Datasheet

1
Non resettable fuses
SMD-FST
www.schurter.com /PG01_2
Fuses
Surface Mount Fuse, 5 x 20 mm, Time-Lag T, L, 250 VAC, Au plating
IEC 60127-2 · 250 VAC · Time-Lag T
Description
- Directly solderable on printed circuit boards
- L = Low Breaking Capacity
- For rated current 1 A to 16 A, SMD-SPT is recommended
Standards
- IEC 60127-2/3
- UL 248-14
- CSA C22.2 no. 248.14
Approvals
- VDE Certificate Number: 40011522
- UL File Number: E41599
Applications
- Primary protection on SMD PCBs
References
Packaging Details
Weblinks
pdf datasheet, html-datasheet, General Product Information, Packaging
details, Approvals, CE declaration of conformity, RoHS, CHINA-RoHS,
REACH, Distributor-Stock-Check, Detailed request for product
Technical Data
Rated Voltage 250 VAC
Rated current 0.05 - 20 A
Breaking Capacity 35 A - 125 A
Characteristic Time-Lag T
Mounting PCB,SMT
Admissible Ambient Air Temp. -55 °C to 125 °C
Climatic Category 55/125/21 acc. to IEC 60068-1
Material: Housing Glass
Material: Terminals Gold-Plated Copper Alloy
Unit Weight 1.05 g
Storage Conditions 0 °C to 60 °C, max. 70% r.h.
Product Marking , Rated current, Rated Voltage, Cha-
racteristic, Breaking Capacity
Soldering Methods Reflow
Soldering Profile
Solderability 245 °C / 3 sec acc. to IEC 60068-2-58,
Test Td
Resistance to Soldering Heat 260 °C / 10 sec acc. to IEC 60068-2-58,
Test Td
Resistance to Vibration acc. to IEC 60068-2-6, test Fc
Load Humidity Test MIL-STD-202, Method 103B
0.1 x In @ 0.85 r.H. @ 85°C
Moisture Resistance Test MIL-STD-202, Method 106E
(50 cycles in a temp./mister chamber)
Terminal Strength MIL-STD-202, Method 211A
(Deflection of board 1 mm for 1 minute)
Thermal Shock MIL-STD-202, Method 107D
(200 air-to-air cycles from -55 to
+125°C)
Case Resistance acc. to EIA/IS-722, Test 4.7
>100 MΩ (between leeds and body)
Resistance to Solvents MIL-STD-202, Method 215A
Dimension
20 mm
5.1
ø 5.2
20
+0.1
-0.2
±0.5
±0.6
5.1
±0.6
5.5 5.5
5
9.5
Soldering pads