Datasheet

使用指南 Application Guidelines
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Index
波峰焊 Wave Soldering
最多給PCB預熱60秒鐘，浸錫達0.8mm或更厚。預熱溫度極限應低於100˚C。
Use a maximum preheating time of 60 seconds for PC boards 0.8mm or thicker. Preheating temperature
should be limited to less than 100˚C.
以下表格信息只用於導針的波峰焊接：
Use the following table for wave soldering on leads only:
焊錫溫度 (˚C)
Solder Bath Temperature
(˚C)
建議焊錫時間 (秒)
Recommended Solder Exposure
(seconds)
最大焊接時間 (秒)
Maximum Solder Exposure
(seconds)
220 7 9
240 7 9
250 5 7
260
3 5
回流焊接 Reflow Soldering
除非EDLC有明確的額定耐回流焊接溫度，否則不應對EDLC使用回流焊接而應使用紅外線或傳送
烤爐加熱方法進行焊接。
Unless the EDLC is specifically rated to withstand reflow soldering temperature, do not use reflow soldering,
infrared or convection heating methods on the EDLC.
紋波電流 Ripple Current
EDLC相對於其它超級電容來說有很低的電阻，相比鋁電解電容器有更高的電阻且在紋波電流之
中容易受內部熱量的影響而使ESR升高，壽命縮短。為確保長久的壽命，建議最大紋波電流不應使
EDLC表面溫度提升高於3˚C。
EDLC have a very low resistance compared to other supercapacitors but have a higher resistance than
aluminum electrolytic capacitors. EDLC are more susceptible to internal heat generation when exposed to
ripple current. In order to ensure long life time, the maximum ripple current recommended should not increase
the surface temperature of the EDLC by more than 3˚C, as heat generation leads to electrolyte decomposition,
gas generation, increased ESR and reduced life time.