601 (UPD75P3116GC) 2-2-6 IC501 (MAX232C) Samsung Electronics 2-13
Reference Information 2-2-7 IC203 (NN2038FAQ) 2-14 Samsung Electronics
Reference Information 2-2-8 IC204 (NN5248) Samsung Electronics 2-15
Reference Information MEMO 2-16 Samsung Electronics
3. Product Specifications Design and specifications are subject to change without notice.
Product Specifications MEMO 3-2 Samsung Electronics
4. Disassembly and Reassembly 4-1 Cabinet and PCB Disassemble in the order shown. (Reassemble in reverse order.) 4-1-1 Case-Side Removal 3 Disconnect 2 tabs while lifting up the case-side to the arrow direction. Bottom Side 1 Remove 2 screws. Precision screw Driver 2 Lift up the case-side using the precision screw driver. Fig.
Disassembly and Reassembly 4-1-2 Door-Battery Removal Open the Door-Battery (in the direction of arrow), and twist it to remove. Fig. 2 4-1-3 Case-Rear Removal 2 Remove 3 tabs while CASE-REAR pushing "A" area down. Detach the case-rear in the direction of the arrow. A 1 Remove 1 screw. Fig.
Disassembly and Reassembly 4-1-4 Main-PCB Removal 1 Remove 2 screws. 2 Disassemble MAIN PCB while disconnecting CN301 from FUNCTION-PCB. 3 Disconnect the lead connector CN502 from JACK-PCB. Fig. 4 4-1-5 Jack-PCB Removal 3 Disconnect the lead connector from CN501. 1 Remove 1 screw. 2 Disconnect 1 tabs. Fig.
Disassembly and Reassembly 4-1-6 Case-Top Removal 1 Disconnect one tab and detach Case-Top in the direction of arrow. Fig. 6 4-1-7 Case-Front Removal 2 Detach Case-Front in the direction of arrow. 1 Remove 1 screw. Fig.
Disassembly and Reassembly 4-1-8 OVF Removal 1 Remove 1 screw. Note : Take extreme care not to ieave fingerprints on the surface. 2 Lift up OVF. Fig.
Disassembly and Reassembly MEMO 4-6 Samsung Electronics
5. Alignment and Adjustments WARNING: The main board should be replaced if the back focus is twisted. Note : Ther is no need to adjust the focus for changing the CCD only 5-1 Camera Adjustment Note : DNP 3100°K light box, 5100°K color temperature conversion filter and adjustment program. A PC is needed for camera adjustment - Flash memory format : Configure the system, and store the “bad block” information - V-Sub voltage adjustment : Adjust the V-Sub voltage of CCD.
Alignment and Adjustments 5-2-3 Program installation * Perform setup.exe. * Perform SVC.exe (use directory made by setup.exe). 5-2-4 Program initial execution and adjustment 1. Initial execution Turn on PC and execute Windows Turn off camera Connect PC with camera Turn on camera Execute SVC.exe in Windows Fig.5-2 2. Initial screen of program Fig. 5-3 Initial screen at execution of SVC.exe 1) The window (Fig. 5-3) appears at execution of SVC.exe.
Alignment and Adjustments Select 'SDC-33/30' of Winows menu bar in use of mouse. Two items appear as shown in Fig. 5-5. Select 'Option' to set the adjustment item Select 'Start' for execution Fig. 5-5 Select 'SDC-33/30' of menu bar Finish the execution Fig. 5-4 3. 'Option' window 1) When selecting 'Option', Fig. 5-6 is displayed. Fig.
Alignment and Adjustments 2) Follow this procedure when setting the options in Fig. 5-6. : Select the communication port connected with PC Communication port setting : Select the communication rate between DSC and PC. Generally 56000 is used If an error occurs during communication, reduce the communication rate (9600 is minimum communication rate, and 115200 is maximum). Communication rate setting : Test decision : Use the camera disconnection function, or change the internal adjustment value.
Alignment and Adjustments 4) Execute the program in accordance with the sequence of Fig. 5-6. Power supply DRAM test Memory format ASIC test VSUB value adjustment 3100°K level AWB 5100°K level AWB LCD test Mode test Timer test Shot & Display Power interrupt Fig.
Alignment and Adjustments 4, Adjistment item Power supply DRAM test Memory format Fig. 5-10 Format is broken : Supply power to the entire camera : Check connections between DRAM and RISC : Check the flash memory state. The various information and image management data are stored as usual in the flash memory. * Normal memory : Go to the next step with ‘Formatted’ message. * Abnormal memory : Display the window to ask for compulsory format with ‘Format is broken’ message as shown in Fig. 5-11.
Alignment and Adjustments LCD test : Check each segment of camera LCD screen. Press 'Enter' key to stop and enter the next step. Mode test : Test the a into shot mode. The camera has two types of shot functions: VGA(640*480) and QVGA(320*240). Test both of these mode conversions. Timer test : Check the delay shot On/Off of camera. Display the result by means of self On/Off without special operation.
Alignment and Adjustments 5. Process for adjustment failure * Communication port XX cannot be used. Select another port. -> Cannot use com port XX. Select another com port. * RISC Processor isn't active. -> RISC Processor does not respond. * Can't receive the specified data data count from camera. -> Camera Communication Error. * There is a fatal error in DRAM circuit. -> DRAM Test error occured. * A fatal error occurs during ASIC test. -> ASIC Test error occured.
Alignment and Adjustments 5-2-5 Using the software 1. Edit S/W installation and use (iPhoto express of Ulead company based) 1) Insert CD-ROM (in Windows 95 environment). 2) Complete the installation according to the instructions on screen. Note: Select 'iPhoto Express Tour' in Help menu to see the detailed instructions for Edit S/W. All functions of Edit S/W are explained with figure. Fig.5-15 2. Twain driver installation 1) Execute setup.exe in TWAIN intallation diskette under Windows 95 environments.
Alignment and Adjustments 3. Twain driver preparation Fig.5-16 1) Execute TWAIN compatible edit program (Photo Impect, Video Studio, iPhoto Express, Photo Shop Pro. etc 2) Select Acquire->Select Soruce->Samsung Digital Camera TWAIN in file menu of edit program 3) Connect the digital camera with PC in use of RS-232C cable and power on. 4) Select Acquire->Image->Acquire in file menu operate TWAIN driver and display the thumbnail image in the camera.
Alignment and Adjustments 4. TWAIN driver use Fig.5-17 Brief descriptions for other functions (except image transmission function on TWAIN driver ) : - Option : Select communication rate - Update : Execute Update when camera state changes - Delete : Delete unnecessary screen.
Alignment and Adjustments MEMO 5-12 Samsung Electronics
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Troubleshooting 6-2 Samsung Electronics
Troubleshooting Samsung Electronics 6-3
Troubleshooting 6-4 Samsung Electronics
Troubleshooting Samsung Electronics 6-5
Troubleshooting 6-1 Test and repair of digital section * Perform the operation test and check for fault in digital section during adjustment and diagnostic program. (Refer to Chapter 5 for Environments, function, program installation and initial execution) Select 'SDC33/30' of Winows menu bar in use of mouse. Two items appear as shown in Fig.6-2. Select 'Option' to set the test item Select 'Start' for execution Finish Fig.6-2 Select 'SDC-30/33' of menu bar Fig.
Troubleshooting 6-3 Test procedure Power supply DRAM test Memory format ASIC test LCD test Mode test Timer test Shot & Display Power interrupt Fig.
Troubleshooting 6-4. Test items : Supply power to the entire camera Power supply : Check connections between DRAM and RISC DRAM test Memory format : Check the flash memory. The various information and image management data required by the camera are stored in the flash memory. * Normal memory : Go to the next step with 'Formatted' message. Fig.6-5 * Abnormal memory : Display the window to ask for compulsory format with 'Format is broken' message as shown in Fig 6-6.
Troubleshooting 6-5. Follow up Actions After inspection * Communication port XX can't be used. Select another port. -> Cannot use com port XX. Select another com port. * RISC Processor isn't active. -> RISC Processor does not respond. * Can't receive the specified count of data from camera. -> Camera Communication Error. * There is a Fatal error in DRAM circuit. -> DRAM Test error. * A fatal error occurs during ASIC test. -> ASIC Test error. * A fatal error occurs during Vsub adjustmentt.
Troubleshooting MEMO 6-10 Samsung Electronics
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Exploded View and Parts List 30 2 1 31 14 12 13 10 31 11 9 22 21 15 30 20 19 18 17 16 7 32 8 30 5 30 4 3 7-1 Cabinet Assembly 7-2 Samsung Electronics
Exploded View and Parts List Loc. No New Part No Description and Specification 1 2 UNIT-CASE FRONT PANEL-FRONT;-,A5056P,T0.8,-,-,DSC33 PANEL-FRONT;-,A5056P,T0.8,-,-,DSC30 UNIT-CASE REAR;SDC33 UNIT-CASE REAR;SDC30 KNOB-POWER;-,PC+ABS,-,BLK,-, HOLDER-POWER;-,PC+ABS,-,BLK, UNIT-CASE SIDE; COVER-JACK;-,PE,HB,-,-,D-GRAY,-,UNIT-DOOR BATTERY UNIT-CASE TOP UNIT-OVF LENS SPRING-BATTERY A SPRING-BATTERY B ASSY-FUNC BOARD; ASSY-JACK BOARD; ASSY-MAIN BOARD;SDC30 ASSY-MAIN BOARD;SDC33 BRACKET-CCD;-,AL,-,T1.
Exploded View and Parts List 7-2 Accessory AD91-10001A ASSY-ACCESSORY; SDC-30,NTSC ŒAD39-42001C ´AD63-10212A ˇAD69-32001A ¨AD46-30001C ¨AD46-30001E ˆAD46-20007A Ø4301-001017 CABLE-RS232C; 9P, 1000MM, PLUG 3.5. 20M STRAP-SHOULDER;-,-,-,-,BLK,-, BAG-SOFT CASE; SDC50, LEATHER,-,-,-,BLK,-,DISC-FLOPPY; 3.5 INCH, 1.44MB DISC-FLOPPY WIN3.1;3.5INCH,1.44MB,SDC-33 DISC-IPHOTO EXPRESS ; 120MM BATTREY-ALKALINE ; 1.5V, -, AA,14 X 49.5MM,PLATE 1 3 1.5V 1.5V 2 6 V 1.5 1.
8. Electrical Parts List Loc.
Electrical Parts List Loc.
Electrical Parts List Loc. No New Part No Description and Specification L201 L202 L203 L204 L205 L206 L207 L208 L209 L301 L302 L303 L311 L321 LED01 Q201 Q202 Q203 Q204 Q208 Q289 Q298 Q301 Q303 R201 R202 R203 R204 R205 R206 R207 R208 R209 R210 R211 R212 R213 R214 R215 R215 R216 R217 R218 R219 R220 R221 R222 R224 R232 R233 R234 R235 R236 R237 R239 INDUCTOR-SMD;22UH,10%,3.2X2.5X2.2MM INDUCTOR-SMD;10UH,5%,2.5X2X1.8MM INDUCTOR-SMD;22UH,10%,3.2X2.5X2.2MM INDUCTOR-SMD;22UH,10%,3.2X2.5X2.
Electrical Parts List Loc.
Electrical Parts List Loc.
Electrical Parts List Loc.
Electrical Parts List Loc.
Electrical Parts List MEMO 8-8 Samsung Electronics
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10.
PCB Diagrams 10-1 Main LOCATION COORDINATES Q101 4-A Q122 3-B Q204 4-F IC100 4-A IC120 2-B IC307 3-C IC206 3-C IC302 2-C IC301 2-D IC205 2-E IC202 4-F IC203 4-F 4 3 4 3 2 2 1 1 A B C D E LOCATION COORDINATES IC140 2-F IC204 4-A IC207 3-B IC303 3-D IC305 1-D Q201 3-B Q303 4-C Q198 4-E Q121 4-F Q141 4-F Q199 4-F Q142 2-F A F B C (Component Side) 10-2 E F (Conductor Side) Jack LOCATION COORDINATES J502 3-B J501 2-B IC501 1-A 3 2 1 1 B (Component Side) LOCATION COORDINATES CN501
PCB Diagrams 10-3 Function LOCATION COORDINATES CN601 4-F 4 4 3 3 2 2 1 1 A B C D E F (Component Side) Samsung Electronics LOCATION COORDINATES IC601 3-F CN602 4-F G H A B C D E F G H (Conductor Side) 10-3
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Schematic Diagrams Note For schematic Diagram - Resistors are in ohms, 1/8W unless otherwise noted. - Circled numbers refer to waveforms. Special note : Most semiconductor devices are electrostatically sensitive and therefore require the special handling techniques described under the “electrostatically sensitive (ES) devices” section of this service manual. Note : Do not use the part number shown on this drawing for ordering.
Schematic Diagrams 11-1.
Schematic Diagrams DIGITAL SIGNAL JPEG SIGNAL ANALOG SIGNAL 11-2.
Schematic Diagrams 11-3.
Schematic Diagrams 11-4.
