Application ModuleX Service AX13-410 T talPlant
Application ModuleX Application ModuleX Service AX13-410 Release 100/110/200 CE Compliant 3/96 T talPlant
Copyright, Notices, and Trademarks Printed in U.S.A. – Copyright 1995 by Honeywell Inc. Revision 06– 3/96 While this information is presented in good faith and believed to be accurate, Honeywell disclaims the implied warranties of merchantability and fitness for a particular purpose and makes no express warranties except as may be stated in its written agreement with and for its customer. In no event is Honeywell liable to anyone for any indirect, special or consequential damages.
Table of Contents SECTION 1—INTRODUCTION .................................................................................... 1 1.1 About this Document Basics.................................................................................................................................... 1 Product description ............................................................................................................... 1 CE compliant hardware................................................................
Table of Contents 3.4 Node Processor Related Board Replacement Overview ............................................................................................................................. 23 Locating shutdown procedure ............................................................................................. 23 Board removal/replacement procedure............................................................................... 24 SECTION 4—HARDWARE DESCRIPTION OF COPROCESSOR .....................
Table of Contents SECTION 5—HARD DISK DRIVE TRAY ................................................................... 47 5.1 Drive Tray Description Overview ............................................................................................................................. Hard disk drive tray (front view) .......................................................................................... Disk drive physical placement and connections............................................................
Table of Contents 5.9 2 GB Seagate Drive (ST32430N) Introduction ......................................................................................................................... 2 GB Seagate drive (ST32430N) SCSI address pinning (address 6) ................................. SCSI address pinning (address 5) ...................................................................................... 2 GB Seagate drive (ST32430N) option pinning................................................................
Table of Contents 7.3 Modem Connection Overview ............................................................................................................................. 93 Modem interface cable schematic....................................................................................... 93 Modem connection procedure for U.S. Robotics Sportster 9600........................................ 94 SECTION 8—HP 712/60 PA RISC DESKTOP WORKSTATION .............................. 97 8.
Table of Contents 10.2 CD-ROM Physical Configuration and Cabling CD-ROM pinning (without DAT drive) ............................................................................... CD-ROM pinning (with DAT drive) .................................................................................... CD-ROM power................................................................................................................. CD-ROM drive SCSI cabling................................................................
Application Module X Service Manual Section 1—Introduction 1.1 About this Document Basics Purpose This manual provides instructions for maintenance and repair of the Application ModuleX. Intended audience All personnel that are expected to perform hardware installation, troubleshooting, and repair activities on the Application ModuleX. For product release This publication supports TDC 3000X software release 431 and CE Compliant hardware.
Introduction 1.2 References for More Information 1.
Section 2—Application ModuleX Overview 2.1 AXM Functionality General introduction The Application ModuleX (AXM) provides the functionality of a standard Application Module (AM) coupled with an HP-UX-based coprocessor. This hardware combination provides the capability for delivering powerful higher level control schemes to the TDC 3000X. It also provides the capability of adapting and utilizing third party control solutions. Two performance levels of the coprocessor are available.
Application ModuleX Overview 2.1 AXM Functionality Functionality diagram The following diagram illustrates that there are two distinct processors in the AXM node. A standard LCN node processor is coupled to an HP-UX-based coprocessor. The total AXM software responsibility of both processors is identified by the dotted lines. Notice that both processors must work through their respective portions of the communication software to successfully pass information between them.
Application ModuleX Overview 2.2 Hardware Organization 2.2 Hardware Organization AXM hardware block diagram Two versions of AXM hardware will be available. One uses the K2LCN board as the LCN node processor and the other uses the HMPU/LLCN/ QMEM combination of boards as the LCN node processor. The diagrams on the following two pages show the major hardware components that make up the AXM hardware.
Application ModuleX Overview 2.
Application ModuleX Overview 2.3 Board Slot Definition 2.3 Board Slot Definition Overview of chassis types Five-slot board placement The AXM will appear in two types of LCN node hardware chassis. They are • Five-slot chassis (when using a K2LCN node processor) • Ten-slot chassis (when using an HMPU node processor)—This specific Ten-slot chassis has a split backplane with 6 slots (bottom) dedicated to one LCN node and 4 slots (top) for another LCN node.
Application ModuleX Overview 2.3 Board Slot Definition Ten-slot board placement The following two tables show the AXM board placement for the Ten-slot chassis using the HMPU node processor. Two versions of board placement are used depending on the size of the coprocessor memory which is located on the WSI2 board. The 256 megabyte size requires additional space above the WSI2 board. Slots 7 through 10 do not share a common backplane for interconnection with slots 1 through 6.
Application ModuleX Overview 2.3 Board Slot Definition Table 2-4 Ten-Slot Chassis Board Locations (with 256 MB Coproc. Mem.) Slot Front 10 Unusable slot 9 Unusable slot 8 Hard Disk Drive Tray 7 (occupies two slots) 6 (Space for extra WSI2 memory) 5 WSI2 * 4 Optional application board 3 QMEM-2 2 LLCN 1 HMPU Rear HDDT I/O WSI2 I/O CLCN A/B or LCN I/O ** * Two versions of the WSI2 board are available to provide the 64 MHz and 100 MHz coprocessors.
Application ModuleX Overview 2.4 Power Supply 2.4 Power Supply Introduction The AXM node contains a power supply (55 amp) that is used in many other LCN node types. It is capable of producing output voltage margins of +5% and -5% that, in some cases, are used in factory test and troubleshooting activities. This margining is controlled by the jumper on the face of the power supply. See the following diagram.
Application ModuleX Overview 2.4 Power Supply The following diagram shows the power supply in a Five-slot chassis (K2LCN version). A similar power supply is used in the Ten-slot chassis (HMPU version). Node power supply diagram 5 4 3 2 1 5-Slot Chassis Norm Lo Power Supply 3/96 Error Power OK Reset Button Hi Margins Test Jumper Application ModuleX Service Honeywell Inc.
Application ModuleX Overview 2.4 Power Supply 12 Application ModuleX Service Honeywell Inc.
Section 3—Hardware Description of LCN Node Processors 3.1 K2LCN-X Node Processor The K2LCN processor board contains all of the essential parts to make up the kernel portion of any LCN node. It includes a 68020 processor, LCN interface circuits, and 4-8 megawords of onboard memory (for AXM). It does not have floating point calculation hardware capability. The exact memory size is determined by which option is purchased. A minimum of 4 Megawords are required to support R431.
Hardware Description of LCN Node Processors 3.1 K2LCN-X Node Processor The following table gives a description of the indicators on the K2LCN board. Reference the preceding diagram. Indicator description Table 3-1 K2LCN Board Indicators LED Description Suspected cause if abnormal Self-Test Pass On after board passes self-test. Normally on. K2LCN TX On when transmitting on the LCN. Normally on or flashing rapidly.
Hardware Description of LCN Node Processors 3.1 K2LCN-X Node Processor K2LCN pinning The K2LCN has an LCN node number pinning feature on the board itself. This feature is duplicated on the CLCN A/B I/O (or LCN I/O) board which is installed directly behind the K2LCN board in the AXM Five-slot chassis. ATTENTION The address pinning jumpers must all be removed from the K2LCN board when it is used in conjunction with an LCN I/O board. The node number pinning must be done on the LCN I/ O board in this case.
Hardware Description of LCN Node Processors 3.2 HMPU Processor and Associated Boards 3.2 HMPU Processor and Associated Boards The HMPU node processor has a 68020 microprocessor and includes floating point calculation hardware capability. It also has 2 megawords of on-board memory. Overview Additional memory for the HMPU processor in the AXM node is provided by a QMEM board.
Hardware Description of LCN Node Processors 3.2 HMPU Processor and Associated Boards Table 3-2 HMPU Error Indicators (continued) LED Description Suspected cause if abnormal Self-Test Error On to indicate a board self-test error. Normally off. HMPU Data Compare Error On to indicate an on-board data compare error. Normally off. HMPU DTAK Time Out On to indicate a Data Transfer Acknowledge failure. Normally off. HMPU BGAK Time Out On to indicate a Bus Grant Acknowledge failure. Normally off.
Hardware Description of LCN Node Processors 3.2 HMPU Processor and Associated Boards The LLCN board provides the LCN interface functionality used by the HMPU node processor. The actual connection to the LCN cables is through the CLCN A/B I/O (or LCN I/O) board which is inserted in the I/O card chassis immediately behind the LLCN board (same board slot). LLCN board functionality The LCN node address is pinned on the CLCN A/B I/O (or LCN I/O) board and is covered later in this section.
Hardware Description of LCN Node Processors 3.2 HMPU Processor and Associated Boards This board is used to provide additional memory for the HMPU node processor. The 2 megaword version is supplied in the AXM. The memory size of any QMEM can quickly be determined by looking at the last digit of the name on the left board extraction lever.
Hardware Description of LCN Node Processors 3.2 HMPU Processor and Associated Boards Table 3-5 QMEM Indicator (continued) LED Description Suspected cause if abnormal Sing Bit On to indicate a single bit (recoverable) error exists. Normally off. QMEM Mult On to indicate a multiple bit (unrecoverable) error exists. Normally off. QMEM. 20 Application ModuleX Service Honeywell Inc.
Hardware Description of LCN Node Processors 3.3 CLCN A/B I/O (or LCN I/O) Board 3.3 CLCN A/B I/O (or LCN I/O) Board Overview This board provides the physical interface to the LCN cables. It is used with both versions of node processors (K2LCN and HMPU). LCN address pinning The AXM LCN address pinning feature for defining the LCN physical node number is located on this board. These address jumpers must be properly configured at the time of hardware installation.
Hardware Description of LCN Node Processors 3.3 CLCN A/B I/O (or LCN I/O) Board LCN cable connections The AXM node processor is connected to the LCN cable network. These LCN cables (A and B) are connected to the CLCN A/B I/O (or LCN I/O) board as shown in the following diagram. This cabling scheme is the same for each LCN node that uses the CLCN A/B I/O (or LCN I/O) board.
Hardware Description of LCN Node Processors 3.4 Node Processor Related Board Replacement 3.4 Overview Node Processor Related Board Replacement Node power must be turned off for the purpose of changing circuit boards in the AXM node. WARNING Damage can result—Circuit board damage can result if you do not practice proper ESD procedures or attempt to remove/insert a circuit board with node power applied.
Hardware Description of LCN Node Processors 3.4 Node Processor Related Board Replacement Board removal/ replacement procedure Table 3-6 Board Replacement Procedure Step Action 1 Turn off power using the switch on the node power supply. 2 Remove the board. 3 Verify that the replacement board pinning matches the existing board. 4 Insert the replacement board. 5 The node is now ready for power on and loading. 6 Perform the node loading procedure.
Section 4—Hardware Description of Coprocessor 4.1 WSI2 Board Description Overview The basic WSI2 board contains the coprocessor interface circuits required to adapt the coprocessor into the AXM node hardware. Reference the diagram below. A coprocessor daughter board connects to the WSI2 mother board through a specially provided connector on the WSI2 board. Several small cables are also used to complete the total coprocessor to WSI2 board connections.
Hardware Description of Coprocessor 4.1 WSI2 Board Description WSI2 board indicators (LEDs) and switch The diagram below shows two indicators and a switch at the left. These are the WSI2 board indicators. These indicators are directly visible with the chassis front cover in place. The indicators are described as follows: • Transaction error (red LED) Indicates that a data parity error or bus error was encountered during normal operation on the backplane module bus.
Hardware Description of Coprocessor 4.1 WSI2 Board Description WSI2 board pinning The WSI2 board has only one pinned option. The pinning defines if an HMPU board or a K2LCN board is used as the node processor. The interface to these two node processors is somewhat different.
Hardware Description of Coprocessor 4.1 WSI2 Board Description Coprocessor battery location The following diagram illustrates the location of the coprocessor battery. It may not be as clearly visible as shown here because an additional memory board may be installed on your coprocessor. The battery will be covered by the additional memory board, if it exists.
Hardware Description of Coprocessor 4.1 WSI2 Board Description Coprocessor memory option (32 megabytes) The following two illustrations show the two methods of providing the minimum 32 megabyte memory option in position on the coprocessor board. Memory board availability at the time of manufacture will determine which method is used.The first method consists of two 16 megabyte boards.
Hardware Description of Coprocessor 4.1 WSI2 Board Description Coprocessor memory option (64 megabytes) The following two illustrations show the two methods of providing the 64 megabyte memory option in position on the coprocessor board. Memory board availability at the time of manufacture will determine which method is used.The first method consists of two 32 megabyte boards. 32 Megabytes (Each Board) 52517 The illustration below shows the second method of providing the 64 megabyte memory option.
Hardware Description of Coprocessor 4.1 WSI2 Board Description 64 Megabytes (Each Board) 51165 3/96 Application ModuleX Service Honeywell Inc.
Hardware Description of Coprocessor 4.1 WSI2 Board Description Coprocessor memory option (265 megabyte) The illustration below shows the 256 megabyte memory option in position on the coprocessor board. Notice that there are two 64 megabyte memory daughter boards stacked in two locations. The 64 megaword memory daughter boards (4 each) make up 256 megabytes of total memory. The stacking of these memory daughter boards requires additional clearence on the top side of the WSI2 board.
Hardware Description of Coprocessor 4.1 WSI2 Board Description • Boot/Run—(Green indicator) Blinks during the boot process and turns on (steady) when the boot is completed. • SCSI—It is the interface used for connecting the coprocessor SCSI (disk drive) interface to the disk drive tray through a cable. • AUI/VID-A—Provides the interface to the Plant Information Network (PIN). The PIN is Honeywell’s terminology for the Local Area Network (LAN). • RS-232-A—Commonly referred to as Serial Port 1.
Hardware Description of Coprocessor 4.1 WSI2 Board Description Coprocessor PIN connection details The coprocessor is connected to the PIN network as shown in the diagram. The PIN connection is made at the coprocessor free edge.
Hardware Description of Coprocessor 4.1 WSI2 Board Description Coprocessor SCSI interface details The coprocessor SCSI (hard disk drive) interface connection is made at the coprocessor board free edge. From there it is routed: • Through a cable to the Hard Disk Drive tray (HDDT) internal circuit board, • Through the internal HDDT circuit board to disk drive interface cables and also through the backplane to the HDDT I/O board, • Through the HDDT I/O board to a cable connector.
Hardware Description of Coprocessor 4.1 WSI2 Board Description Honeywell provides the appropriate Kinet license key (correlated to the coprocessor hardware identification number) to the customer with the Kinet software at the time of shipment. The customer must enter this provided license key into the Kinet software configuration data. Replacement of a WSI2 board assembly due to failure (or any other reason) also changes the hardware identification number.
Hardware Description of Coprocessor 4.2 WSI2 I/O Board Description WSI2 I/O Board Description WSI2 I/O board cable connections The WSI2 I/O board provides the coprocessor connection to the PIN network. A connection for Serial Port 1 (coprocessor console or modem connection to J1) is also provided. BAR CODE 4.2 ASSY NO. 51304924-200 REV C WSI2 I/O LAN J6 Video J3 Terminal J1 53352 3/96 Application ModuleX Service Honeywell Inc.
Hardware Description of Coprocessor 4.3 Media Access Unit (MAU) Description 4.3 Media Access Unit (MAU) Description The Media Access Unit is the device that connects the AXM to the Plant Information Network (PIN). It contains a transceiver device that adapts the LAN interface of the coprocessor to the LAN (ethernet) cable. Purpose There are many vendors that produce this type of device. The one shown in the diagram is just one of the many available.
Hardware Description of Coprocessor 4.3 Media Access Unit (MAU) Description Media Access Unit connection The following WSI2 I/O diagram identifies the MAU connection (J6). Power is supplied to the MAU from the WSI2 I/O board through the interface cable. . BAR CODE ASSY NO. 51304924-200 REV C WSI2 I/O LAN J6 To MAU (PIN Cable) 3/96 Video J3 Terminal J1 Video (Not used for AX M) Serial Port 1 (Terminal or Modem) Application ModuleX Service Honeywell Inc.
Hardware Description of Coprocessor 4.4 WSI2 Board Replacement 4.4 WSI2 Board Replacement Overview Node power must be turned off for the purpose of changing circuit boards in the AXM node. WARNING Damage Can Result—Circuit board damage can result if you do not practice proper ESD procedures or attempt to remove/insert a circuit board with node power applied.
Hardware Description of Coprocessor 4.4 WSI2 Board Replacement Table 4-3 WSI2 Board Replacement Procedure (continued) Step Action 5 Ensure that the replacement WSI2 assembly has the proper size coprocessor memory (complement of board/s) properly mounted on the coprocessor board. These boards are plugged into sockets on the coprocessor board and then fastened with two screws each. Remember that the WSI2 and coprocessor memory are ordered separately.
Hardware Description of Coprocessor 4.4 WSI2 Board Replacement Table 4-3 WSI2 Board Replacement Procedure (continued) Step 13 Action Having obtained the new hardware identification number, call the Honeywell Technical Assistance Center (TAC), using telephone number 800-8227673. Inform them that you have changed your Application ModuleX coprocessor hardware and give them the new hardware identification number.
Hardware Description of Coprocessor 4.5 WSI2 I/O Board replacement 4.5 WSI2 I/O Board replacement Overview Node power must be turned off for the purpose of changing circuit boards in the AXM node. WARNING Damage Can Result—Circuit board damage can result if you do not practice proper ESD procedures or attempt to remove/insert a circuit board with node power applied.
Hardware Description of Coprocessor 4.5 WSI2 I/O Board replacement Table 4-4 WSI2 I/O Board Replacement Procedure (continued) 44 Step Action 4 Insert the replacement board and secure the screws. (Extraction/insertion levers exist in place of screws on non-CE compliant units.) 5 Reconnect the cables removed in step 2. 6 The node is ready for power on and loading. Turn on the power switch located on the AXM node power supply. 7 Perform the node loading procedure.
4.6 4.6 Overview Hardware Description of Coprocessor Media Access Unit Replacement Procedure Media Access Unit Replacement Procedure The replacement of the MAU is a simple procedure. It does not require powering off the AXM nor any special actions on the PIN (network). CAUTION Replacing the MAU with power on in the AXM node does require that proper care must be exercised to prevent the cable ends from touching any possible grounded or electrically charged object.
Hardware Description of Coprocessor 4.6 Media Access Unit Replacement Procedure 46 Application ModuleX Service Honeywell Inc.
Section 5—Hard Disk Drive Tray 5.1 Drive Tray Description Overview The Hard Disk Drive Tray (HDDT) contains the coprocessor hard disk drive(s). A maximum of two drives can exist in this tray. The primary (first) drive is always mounted on the right side. This is done for cooling reasons and must be adhered to in all cases. This drive will always have device address 6 (physical pinning). An optional second drive is mounted on the left side. This drive will always have device address 5 (physical pinning).
Hard Disk Drive Tray 5.1 Drive Tray Description The diagram below shows the drive tray from the opposite end when compared to the diagram above. Notice the following: Disk drive physical placement and connections • Physical position of each drive • Drive tray internal circuit board • SCSI interface ribbon cable for each drive Disk drives currently originate from several different manufacturing sources. Their drive mounting and electrical connection properties are identical.
5.1 Drive connection detail Hard Disk Drive Tray Drive Tray Description The following illustration gives greater detail to show the drive SCSI interface cable and power harness. Power Harness SCSI Interface Cable Drive mounting details 51170 The following illustration gives the drive mounting hardware detail. All four mounting screws (one at each corner of the drive) are identical. Nut Washer Shock Mount Washer Screw 51169 3/96 Application ModuleX Service Honeywell Inc.
Hard Disk Drive Tray 5.1 Drive Tray Description Disk drives Several types of disk drives are available for use in the drive tray. The following table identifies the drive types currently available. The drives of the same capacity (although from different manufacturers) are functionally the same. An order for a specific size spare drive will be filled with one from a vendor listed in the following table.
5.1 Considerations for ordering replacement drives Hard Disk Drive Tray Drive Tray Description The only thing to consider when ordering a replacement disk drive is drive capacity. The spare drive is supplied properly formatted, but without HP-UX software. If the primary drive is the one being replaced, the appropriate recovery procedure must be used to boot from “HP-UX Install” DAT tape on an alternate boot source such as a DAT drive connected locally or remote DAT drive accessible over the network.
Hard Disk Drive Tray 5.1 Drive Tray Description If the optional second drive is replaced with a drive containing files from another system, the existing files must be discarded by initializing the drive and then performing a software restore operation from customer generated DAT drive “Backup Tape” (or other available source) before returning the replaced drive under system control using the “mount” command. 52 Application ModuleX Service Honeywell Inc.
5.2 5.2 Hard Disk Drive Tray 525 MB Quantum Disk Drive (LPS525S) 525 MB Quantum Disk Drive (LPS525S) The diagram shows a 525 MB Quantum drive. Notice the identified parts. Introduction Busy Indicator (LED) Drive Pinning Locations 525 MB Quantum drive pinning 40030 The only pinning that should be required is the SCSI interface device address. The drive on the right of the tray is always address 6 and the optional drive on the left is always address 5.
Hard Disk Drive Tray 5.2 525 MB Quantum Disk Drive (LPS525S) Pin as Shown (For Both Drives) Device Address 2 2 1 2 20 No Jumpers Address 5 Shown 54 40032 Application ModuleX Service Honeywell Inc.
5.3 5.3 Hard Disk Drive Tray 525 MB Seagate Drive (ST3600N) 525 MB Seagate Drive (ST3600N) Introduction The diagram shows a 525 MB Seagate drive. Drive Pinning Locations SCSI Interface Connector Power Connector 40033 525 MB Seagate drive address pinning The pinning to define the device address on the SCSI interface bus must be done. The drive on the right of the tray is always pinned for address 6 and the optional drive on the left is always pinned for address 5.
Hard Disk Drive Tray 5.3 525 MB Seagate Drive (ST3600N) The following diagram is the same as the previous diagram with the exception of address 5 instead of 6. 0 Address 5 Shown 21 22 2 No Jumpers PWB Drive Bottom 1 2 3 4 5 6 40035 56 Application ModuleX Service Honeywell Inc.
5.3 525 MB Seagate drive SCSI interface termination Hard Disk Drive Tray 525 MB Seagate Drive (ST3600N) The Seagate drives have the capability to provide termination for the SCSI interface cable. This feature is not needed for the AXM application since a terminator is placed at the end of the SCSI cable network on the HDDT I/O board. The diagram illustrates the missing termination resistor modules on the drive. Replacement drives may have these resistor modules in place. Remove them if they are present.
Hard Disk Drive Tray 5.3 525 MB Seagate Drive (ST3600N) 525 MB Seagate drive termination/ parity pinning Both drives 5 and 6 should have these options pinned as illustrated in the diagram. Active/Passive Termination Jumper Block PWB 1 23 4 5 67 8 40037 525 MB Seagate drive unused pinning There are no option jumpers required in this location as illustrated in the diagram. This applies to both possible drives in the disk tray.
Hard Disk Drive Tray 1.2 GB Digital Equipment Corp. Drive (DSP3107L) 5.4 5.4 1.2 GB Digital Equipment Corp. Drive (DSP3107L) Introduction The diagram shows a 1.2 GB Digital Equipment Corporation disk. The drive is shown upside down. Notice the identified pinning locations and indicators. Device Pinning Locations Busy (LED) Fault (LED) 40045 1.2 GB DEC drive SCSI address pinning (address 6) The illustration below shows the proper drive pinning for SCSI address 6.
Hard Disk Drive Tray 5.4 1.2 GB Digital Equipment Corp. Drive (DSP3107L) 1.2 GB DEC drive SCSI address pinning (address 5) The illustration below is identical to the previous diagram with the exception of SCSI address 5. Busy (LED) Fault (LED) (Under Board) Option Pinning 9 10 8 5 76 3 4 21 20 21 22 SCSI Address 5 40060 1.2 GB DEC drive SCSI termination pinning The SCSI termination pinning options provided on the drive are not used in the AXM. They should all be removed if they are present.
Hard Disk Drive Tray 1.2 GB Quantum Drive (LPS1080S) 5.5 5.5 1.2 GB Quantum Drive (LPS1080S) The diagram below illustrates the 1.2 GB Quantum disk drive. The drive is shown upside down. Notice the identified pinning locations and “Busy” indicator. Introduction Busy Indicator (LED) Drive Pinning Locations 1.2 GB Quantum drive SCSI address pinning (address 6) 40030 The diagram below identifies the pinning required for SCSI address 6. .
Hard Disk Drive Tray 5.5 1.2 GB Quantum Drive (LPS1080S) SCSI address pinning (address 5) The diagram below is identical to the one above with the exception for the SCSI address 5. LED SCSI Address 5 20 21 22 40063 1.2 GB Quantum drive option pinning The following diagram illustrates the drive option pinning for use in the AXM. Both drives must have the options pinned as shown.
5.6 5.6 Hard Disk Drive Tray 1.2 GB Quantum Drive (VP31110) 1.2 GB Quantum Drive (VP31110) Introduction The diagram below illustrates the 1.2 GB Quantum (VP31110) disk drive. The drive is shown upside down. Notice the identified pinning locations and “Busy” indicator. SCSI Terminator Location (Not Used) 9 10 87 6 5 4 3 2 1 20 21 22 Option Pinning Busy (LED) 1.
Hard Disk Drive Tray 5.6 1.2 GB Quantum Drive (VP31110) SCSI address pinning (address 5) The diagram below is identical to the one above with the exception for the SCSI address 5. SCSI Terminator Location (Not Used) 9 10 Option Pinning Busy (LED) 1.2 GB Quantum drive (VP31110) option pinning 8 7 Fault (LED) 6 5 4 32 1 20 21 22 Option Pinning SCSI Address 5 54379 The following diagram illustrates the drive option pinning for use in the AXM. Both drives must have the options pinned as shown.
5.7 5.7 Hard Disk Drive Tray 1.2 GB Seagate Drive (ST31200) 1.2 GB Seagate Drive (ST31200) Introduction The diagram shows a 1.2 GB Seagate drive. The drive is shown upside down. Notice the identified pinning locations and SCSI terminator resistor module locations. Drive Pinning Locations SCSI Interface Connector Power Connector 40033 3/96 Application ModuleX Service Honeywell Inc.
Hard Disk Drive Tray 5.7 1.2 GB Seagate Drive (ST31200) 1.2 GB Seagate drive address pinning The pinning to define the device address on the SCSI interface bus must be done. The drive on the right of the tray is always pinned for address 6 and the optional drive on the left is always pinned for address 5. The following diagram illustrates the pinning for address 6. Notice that the drive is shown upside down.
5.7 Drive address 5 Hard Disk Drive Tray 1.2 GB Seagate Drive (ST31200) The diagram below illustrates the same drive pinned for address 5. 0 Address 5 Shown 21 22 2 No Jumpers PWB Drive Bottom 1 2 3 4 5 6 40035 1.2 GB Seagate drive termination/ parity pinning Both drives 5 and 6 should have these options pinned as illustrated in the diagram. Active/Passive Termination Jumper Block PWB 1 23 4 5 67 8 40037 3/96 Application ModuleX Service Honeywell Inc.
Hard Disk Drive Tray 5.7 1.2 GB Seagate Drive (ST31200) 1.2 GB Seagate drive unused pinning There are no option jumpers allowed in this location as illustrated in the diagram. No Jumpers Drive Bottom PWB 3 2 1 40038 68 Application ModuleX Service Honeywell Inc.
Hard Disk Drive Tray 2 GB Quantum Drive (VP32210) 5.8 5.8 2 GB Quantum Drive (VP32210) Introduction The diagram below illustrates the 2 GB Quantum (VP32210) disk drive. The drive is shown upside down. Notice the identified pinning locations and “Busy” indicator.
Hard Disk Drive Tray 5.8 2 GB Quantum Drive (VP32210) SCSI address pinning (address 5) The diagram below is identical to the one above with the exception for the SCSI address 5. SCSI Terminator Location (Not Used) 9 10 Option Pinning Busy (LED) 2 GB Quantum drive (VP32210) option pinning 8 7 Fault (LED) 6 5 4 32 1 20 21 22 Option Pinning SCSI Address 5 54379 The following diagram illustrates the drive option pinning for use in the AXM. Both drives must have the options pinned as shown.
Hard Disk Drive Tray 2 GB Seagate Drive (ST32430N) 5.9 5.9 2 GB Seagate Drive (ST32430N) The diagram below illustrates the 2 GB Seagate (ST23430N) disk drive. The drive is shown upside down. Notice the identified pinning locations and “Busy” indicator.
Hard Disk Drive Tray 5.9 2 GB Seagate Drive (ST32430N) SCSI address pinning (address 5) The diagram below is identical to the one above with the exception for the SCSI address 5. Option Pinning Busy (LED) 0 Option Pinning 1 2 Additional Pinning 34 5 6 7 8 91 Cover (leave in place) 22 21 20 Option Pinning 2 GB Seagate drive (ST32430N) option pinning SCSI Address 5 54376 The following diagram illustrates the drive option pinning for use in the AXM.
Hard Disk Drive Tray 2 GB Hewlett Packard Drive (C3325A) 5.10 5.10 2 GB Hewlett Packard Drive (C3325A) Introduction The diagram below illustrates the 2 GB Hewlett (C3325A) disk drive. The drive is shown upside down. Notice the identified pinning locations and “Activity” indicator.
Hard Disk Drive Tray 5.10 2 GB Hewlett Packard Drive (C3325A) SCSI address pinning (address 5) The diagram below is identical to the one above with the exception for the SCSI address 5. Option Pinning Additional Pinning 0 11 21 9 6 5 87 43 2 1 1 Option Pinning 2 2 1 2 20 Activity (LED) 2 GB HPdrive (C3325A) option pinning SCSI Address 5 54382 The following diagram illustrates the drive option pinning for use in the AXM.
Hard Disk Drive Tray 5.11 HDDT I/O Board 5.11 HDDT I/O Board Description The HDDT I/O board interfaces with the Hard Disk Drive Tray through the module backplane. The coprocessor SCSI (disk drive) interface normally stops at connector J1. If an optional DAT tape or CD-ROM device exists on your AXM, one end of the daisy-chain device interface cable connects to J1 of the HDDT I/O board. The device at the far end of this cable must be pinned to provide the SCSI interface termination.
Hard Disk Drive Tray 5.12 Disk Drive/Drive Tray Replacement 5.12 Disk Drive/Drive Tray Replacement Overview Node power must be turned off for the purpose of removing the disk drive tray from the AXM node. WARNING Damage Can Result—Circuit board damage can result if you do not practice proper ESD procedures or attempt to remove/insert a circuit board with node power applied.
5.12 Hard Disk Drive Tray Disk Drive/Drive Tray Replacement Table 5-2 Drive Tray/Disk Drive Replacement Procedure Step Action 1 Determine if the primary or optional second disk drive is to be replaced. 2 If it is the optional second drive that is to be replaced, use the proper software command to unmount the drive (umount). 3 Perform a coprocessor software shutdown using the appropriate software command. Reference:>>AXM System Administration manual , Shutting down HP-UX (Section 3.5).
Hard Disk Drive Tray 5.12 Disk Drive/Drive Tray Replacement Table 5-2 Drive Tray/Disk Drive Replacement Procedure Step 16 Action Replace the drive tray cover removed in step 4. Be sure none of the cables are pinched between the cover and the tray at any point. Failing to do so can cause damage to the cable. 17 Insert the drive tray into the chassis. 18 Reconnect the SCSI cable disconnected in step 2. 19 The node is ready for power on and loading.
5.13 5.13 Overview Hard Disk Drive Tray HDDT I/O Board Replacement HDDT I/O Board Replacement Node power must be turned off for the purpose of changing circuit boards in the AXM node. WARNING Damage can result—Circuit board damage can result if you do not practice proper ESD procedures or attempt to remove/ insert a circuit board with node power applied.
Hard Disk Drive Tray 5.13 HDDT I/O Board Replacement HDDT I/O Board Removal/ Replacement Procedure Table 5-3 HDDT I/O Board Replacement Procedure Step 80 Action 1 Turn off power using the switch on the node power supply. 2 Disconnect the item connected to J1 on the HDDT I/ O board. This is the SCSI interface cable to the optional DAT/CD-ROM devices if they exist. It is a terminator assembly if the optional devices do not exist.
Section 6—Coprocessor Console 6.1 Overview Requirements for coprocessor console A console terminal connection to the coprocessor Serial Port 1 is required to initially configure the coprocessor software in PIN connected AXMs. This (terminal) will serve as a “console” to the coprocessor HP-UX software environment. The fundamental coprocessor software configuration task is to make the AXM conversant with appropriate other nodes on the PIN (LAN).
Coprocessor Console 6.1 Overview Overview of activities to be performed There are several distinct tasks required to connect a console terminal to the coprocessor as a console. • Select the proper terminal options. • Connect the terminal to the WSI2 I/O board. • The coprocessor software defaults to the proper configuration of Serial Port 1 and no coprocessor configuration actions are required. • Apply power to the terminal.
6.2 6.2 Coprocessor Console Coprocessor Terminal Description and Configuration Coprocessor Terminal Description and Configuration Recommended terminal Honeywell recommends the Digital Equipment Corporation (DEC) VT100 terminal (or any simple terminal with equivalent functionality) for use as a “console” terminal connected to the coprocessor. This terminal is needed for initial configuration of PIN connected AXMs and for troubleshooting coprocessor related problems.
Coprocessor Console 6.3 Coprocessor Console Terminal Connection 6.3 Coprocessor Console Terminal Connection Overview A direct connect interface cable must be connected between the coprocessor console terminal device and the WSI2 I/O board (Serial Port 1). Several different devices can be used to provide this coprocessor console connection. The following diagram illustrates this.
6.3 Coprocessor console terminal interface cable schematic Coprocessor Console Coprocessor Console Terminal Connection Examples of the direct connect terminal interface cable wiring details are shown in the following diagrams. Notice that two cable types are described. One is a 9 to 25 pin direct connect cable and the other is a 9 to 9 pin direct connect cable. The 9 to 25 pin cable (in the first diagram ) is available from Honeywell logistics using the part number 51196218-300.
Coprocessor Console 6.3 Coprocessor Console Terminal Connection 9 to 9 pin cable AXM (WSI2 I/O Board J1) Coprocessor Console Terminal (RS-232 Port) 1 2 3 "X" End 4 5 6 7 8 9 Female 1 2 3 4 5 "Y" End 6 7 8 9 Female Pinning Table "X" End "Y" End 1 7&8 2 3 3 2 4 6 5 5 6 4 7 1 8 1 9 9 Shield Shield Outer Shield 40070 Note: The dashed lines shown in the 9 to 9 cable diagram above are required connections.
6.3 Coprocessor Console Coprocessor Console Terminal Connection Table 6-1 Terminal Connection Procedure (continued) Step Action 4 Make sure the terminal is powered on.
Coprocessor Console 6.3 Coprocessor Console Terminal Connection Table 6-2 Cable/Connector Definition for Connecting Console Terminals. Applicable Terminal Devices HP 712/60 Workstation Terminal Connector RS-232 Cable Part Number 51305069-100 9 pin(F) to 9 pin(F) UXS-100 WSI I/O board (J2) 51305069-100 9 pin(F) to 9 pin(F) UXS-200 WSI2 I/O board (J1) 51305069-100 9 pin(F) to 9 pin(F) Other VT-100 compatible devices with 9 pin RS-232 connector.
Section 7—TAC Access to Coprocessor 7.1 Overview TAC support for coprocessor problems The Technical Assistance Center (TAC) has the capability of providing assistance with troubleshooting coprocessor related problems. Troubleshooting some problems may require direct access to the coprocessor. A telephone communications link must be connected to the coprocessor to allow direct access from TAC. The diagram right illustrates this communications link.
TAC Access to Coprocessor 7.2 Communications Modem Description and Configuration 7.2 Communications Modem Description and Configuration Recommended modem Honeywell recommends the following modem for the TAC access communications link. U.S. Robotics Sportster 9600 This is a commercially available device and is not supplied by Honeywell. The configuration switches and registers for this modem are given later in this section. Other modems that are fully compatible with the U. S.
7.2 Modem Configuration Registers TAC Access to Coprocessor Communications Modem Description and Configuration The internal configuration registers of the U.S. Robotics Sportster 9600 modem must be properly loaded to finish the modem configuration task. This is done by connecting a terminal to the modem and then entering the required configuration data into the registers. The configuration data for the U.S. Robotics 9600 modem is provided in a table following in this section.
TAC Access to Coprocessor 7.2 Communications Modem Description and Configuration Table 7-2 U.S. Robotics 9600 Configuration Register Data (continued) Register Description &N0 Variable link operations &P0 Pulse dialing US/Canada &R1 Ignore RTS &S0 DSR override &T5 Prohibit RDL &Y1 Break handling, destructive expedited CAUTION Be certain to perform a save/write (AT&W) to NVRAM registers after entering the register data.
TAC Access to Coprocessor 7.3 Modem Connection 7.3 Modem Connection Overview An interface cable must be connected between the optional modem and the WSI2 I/O board J1 (Serial Port 1). Locate J1 in the diagram on the right. BAR CODE ASSY NO.
TAC Access to Coprocessor 7.3 Modem Connection U XS Connector (WSI2 I/O J1) 1 Transmitted Data 2 Received Data 3 4 Ground 5 1 Frame Ground 2 Transmitted Data 3 Received Data 4 Request to Send 5 Clear to Send 6 6 Data Set Ready 7 7 Signal Ground 8 8 Data Carrier Detect 9 20 Data Terminal Ready D-9 Female Modem connection procedure for U.S. Robotics Sportster 9600 Modem Connector D-25 Male 40043 CAUTION The modem can be connected while power is applied to the AXM and the modem.
TAC Access to Coprocessor 7.3 Modem Connection Table 7-3 Modem Connection Procedure (continued) Step 3/96 Action 5 Ensure modem power is on. 6 The communications link hardware is ready for making the telephone connection and subsequent sign-on by TAC. Application ModuleX Service Honeywell Inc.
TAC Access to Coprocessor 7.3 Modem Connection 3/96 Application ModuleX Service Honeywell Inc.
Section 8—HP 712/60 PA RISC Desktop Workstation 8.1 HP 712/60 Workstation in AXM Environment Overview of HP 712/60 workstation functionality supporting AXM The optional System Administration and Development workstation (HP 712/60) provides several functions that support the AXM environment. They are: • Provides an HP-UX workstation connected to the PIN (LAN). AXM system administration and application development can be accomplished through this PIN connection.
HP 712/60 PA RISC Desktop Workstation 8.1 HP 712/60 Workstation in AXM Environment The following diagram illustrates the connections required to provide all of the AXM support functionality as described earlier in this section.
Section 9—DAT DRIVE Introduction DAT drive purpose A directly connected Digital Audio Tape (DAT) drive is an optional feature for the AXM. It provides the capability to perform software “Backup” and “Restore” operations without a communication connection over the PIN network. It may also be used for software installation and software updates. This locally connected DAT tape can also be utilized to recover from a catastrophic failure of the coprocessor primary hard drive.
DAT DRIVE 9.1 DAT Drive Indicators 9.1 DAT Drive Indicators DAT indicator definition The DAT drive front panel has two bicolored indicators (left and right). The two colors are green and amber. Green is used to indicate normal conditions, whereas amber is used to indicate that operator intervention is required or that an error has occurred. The table below identifies the possible indicator patterns and the associated definitions.
9.2 9.2 DAT DRIVE Preventive Maintenance Preventive Maintenance DAT head cleaning The DAT drive heads require cleaning: Head cleaning procedure • after every 28 hours of actual operation. • when the “Caution” indicator status on front of the drive is displayed. See the table above for details. The following table provides the procedure for using the DAT cleaning cassette. This cassette is available from Honeywell logistics under the number 51196257-200 (HP 92283K).
DAT DRIVE 9.3 DAT Drive Physical Configuration and Cabling 9.3 DAT Drive Physical Configuration and Cabling DAT SCSI address pinning The SCSI address for the DAT drive must be pinned for an address of 1. The pinning is done in binary fashion as shown at the bottom right of the following diagram. This SCSI address pinning must be checked, and corrected if necessary, when installing a DAT drive as a new option or a replacement drive.
9.3 DAT DRIVE DAT Drive Physical Configuration and Cabling DAT SCSI interface The termination for the coprocessor SCSI bus must be provided by the termination device at the end of the cable when external peripherals are connected to the coprocessor. The DAT drive will always be at the end of the SCSI cable if a DAT exists. The terminator assemblies that provide this function within the DAT drive are mounted immediately above the SCSI interface cable connection.
DAT DRIVE 9.3 DAT Drive Physical Configuration and Cabling DAT option switches Internal DAT drive options are selected by 8 switches located on the bottom of the drive. The connection of the DAT drive to the AXM requires that these switches all be placed in the ON position. See the following diagram. These switches must be checked, and turned on if necessary, when installing a DAT drive as a new option or a replacement drive.
9.3 DAT drive cabling DAT DRIVE DAT Drive Physical Configuration and Cabling The optional DAT drive connection may coexist with an optional CDROM drive connection to the coprocessor. The possible SCSI interface cable connection schemes are illustrated in the following two diagrams. The device connected to the far end of the cable (multidrop) must be the device that provides the SCSI interface termination.
DAT DRIVE 9.3 DAT Drive Physical Configuration and Cabling DAT connection (with CD-ROM) The following diagram illustrates the SCSI cable connections for both an optional AXM connected DAT and optional AXM connected CD-ROM drive. Notice that the optional AXM connected drives consume the entire drive enclosure (both drive positions). The US node in the common station furniture would not be able to have a cartridge drive in this case.
9.4 9.4 DAT DRIVE DAT Replacement DAT Replacement Overview Node power must be turned off for the purpose of changing circuit boards in the AXM node. WARNING Damage can result—Circuit board damage can result if you do not practice proper ESD procedures or attempt to remove/ insert a circuit board with node power applied. CAUTION Mandatory steps—It is mandatory that appropriate software shutdown procedures are followed for the AXM coprocessor prior to removing power from the node.
DAT DRIVE 9.4 DAT Replacement Table 9-3 DAT Replacement Procedure (continued) Step Action 5 Remove the power connector from the rear of the device. 6 Remove SCSI interface cable from the rear of the device. 7 Remove the drive from its mounting hardware. 8 Check that the SCSI address for the new drive is pinned for address 1. Compare to the old drive, if required. 9 Check that the SCSI terminator power pinning is correct (enabled) in the new drive.
Section 10—CD-ROM Drive 10.1 Introduction CD-ROM purpose A directly connected CD-ROM drive is an optional feature for the AXM. It provides the capability to access HP software documentation. Future uses may include installing software and software updates. CD-ROM drive location This optional device is available only if the AXM node is mounted in TDC 3000X console furniture (station) which has sufficient available space to accommodate a DAT drive in the removable media tray (two devices maximum).
CD-ROM Drive 10.2 CD-ROM Physical Configuration and Cabling 10.2 CD-ROM Physical Configuration and Cabling CD-ROM pinning (without DAT drive) The SCSI interface must be terminated by placing termination resistor assemblies at the drive located at the end of the cable (farthest from HDDT I/O board). The following illustration shows the proper pinning (device address 2) and terminators for the CD-ROM when the configuration does not include a DAT drive.
10.2 CD-ROM Drive CD-ROM Physical Configuration and Cabling CD-ROM power Power to the CD-ROM drive is supplied by the AXM node power supply. This is done through a wire harness connected to J9 on the rear of the AXM node backplane. CD-ROM drive SCSI cabling The optional CD-ROM drive connection may coexist with an optional DAT drive connection to the coprocessor. The possible SCSI interface cable connection schemes are illustrated in the following two diagrams.
CD-ROM Drive 10.2 CD-ROM Physical Configuration and Cabling CD-ROM connection (with DAT drive) The following diagram illustrates the SCSI cable connections for an optional AXM connected CD-ROM drive coexisting with an otional AXM connected DAT drive. In this case, the CD-ROM must not have the termination resistors present. The DAT drive will provide the SCSI interface termination. Notice that the optional AXM connected drives consume the entire drive enclosure (both drive positions).
10.3 10.3 CD-ROM Drive CD-ROM Replacement CD-ROM Replacement Overview Node power must be turned off for the purpose of changing circuit boards in the AXM node. WARNING Damage can result—Circuit board damage can result if you do not practice proper ESD procedures or attempt to remove/ insert a circuit board with node power applied. CAUTION Mandatory steps—It is mandatory that appropriate software shutdown procedures are followed for the AXM coprocessor prior to removing power from the node.
CD-ROM Drive 10.3 CD-ROM Replacement Table 10-1 CD-ROM Replacement Procedure (continued) Step Action 5 Remove the power connector from the rear of the device. 6 Remove SCSI interface cable from the rear of the device. 7 Remove the drive from its mounting hardware. 8 Check that the new drive pinning and SCSI terminators are correct. Compare to the old drive, if required. (Note that there is a difference with and without the DAT drive.
Section 11—Spare Parts 11.1 Overview Organization of this section This section lists the field replaceable parts for both versions of AXM node hardware. It is divided into the following categories: • Basic 5-Slot Module (does not include circuit boards). • Basic 10-Slot Module (does not include circuit boards).
Spare Parts 11.2 Basic 5-Slot Module Parts 11.2 Basic 5-Slot Module Parts Basic 5-slot parts list The table on the following page identifies the basic parts for an AXM node in a 5-slot chassis.
11.2 Spare Parts Basic 5-Slot Module Parts Table 11-1 5-Slot Module Parts List for Normal Production Units Assembly Number 3/96 Description Non-CE compliant 51308066-200 Power cord 220 V 50/60 Hz (ergonomic furniture) 51305282-100 Empty card slot filler plate (used in CE compliant notes only) Application ModuleX Service Honeywell Inc.
Spare Parts 11.3 Basic 10-Slot Module Parts 11.3 Basic 10-Slot Module Parts Basic 10-slot parts list The following table identifies the basic parts for an AXM node in a 10-slot chassis. Table 11-2 Basic 10-Slot Module Parts List for Normal Production Units Assembly Number Description CE compliant 51196736-100 Non-CE compliant 10-Slot Module assembly (card file) for rack mounting or classic furniture.
11.4 11.4 Spare Parts LCN Node Processor Parts LCN Node Processor Parts Node processor parts list The following table provides the part numbers for the Node processor components. LCN Node Processor Related boards Parts List Assembly Number Description 51401551-801 K2LCN (with 8 megawords of on-board memory.) 51401551-401 K2LCN (with 4 megawords of on-board memory.
Spare Parts 11.5 Coprocessor and Related Parts 11.5 Coprocessor and Related Parts WSI2 and WSI2 I/O Table 11-3 WSI2 and WSI2 I/O Boards Assembly Number Description 51402083-100 WSI2 Board, includes 64 MHz coprocessor with no memory (requires the appropriate coprocessor memory daughter boards—ordered separately). 51402083-200 WSI2 Board, includes 100 MHz coprocessor with no memory (requires the appropriate coprocessor memory daughter boards—ordered separately).
11.5 Spare Parts Coprocessor and Related Parts The following page contains a table which provides the part numbers for the optional sizes of coprocessor memory and the coprocessor battery Coprocessor memory and battery . ATTENTION Two methods of providing the 32 megabyte and 64 megabyte memory are used depending on memory board availability at the time of manufacture. The possible memory configurations are as follows.
Spare Parts 11.5 Coprocessor and Related Parts Coprocessor console terminal/ modem cables Table 11-6 Coprocessor Console Terminal/Modem Interface Cables Assembly Number 122 Description 51305069-100 Serial Port interface cable (for connecting coprocessor console terminal with 9-pin RS-232 connector). Supplied with initial AXM through the MP-XLLPLK model number. 51196218-300 Optional Serial Port interface cable (for connecting coprocessor console terminal with 25-pin RS-232 connector).
11.6 11.6 Spare Parts Hard Disk Drive Tray and Drive Parts Hard Disk Drive Tray and Drive Parts Tray and drive parts list The following table provides the part numbers for the Hard Disk Drive Tray and the disk drives. Table 11-7 Drive Tray and Related Parts List Assembly Number Description 51402176-100 Hard Disk Drive Tray (includes internal circuit board and drive cables.
Spare Parts 11.7 DAT Tape and Associated Parts 11.7 DAT Tape and Associated Parts Introduction ATTENTION The DAT drive may be mounted in one of three (3) possible cabinet configurations. They are: • Ergonomic furniture Station • Classic furniture Station • Table-top work surface (adjacent to Station containing the AXM node) There are part differences associated with these configurations. Separate parts lists for each possible cabinet arrangement are provided.
11.7 DAT drive in classic furniture station Spare Parts DAT Tape and Associated Parts The following table provides the part numbers for the optional DAT tape drive and its associated parts as it appears in a Classic Furniture style station.
Spare Parts 11.8 CD-ROM and Associated Parts 11.8 CD-ROM and Associated Parts Introduction ATTENTION The CD-ROM drive may be mounted in one of three (3) possible cabinet configurations. They are: • Ergonomic furniture Station • Classic furniture Station • Table-top work surface (adjacent to Station containing the AXM node) There are part differences associated with these configurations. Separate parts lists for each possible cabinet arrangement are provided.
11.8 CD-ROM in classic furniture station Spare Parts CD-ROM and Associated Parts The following table provides the part numbers for the optional CD-ROM and its associated parts as they appear in a Classic furniture style station..
Spare Parts 11.8 CD-ROM and Associated Parts 128 Application ModuleX Service Honeywell Inc.
Index Numerics 1 GB DEC drive SCSI address pinning 59 1 GB DEC drive SCSI termination pinning 60 1 GB Quantum drive option pinning 62, 64 1 GB Seagate Drive 65 1 GB Seagate drive address pinning 66 1 GB Seagate drive termination/parity pinning 67 1 GB Seagate drive unused pinning 68 1.2 GB Quantum Drive (LPS1080S) 61 1.2 GB Quantum Drive (VP31110) 63 1.2 GB Quantum drive (VP31110) SCSI address pinning (address 6) 63 10-Slot board placement 8 1GB Digital Equipment Corp.
Index HMPU Indicators 16 HMPU Processor and Associated Boards 16 HP 712/60 PA RISC Desktop Workstation 97 HP 712/60 Workstation connection 98 HP 712/60 Workstation Documentation 98 HP 712/60 Workstation Service 98 Q QMEM indicators 19 QMEM-X board 19 Quantum 525 MB Drive pinning 53 R K Recommended modem 90 Replacement drives taken from another AXM or UXS 51 Requirements for Coprocessor Console 81 K2LCN hardware version 6 K2LCN indicators 13 K2LCN Pinning 15 K2LCN-X Node Processor 13 S L Spare Parts
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