Data Sheet

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PACKAGE OUTLINE
C
40X
0.3
0.2
4.5 0.1
40X
0.5
0.3
1 MAX
(0.2) TYP
0.05
0.00
36X 0.5
2X
4.5
2X 4.5
A
6.1
5.9
B
6.1
5.9
0.3
0.2
0.5
0.3
(0.1)
VQFN - 1 mm max heightRHA0040H
PLASTIC QUAD FLATPACK - NO LEAD
4219055/B 08/22/2019
PIN 1 INDEX AREA
0.08 C
SEATING PLANE
1
10
21
30
11
20
40
31
(OPTIONAL)
PIN 1 ID
0.1 C A B
0.05
EXPOSED
THERMAL PAD
DETAIL
SEE TERMINAL
SYMM
SYMM
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
41
SEE SIDE WALL
DETAIL
SCALE 2.200
DETAIL
OPTIONAL TERMINAL
TYPICAL
SIDE WALL DETAIL
OPTIONAL METAL THICKNESS