X Application Module Service AX13-510
Application ModuleX X Application Module Service AX13-510 Release 110/200 CE Compliant 12/01
Copyright, Notices, and Trademarks Copyright 1995-1999 by Honeywell Inc. Revision 05 – December 13, 2001 While this information is presented in good faith and believed to be accurate, Honeywell disclaims the implied warranties of merchantability and fitness for a particular purpose and makes no express warranties except as may be stated in its written agreement with and for its customers. In no event is Honeywell liable to anyone for any indirect, special or consequential damages.
Contents 1. INTRODUCTION............................................................................................................................. 7 1.1 About This Document ............................................................................................................... 7 1.2 References ................................................................................................................................. 8 X 2. APPLICATION MODULE .............................................
Contents 5.12 HDDT I/O Board ....................................................................................................................91 5.13 Disk Drive/Drive Tray Replacement....................................................................................92 5.14 HDDT I/O Board Replacement.............................................................................................95 6. COPROCESSOR CONSOLE ..................................................................................
Tables Tables Table 2-1 Five-Slot Chassis Board Locations (32/64/128 MB Coprocessor Memory Sizes) ................. 13 Table 2-2 Five-Slot Chassis Board Locations (with 256 MB Coprocessor Memory).............................. 14 Table 2-3 Ten-Slot Chassis Board Locations ......................................................................................... 15 Table 2-4 Ten-Slot Chassis Board Locations (with 256 MB Coprocessor Memory) .............................. 15 Table 3-1 K2LCN Board Indicators ...
Tables vi Application ModuleX Service Honeywell 12/01
1. Introduction 1.1 About This Document Basics Purpose This manual provides instructions for maintenance and repair of X the Application Module . Intended All personnel that are expected to perform hardware installation, Audience troubleshooting, and repair activities on the Application ModuleX. For Product This publication supports TotalPlant Solution (TPS) system Release software release 500 and later, and CE Compliant hardware.
Introduction – References 1.
2. Application ModuleX 2.1 AXM Functionality General introduction Supports existing AM functionality 12/01 The Application ModuleX (AXM) provides the functionality of a standard Application Module (AM) coupled with an HP-UX-based coprocessor. This hardware combination provides the capability for delivering powerful higher level control schemes to the TDC 3000X. It also provides the capability of adapting and utilizing third party control solutions. Two performance levels of the coprocessor are available.
Application ModuleX – AXM Functionality Functionality Diagram The following diagram illustrates that there are two distinct processors in the AXM node. A standard LCN node processor is coupled to an HPUX-based coprocessor. The total AXM software responsibility of both processors is identified by the dotted lines. Notice that both processors must work through their respective portions of the communication software to successfully pass information between them.
Application ModuleX – Hardware Organization 2.2 Hardware Organization AXM Hardware block diagram Two versions of AXM hardware will be available. One uses the K2LCN (or K4LCN) board as the LCN node processor and the other uses the HMPU/ LLCN/QMEM combination of boards as the LCN node processor. The diagrams on the following two pages show the major hardware components that make up the AXM hardware.
Application ModuleX – Hardware Organization K2LCN/K4LCN hardware version Local Control Network (LCN) A B CLCN A/B I/O * Plant Information Network (PIN) WSI2 I/O HDDT I/O Backplane Connection CLCN A/B I/O * HDDT SCSI Interface Cable Plant Information Network (PIN) DAT Drive (Optional) Connection for Console Terminal or TAC Access Modem WSI2 I/O Backplane Connection LLCN HMPU LCN Interface Node Processor QMEM Additional Memory (For HMPU) WSI2 Coprocessor * Non-CE compliant nodes use an LCN I/O
Application ModuleX – Board Slot Definition 2.3 Board Slot Definition Overview of chassis types Five-Slot board placement The AXM will appear in two types of LCN node hardware chassis. They are Five-slot chassis (when using a K2LCN/K4LCN node processor) Ten-slot chassis (when using an HMPU node processor)—This specific Ten-slot chassis has a split backplane with 6 slots (bottom) dedicated to one LCN node and 4 slots (top) for another LCN node.
Application ModuleX – Board Slot Definition Table 2-2 Five-Slot Chassis Board Locations (with 256 MB Coprocessor Memory) Slot 5 Front Hard Disk Drive Tray (occupies two slots) 4 3 HDDT I/O (Space for extra WSI2 Memory) WSI2 * 2 1 Rear WSI2 I/O K2LCN-8 or K4LCN-8 ( or -16) CLCN A/B or LCN I/O ** * Two versions of the WSI2 board are available to provide the 64 MHz and 100 MHz coprocessors. ** Non-CE Compliant versions use the LCN I/O.
Application ModuleX – Board Slot Definition Table 2-3 Ten-Slot Chassis Board Locations Slot Front 10 Unusable slot 9 Unusable slot 8 Hard Disk Drive Tray 7 (occupies two slots) 6 WSI2 * 5 Optional Application board 4 Optional memory board 3 QMEM-4 2 LLCN 1 HMPU Rear HDDT I/O WSI2 I/O CLCN A/B or LCN I/O ** * Two versions of the WSI2 board are available to provide the 64 MHz and 100 MHz coprocessors. ** Non-CE Compliant versions use the LCN I/O.
Application ModuleX – Power Supply 2.4 Power Supply The AXM node contains a power supply (55 amp) that is used in many other LCN node types. It is capable of producing output voltage margins of +5% and -5% that, in some cases, are used in factory test and troubleshooting activities. This margining is controlled by the jumper on the face of the power supply. See the following diagram. Similar power supplies are used in both the K2LCN/K4LCN (Five-slot) and HMPU (Ten-slot) versions of AXM.
3. Hardware Description of LCN Node Processors 3.1 K2LCN-X Node Processor Overview K2LCN indicators The K2LCN processor board contains all of the essential parts to make up the kernel portion of any LCN node. It includes a 68020 processor, LCN interface circuits, and 6 or 8 megawords of on-board memory (for AXM). It does not have floating point calculation hardware capability. The exact memory size is determined by which option is purchased. A minimum of 6 megawords is required to support R500 software.
Hardware Description of LCN Node Processors – K2LCN-X Node Processor The indicators on the latest production K2LCN borad, assembly 51402615-x00, are shown in the following illustration.
Hardware Description of LCN Node Processors – K2LCN-X Node Processor The following table provides descriptions of the indicators on the K2LCN board. Reference the preceding diagrams. Indicator description Table 3-1 K2LCN Board Indicators LED Description Suspected cause if abnormal Self-Test Pass On after board passes self-test. Normally on. K2LCN TX On when transmitting on the LCN. Normally on or flashing rapidly.
Hardware Description of LCN Node Processors – K2LCN-X Node Processor K2LCN Pinning The K2LCN board has an LCN node number pinning feature on the board itself. This feature is duplicated on the CLCN A/B I/O or LCN I/O board that is installed directly behind the K2LCN board in the AXM Five-Slot Module chassis. ATTENTION The address pinning jumpers must all be removed from the K2LCN board when it is used in conjunction with an CLCN A/B I/O (or LCN I/O) board.
Hardware Description of LCN Node Processors – K2LCN-X Node Processor NOTE: This text is not on the board. Binary Weight Parity 5 6 P TS2 64 3 4 32 9C 16 0 1 2 8 9D 4 2 1 9F 9H Jumper Removed = "1" K2LCN 40002 6 P Binary Weight Parity NOTE: This text is not on the board.
Hardware Description of LCN Node Processors – K4LCN-X Node Processor 3.2 K4LCN-X Node Processor Overview The K4LCN processor board contains all of the essential parts to make up the kernel portion of any LCN node. It includes a 68040 processor, LCN interface circuits, and 8 or 16 megawords of on-board memory (for the AXM). It has floating point calculation hardware capability. The exact memory size is determined by which memory option is purchased.
Hardware Description of LCN Node Processors – K4LCN-X Node Processor Memory Board K4LCN LCN Address Pinning ASSY. NO.
Hardware Description of LCN Node Processors – K4LCN-X Node Processor K4LCN indicators The K4LCN board indicators are visible at the free edge of the board while it is installed in the module chassis. They provide visual indication of the existing conditions of the board. See the illustration below.
Hardware Description of LCN Node Processors – K4LCN-X Node Processor Table 3-2 K4LCN Board Indicators LED Description Suspected cause if abnormal Self-Test Pass On after board passes self-test. Normally on. K4LCN TX On when transmitting on the LCN. Normally on or flashing rapidly. K4LCN RST/PWR fail On when a reset operation caused by the reset button or power on is in progress. Normally off. K4LCN Self-Test Error On to indicate a board self-test error. Normally off.
Hardware Description of LCN Node Processors – K4LCN-X Node Processor K4LCN Pinning The K4LCN board has an LCN node number pinning feature on the board itself. This feature is duplicated on the CLCN A/B I/O or LCN I/O board that is installed directly behind the K4LCN board in the AXM Five-Slot Module chassis. ATTENTION The address pinning jumpers must all be removed from the K4LCN board when it is used in conjunction with a CLCN A/B I/O (or LCN I/O) board.
Hardware Description of LCN Node Processors – K4LCN-X Node Processor K4LCN Memory Memory for the K4LCN board is provided by a vertically pluggable daughter board on the early production K4LCN board, assembly 51401946-100, and a horizontally pluggable DIMM (Dual Iline Memory Module) style mezzanine board on the latest production K4LCN board, assembly 51402755-100. The memory daughter board is also sometimes referred to as a mezzanine board.
Hardware Description of LCN Node Processors – K4LCN-X Node Processor Memory Board K4LCN LCN Address Pinning ASSY. NO.
Hardware Description of LCN Node Processors – HMPU Processor and Associated Boards 3.3 HMPU Processor and Associated Boards Overview The HMPU node processor has a 68020 microprocessor and includes floating point calculation hardware capability. It also has 2 megawords of on-board memory. Additional memory for the HMPU processor in the AXM node is provided by a QMEM board. A minimum of 6 megawords is required to support R500 software.
Hardware Description of LCN Node Processors – HMPU Processor and Associated Boards The following table gives a description of the indicators on the HMPU board. Reference the preceding diagram. Indicator description Table 3-3 HMPU Error Indicators LED Description Suspected cause if abnormal Pass Module Test On after board passes self-test. Normally on. HMPU RST/PWR Fail On when a reset operation caused by the reset button or power on is in progress. Normally off.
Hardware Description of LCN Node Processors – HMPU Processor and Associated Boards LLCN board functionality LLCN board indicators The LLCN board provides the LCN interface functionality used by the HMPU node processor. The actual connection to the LCN cables is through the CLCN A/B I/O (or LCN I/O) board which is inserted in the I/O card chassis immediately behind the LLCN board (same board slot). The LCN node address is pinned on the CLCN A/B I/O (or LCN I/O) board and is covered later in this section.
Hardware Description of LCN Node Processors – HMPU Processor and Associated Boards LLCN indicator description The following table gives a description of the indicators on the LLCN board. Reference the preceding diagram. Table 3-4 LLCN Indicators LED Description Suspected cause if abnormal Self-Test/Error On to indicate a board self-test error. Normally off. LLCN Pass module test On after board passes self-test. Normally on.
Hardware Description of LCN Node Processors – HMPU Processor and Associated Boards QMEM indicators The QMEM board indicators are visible from the free edge of the board while it is installed in a chassis. They provide visual indications regarding the existing conditions on the board. An illustration is provided below. QMEM-X Pass Mod Test QMEM indicator description Data Par Sing Bit MULT 40025 The following table gives a description of the QMEM indicators. Reference the preceding diagram.
Hardware Description of LCN Node Processors – CLCN A/B I/O Board (or LCN I/O Board) 3.4 CLCN A/B I/O Board (or LCN I/O Board) Overview This board provides the physical interface to the LCN cables. It is used with both versions of node processors (K2LCN/K4LCN and HMPU). The AXM LCN address pinning feature for defining the LCN physical node number is located on this board. These address jumpers must be properly configured at the time of hardware installation.
Hardware Description of LCN Node Processors – CLCN A/B I/O Board (or LCN I/O Board) LCN cable connections The AXM node processor is connected to the LCN cable network. These LCN cables (A and B) are connected to the CLCN A/B I/O (or LCN I/O) board as shown in the following diagram. This cabling scheme is the same for each LCN node that uses the CLCN A/B I/O (or LCN I/O) board.
Hardware Description of LCN Node Processors – Node Processor Related Board Replacement 3.5 Node Processor Related Board Replacement Overview Node power must be turned off for the purpose of changing circuit boards in the AXM node. WARNING Damage can result—Circuit board damage can result if you do not practice proper ESD procedures or attempt to remove/ insert a circuit board with node power applied.
4. Hardware Description of Coprocessor 4.1 WSI2 Board Description Overview WSI2 board illustration The basic WSI2 board contains the coprocessor interface circuits required to adapt the coprocessor into the AXM node hardware. Reference the diagram below. A coprocessor daughter board connects to the WSI2 mother board through a specially provided connector on the WSI2 board. Several small cables are also used to complete the total coprocessor to WSI2 board connections.
Hardware Description of Coprocessor – WSI2 Board Description WSI2 Board indicators (LEDs) and switch The diagram below shows two indicators and a switch at the left. These are the WSI2 board indicators. These indicators are directly visible with the chassis front cover in place. The indicators are described as follows: • Transaction error (red LED) Indicates that a data parity error or bus error was encountered during normal operation on the backplane module bus.
Hardware Description of Coprocessor – WSI2 Board Description WSI2 board indicators The diagram below describes the indicators on the WSI2 mother board. The coprocessor daughter board portion is covered later in this section. WSI2 Board Indicators Model 743 PS/2 1 A B R S 2 3 2 PS/2 0 V A A U I / V I D S C S I Boot... Model 743 H Run... P P a r a l l e l Abt. Sys. Fail Rst.
Hardware Description of Coprocessor – WSI2 Board Description Calender clock battery Coprocessor battery location The coprocessor contains a time of day clock circuit which has a battery backup. The clock circuits are maintained by this battery whenever node power is removed. This battery has a very long life (years), but it will eventually have to be replaced. Note the location of this battery on the coprocessor daughter board shown in the diagram below. It is a separately listed item in the parts list.
Hardware Description of Coprocessor – WSI2 Board Description Coprocessor memory The coprocessor, which plugs into the WSI2 board, itself can have one or more daughter boards. These are the coprocessor memory boards. The diagram below illustrates the position of these boards. The coprocessor memory can be upgraded in the field by changing these boards. The coprocessor memory daughter boards are mounted with two Phillips screws threaded into standoffs on the coprocessor board.
Hardware Description of Coprocessor – WSI2 Board Description Coprocessor memory option (32 megabytes) The following two illustrations show the two methods of providing the minimum 32 megabyte memory option in position on the coprocessor board. Memory board availability at the time of manufacture will determine which method is used.The first method consists of two 16 megabyte boards.
Hardware Description of Coprocessor – WSI2 Board Description Coprocessor memory option (64 megabytes) The following two illustrations show the two methods of providing the 64 megabyte memory option in position on the coprocessor board. Memory board availability at the time of manufacture will determine which method is used.The first method consists of two 32 megabyte boards.
Hardware Description of Coprocessor – WSI2 Board Description Coprocessor memory option (128 megabyte) The illustration below shows the 128 megabyte memory option in position on the coprocessor board.
Hardware Description of Coprocessor – WSI2 Board Description Coprocessor memory option (265 megabyte) The illustration below shows the 256 megabyte memory option in position on the coprocessor board. Notice that there are two 64 megabyte memory daughter boards stacked in two locations. The 64 megaword memory daughter boards (4 each) make up 256 megabytes of total memory. The stacking of these memory daughter boards requires additional clearence on the top side of the WSI2 board.
Hardware Description of Coprocessor – WSI2 Board Description • Boot/Run—(Green indicator) Blinks during the boot process and turns on (steady) when the boot is completed. • SCSI—It is the interface used for connecting the coprocessor SCSI (disk drive) interface to the disk drive tray through a cable. • AUI/VID-A—Provides the interface to the Plant Information Network (PIN). The PIN is Honeywell’s terminology for the Local Area Network (LAN). • RS-232-A—Commonly referred to as Serial Port 1.
Hardware Description of Coprocessor – WSI2 Board Description Coprocessor PIN connection details The coprocessor is connected to the PIN network as shown in the diagram. The PIN connection is made at the coprocessor free edge.
Hardware Description of Coprocessor – WSI2 Board Description Coprocessor SCSI interface details The coprocessor SCSI (hard disk drive) interface connection is made at the coprocessor board free edge. From there it is routed: • Through a cable to the Hard Disk Drive tray (HDDT) internal circuit board, • Through the internal HDDT circuit board to disk drive interface cables and also through the backplane to the HDDT I/O board, • Through the HDDT I/O board to a cable connector.
Hardware Description of Coprocessor – WSI2 Board Description License key Honeywell provides the appropriate Kinet license key (correlated to the coprocessor hardware identification number) to the customer with the Kinet software at the time of shipment. The customer must enter this provided license key into the Kinet software configuration data. Replacement of a WSI2 board assembly due to failure (or any other reason) also changes the hardware identification number.
Hardware Description of Coprocessor – WSI2 I/O Board Description The Honeywell license key information (correlated to the Internet Protocol address) is obtained from Honeywell prior to system installation. The customer creates a license file based on this information. This license file is not affected by replacement of a WSI2 board assembly. This activity is not required for AXM R110. 4.2 WSI2 I/O Board Description The WSI2 I/O board provides the coprocessor connection to the PIN (LAN) network.
Hardware Description of Coprocessor – Media Access Unit (MAU) Description End View Top View LTX-2 Thin Coax Transceiver IEEE 802.3 10Base2 To Coprocessor (WSI2 I/O) 1 0 RCV RCV HBE To PIN (Ethernet) HBE LANTRONIX Heartbeat Power HBE Switches 1 0 PWR Indicators Media Access unit indicators 40044 Many of the MAU devices have indicators on them. The following indicator and switch explanation is specifically for the MAU shown in the previous diagram.
Hardware Description of Coprocessor – Media Access Unit (MAU) Description Media Access Unit connection The following WSI2 I/O diagram identifies the MAU connection (J6). Power is supplied to the MAU from the WSI2 I/O board through the interface cable. BAR CODE ASSY NO.
Hardware Description of Coprocessor – WSI2 Board Replacement 4.4 WSI2 Board Replacement Overview Node power must be turned off for the purpose of changing circuit boards in the AXM node. WARNING Damage Can Result—Circuit board damage can result if you do not practice proper ESD procedures or attempt to remove/insert a circuit board with node power applied.
Hardware Description of Coprocessor – WSI2 Board Replacement WSI2 Board Replacement Procedure Table 4-3 WSI2 Board Replacement Procedure Step Action 1 Turn off the power using the switch on the node power supply. 2 Disconnect the SCSI interface cable from the coprocessor free edge. (It runs between the WSI2 and the drive tray above it.) This may require removal of an additional cable to gain access (PIN interface). Note the position of both cables as you remove them.
Hardware Description of Coprocessor – WSI2 Board Replacement Table 4-3 WSI2 Board Replacement Procedure Step 12 Action Having obtained the new hardware identification number, call the Honeywell Technical Assistance Center (TAC), using telephone number 800-822- 7673. Inform them that you have changed your Application Module coprocessor hardware and give them the new hardware identification number.
Hardware Description of Coprocessor – WSI2 I/O Board replacement 4.5 WSI2 I/O Board replacement Overview Node power must be turned off for the purpose of changing circuit boards in the AXM node. WARNING Damage Can Result—Circuit board damage can result if you do not practice proper ESD procedures or attempt to remove/insert a circuit board with node power applied.
Hardware Description of Coprocessor – WSI2 I/O Board replacement WSI2 I/O Board Replacement Procedure Table 4-4 WSI2 I/O Board Replacement Procedure Step 12/01 Action 1 Turn off the power using the switch on the node power supply. 2 Disconnect the cables from the WSI2 I/O board. Pay attention to the marking on the cables. These cables must be returned to their appropriate positions after installing the new board. 3 Remove the board using the two screws which secure the faceplate to the chassis.
Hardware Description of Coprocessor – WSI2 I/O Board replacement 58 Application ModuleX Service Honeywell 12/01
5. Hard Disk Drive Tray 5.1 Drive Tray Description Overview Hard disk drive tray (front view) The Hard Disk Drive Tray (HDDT) contains the coprocessor hard disk drive(s). A maximum of two drives can exist in this tray. The primary (first) drive is always mounted on the right side. This is done for cooling reasons and must be adhered to in all cases. This drive will always have device address 6 (physical pinning). An optional second drive is mounted on the left side.
Hard Disk Drive Tray – Drive Tray Description Disk drive physical placement and connections Hard disk drive tray (rear view) The diagram below shows the drive tray from the opposite end when compared to the diagram above. Notice the following: • Physical position of each drive • Drive tray internal circuit board • SCSI interface ribbon cable for each drive Disk drives currently originate from several different manufacturing sources.
Hard Disk Drive Tray – Drive Tray Description Drive connection detail The following illustration gives greater detail to show the drive SCSI interface cable and power harness. Power Harness SCSI Interface Cable Drive mounting details 51170 The following illustration gives the drive mounting hardware detail. All four mounting screws (one at each corner of the drive) are identical.
Hard Disk Drive Tray – Drive Tray Description Disk drives Several types of disk drives are available for use in the drive tray. The following table identifies the drive types currently available. The drives of the same capacity (although from different manufacturers) are functionally the same. An order for a specific size spare drive will be filled with one from a vendor listed in the following table.
Hard Disk Drive Tray – Drive Tray Description Considerations for ordering replacement drives Replacement drives taken from X another A M or X U S 12/01 The only thing to consider when ordering a replacement disk drive is drive capacity. The spare drive is supplied properly formatted, but without HP-UX software.
Hard Disk Drive Tray – Drive Tray Description If the primary drive is replaced by a drive that was the second drive on another system, the appropriate recovery procedure must be used to boot operating software from an alternate boot source such as a DAT drive. This DAT drive may be locally connected or accessible over the network. A complete software restore is required to get the coprocessor file structure to reflect conditions existing prior to drive replacement.
Hard Disk Drive Tray – 525 MB Quantum Disk Drive (LPS525S) 5.2 525 MB Quantum Disk Drive (LPS525S) Introduction The diagram shows a 525 MB Quantum drive. Notice the identified parts. Busy Indicator (LED) Drive Pinning Locations 525 MB Quantum drive pinning 40030 The only pinning that should be required is the SCSI interface device address. The drive on the right of the tray is always address 6 and the optional drive on the left is always address 5.
Hard Disk Drive Tray – 525 MB Quantum Disk Drive (LPS525S) The following diagram is the same as the previous diagram with the exception of the device address pinning (address 5).
Hard Disk Drive Tray – 525 MB Seagate Drive (ST3600N) 5.3 525 MB Seagate Drive (ST3600N) Introduction The diagram shows a 525 MB Seagate drive. Drive Pinning Locations SCSI Interface Connector Power Connector 40033 525 MB Seagate drive address pinning The pinning to define the device address on the SCSI interface bus must be done. The drive on the right of the tray is always pinned for address 6 and the optional drive on the left is always pinned for address 5.
Hard Disk Drive Tray – 525 MB Seagate Drive (ST3600N) The following diagram is the same as the previous diagram with the exception of address 5 instead of 6.
Hard Disk Drive Tray – 525 MB Seagate Drive (ST3600N) 525 MB Seagate drive SCSI interface termination The Seagate drives have the capability to provide termination for the SCSI interface cable. This feature is not needed for the AXM application since a terminator is placed at the end of the SCSI cable network on the HDDT I/O board. The diagram illustrates the missing termination resistor modules on the drive. Replacement drives may have these resistor modules in place. Remove them if they are present.
Hard Disk Drive Tray – 525 MB Seagate Drive (ST3600N) 525 MB Seagate drive termination/ parity pinning Both drives 5 and 6 should have these options pinned as illustrated in the diagram.
Hard Disk Drive Tray – 525 MB Seagate Drive (ST3600N) 525 MB Seagate drive unused pinning There are no option jumpers required in this location as illustrated in the diagram. This applies to both possible drives in the disk tray.
Hard Disk Drive Tray – GB Digital Equipment Corp. Drive (DSP3107L) 5.4 GB Digital Equipment Corp. Drive (DSP3107L) Introduction The diagram shows a 1.2 GB Digital Equipment Corporation disk. The drive is shown upside down. Notice the identified pinning locations and indicators. Device Pinning Locations Busy (LED) Fault (LED) 40045 1.2 GB DEC drive SCSI address pinning (address 6) The illustration below shows the proper drive pinning for SCSI address 6.
Hard Disk Drive Tray – GB Digital Equipment Corp. Drive (DSP3107L) 1.2 GB DEC drive SCSI address pinning (address 5) The illustration below is identical to the previous diagram with the exception of SCSI address 5. Busy (LED) Fault (LED) (Under Board) Option Pinning 10 9 8 7 6 5 3 4 21 20 21 22 SCSI Address 5 40060 1.2 GB DEC drive SCSI termination pinning The SCSI termination pinning options provided on the drive are not used in the AXM. They should all be removed if they are present.
Hard Disk Drive Tray – GB Quantum Drive (LPS1080S) 5.5 GB Quantum Drive (LPS1080S) Introduction The diagram below illustrates the 1.2 GB Quantum disk drive. The drive is shown upside down. Notice the identified pinning locations and “Busy” indicator. Busy Indicator (LED) Drive Pinning Locations 1.2 GB Quantum drive SCSI address pinning (address 6) 40030 The diagram below identifies the pinning required for SCSI address 6.
Hard Disk Drive Tray – GB Quantum Drive (LPS1080S) SCSI address pinning (address 5) The diagram below is identical to the one above with the exception for the SCSI address 5. LED SCSI Address 5 20 21 22 40063 1.2 GB Quantum drive option pinning The following diagram illustrates the drive option pinning for use in the AXM. Both drives must have the options pinned as shown.
Hard Disk Drive Tray – GB Quantum Drive (VP31110) 5.6 GB Quantum Drive (VP31110) Introduction The diagram below illustrates the 1.2 GB Quantum (VP31110) disk drive. The drive is shown upside down. Notice the identified pinning locations and “Busy” indicator. SCSI Terminator Location (Not Used) 10 9 8 7 6 5 4 1 3 2 20 21 22 Option Pinning Busy (LED) 1.
Hard Disk Drive Tray – GB Quantum Drive (VP31110) SCSI address pinning (address 5) The diagram below is identical to the one above with the exception for the SCSI address 5. SCSI Terminator Location (Not Used) 10 Option Pinning Busy (LED) 1.2 GB Quantum drive (VP31110) option pinning Fault (LED) 9 6 8 7 5 4 3 2 1 20 21 22 Option Pinning SCSI Address 5 54379 The following diagram illustrates the drive option pinning for use in the AXM. Both drives must have the options pinned as shown.
Hard Disk Drive Tray – GB Seagate Drive (ST31200) 5.7 GB Seagate Drive (ST31200) Introduction The diagram shows a 1.2 GB Seagate drive. The drive is shown upside down. Notice the identified pinning locations and SCSI terminator resistor module locations.
Hard Disk Drive Tray – GB Seagate Drive (ST31200) 1.2 GB Seagate drive address pinning The pinning to define the device address on the SCSI interface bus must be done. The drive on the right of the tray is always pinned for address 6 and the optional drive on the left is always pinned for address 5. The following diagram illustrates the pinning for address 6. Notice that the drive is shown upside down.
Hard Disk Drive Tray – GB Seagate Drive (ST31200) 1.2 GB Seagate drive termination/ parity pinning Both drives 5 and 6 should have these options pinned as illustrated in the diagram.
Hard Disk Drive Tray – GB Seagate Drive (ST31200) 1.2 GB Seagate drive unused pinning There are no option jumpers allowed in this location as illustrated in the diagram.
Hard Disk Drive Tray – 2 GB Quantum Drive (VP32210) 5.8 2 GB Quantum Drive (VP32210) Introduction The diagram below illustrates the 2 GB Quantum (VP32210) disk drive. The drive is shown upside down. Notice the identified pinning locations and “Busy” indicator.
Hard Disk Drive Tray – 2 GB Quantum Drive (VP32210) SCSI address pinning (address 5) The diagram below is identical to the one above with the exception for the SCSI address 5. SCSI Terminator Location (Not Used) 10 Option Pinning Busy (LED) 2 GB Quantum drive (VP32210) option pinning Fault (LED) 9 6 8 7 5 4 3 2 1 20 21 22 Option Pinning SCSI Address 5 54379 The following diagram illustrates the drive option pinning for use in the AXM. Both drives must have the options pinned as shown.
Hard Disk Drive Tray – 2 GB Seagate Drive (ST32430N) 5.9 2 GB Seagate Drive (ST32430N) Introduction The diagram below illustrates the 2 GB Seagate (ST23430N) disk drive. The drive is shown upside down. Notice the identified pinning locations and “Busy” indicator.
Hard Disk Drive Tray – 2 GB Seagate Drive (ST32430N) SCSI address pinning (address 5) The diagram below is identical to the one above with the exception for the SCSI address 5. Option Pinning Busy (LED) Option Pinning 3 1 2 Additional Pinning 45 6 7 8 0 91 Cover (leave in place) 22 21 20 Option Pinning 2 GB Seagate drive (ST32430N) option pinning SCSI Address 5 54376 The following diagram illustrates the drive option pinning for use in the AXM.
Hard Disk Drive Tray – 2 GB Hewlett Packard Drive (C3325A) 5.10 2 GB Hewlett Packard Drive (C3325A) Introduction The diagram below illustrates the 2 GB Hewlett (C3325A) disk drive. The drive is shown upside down. Notice the identified pinning locations and “Busy” indicator.
Hard Disk Drive Tray – 2 GB Hewlett Packard Drive (C3325A) 2 GB HP drive SCSI address pinning (address 6) The diagram below identifies the pinning required for SCSI address 6.
Hard Disk Drive Tray – 2 GB Hewlett Packard Drive (C3325A) SCSI address pinning (address 5) The diagram below is identical to the one above with the exception for the SCSI address 5. Option Pinning Additional Pinning 12 9 10 11 8 7 6 5 4 3 2 1 Option Pinning 2 2 1 2 20 Activity (LED) 2 GB HPdrive (C3325A) option pinning SCSI Address 5 54382 The following diagram illustrates the drive option pinning for use in the AXM.
Hard Disk Drive Tray – 4 GB Seagate Drive (ST34572N) 5.11 4 GB Seagate Drive (ST34572N) 4 GB Seagate drive (ST34572N) SCSI pinning (address 6) 12/01 The diagram below illustrates the pinning for address 6 with no termination.
Hard Disk Drive Tray – 4 GB Seagate Drive (ST34572N) 4 GB Seagate drive (ST34572N) SCSI pinning (address 5) 90 The diagram below illustrates the pinning for address 5 with no termination.
Hard Disk Drive Tray – HDDT I/O Board 5.12 HDDT I/O Board Description The HDDT I/O board interfaces with the Hard Disk Drive Tray through the module backplane. The coprocessor SCSI (disk drive) interface normally stops at connector J1. If an optional DAT tape or CD-ROM device exists on your AXM, one end of the daisy-chain device interface cable connects to J1 of the HDDT I/O board. The device at the far end of this cable must be pinned to provide the SCSI interface termination.
Hard Disk Drive Tray – Disk Drive/Drive Tray Replacement 5.13 Disk Drive/Drive Tray Replacement Overview Node power must be turned off for the purpose of removing the disk drive tray from the AXM node. WARNING Damage Can Result—Circuit board damage can result if you do not practice proper ESD procedures or attempt to remove/insert a circuit board with node power applied.
Hard Disk Drive Tray – Disk Drive/Drive Tray Replacement Table 5-2 Drive Tray/Disk Drive Replacement Procedure Step Action 1 Determine if the primary or optional second disk drive is to be replaced. 2 If it is the optional second drive that is to be replaced, use the proper software command to unmount the drive (umount). 3 Perform a coprocessor software shutdown using the appropriate software command. X Reference:>>A M System Administration manual , Shutting down HP-UX (Section 3.5).
Hard Disk Drive Tray – Disk Drive/Drive Tray Replacement A coprocessor software recovery activity must be performed at this point. The work to be done differs depending on which hard drive was replaced. If the primary drive is replaced with a spare from Honeywell logistics (formatted but no data files), the operating software is no longer available for boot purposes. This requires special procedures to boot from a local DAT drive or from a DAT drive accessed over the PIN network.
Hard Disk Drive Tray – HDDT I/O Board Replacement 5.14 HDDT I/O Board Replacement Overview Node power must be turned off for the purpose of changing circuit boards in the AXM node. WARNING Damage Can Result—Circuit board damage can result if you do not practice proper ESD procedures or attempt to remove/insert a circuit board with node power applied.
Hard Disk Drive Tray – HDDT I/O Board Replacement HDDT I/O Board Removal/ Replacement Procedure Table 5-3 HDDT I/O Board Replacement Procedure Step 96 Action 1 Turn off power using the switch on the node power supply. 2 Disconnect the item connected to J1 on the HDDT I/ O board. This is the SCSI interface cable to the optional DAT/CD-ROM devices if they exist. It is a terminator assembly if the optional devices do not exist.
6. Coprocessor Console 6.1 Overview Requirements for coprocessor console A console terminal connection to the coprocessor Serial Port 1 is required to initially configure the coprocessor software in PIN connected AXMs. This (terminal) will serve as a “console” to the coprocessor HPUX software environment. The fundamental coprocessor software configuration task is to make the AXM conversant with appropriate other nodes on the PIN (LAN).
Coprocessor Console – Overview • Ensure the terminal emulation software is activated (if using a personal computer or HP 712/60 PA-RISC workstation or UXS) to perform the coprocessor console operations through serial port 1 of the AXM coprocessor. • Initiate communications using the keyboard on the terminal. The usage of this console terminal is defined in the procedures provided in the AXM System Administration and AX M Troubleshooting manuals.
Coprocessor Console – Coprocessor Terminal Description and Configuration 6.2 Coprocessor Terminal Description and Configuration Recommended terminal Required terminal options 12/01 Honeywell recommends the Digital Equipment Corporation (DEC) VT100 terminal (or any simple terminal with equivalent functionality) for use as a “console” terminal connected to the coprocessor. This terminal is needed for initial configuration of PIN connected AXMs and for troubleshooting coprocessor related problems.
Coprocessor Console – Coprocessor Console Terminal Connection 6.3 Coprocessor Console Terminal Connection Overview A direct connect interface cable must be connected between the coprocessor console terminal device and the WSI2 I/O board (Serial Port 1). Several different devices can be used to provide this coprocessor console connection. The following diagram illustrates this.
Coprocessor Console – Coprocessor Console Terminal Connection Coprocessor console terminal interface cable schematic Examples of the direct connect terminal interface cable wiring details are shown in the following diagrams. Notice that two cable types are described. One is a 9 to 25 pin direct connect cable and the other is a 9 to 9 pin direct connect cable. The 9 to 25 pin cable (in the first diagram ) is available from Honeywell logistics using the part number 51196218-300.
Coprocessor Console – Coprocessor Console Terminal Connection 9 to 9 pin cable AX M (WSI2 I/O Board J1) Coprocessor Console Terminal (RS-232 Port) 1 2 3 "X" End 4 5 6 7 8 9 Female 1 2 3 4 5 "Y" End 6 7 8 9 Female Outer Shield Pinning Table "X" End "Y" End 1 7&8 2 3 3 2 4 6 5 5 6 4 7 1 8 1 9 9 Shield Shield 40070 Note: The dashed lines shown in the 9 to 9 cable diagram above are required connections.
Coprocessor Console – Coprocessor Console Terminal Connection Table 6-1 Terminal Connection Procedure Step Action 1 Make sure the terminal is properly configured (switches/jumpers/etc.). 2 Connect the direct connect terminal interface cable to the terminal. See the diagram following this table for the proper connection (depends on which device you are using as the console terminal). 3 Connect the terminal interface cable to the WSI2 I/O board connector for Serial Port 1 (connector J1).
Coprocessor Console – Coprocessor Console Terminal Connection X Note: The cable connection to the U S is different depending on if it is Release X 100 or 200 hardware. The U S-100 connection is to the WSI I/O board J2 X (normally used for printer). The U S-200 connection is to the WSI2 I/O board J1 X (normally used for U S coprocessor console terminal). The following table defines the different cable types available for connecting coprocessor terminals.
7. TAC Access to Coprocessor 7.1 Overview TAC support for coprocessor problems The Technical Assistance Center (TAC) has the capability of providing assistance with troubleshooting coprocessor related problems. Troubleshooting some problems may require direct access to the coprocessor. A telephone communications link must be connected to the coprocessor to allow direct access from TAC. The diagram below illustrates this communications link.
TAC Access to Coprocessor – Overview Overview of activities to enable TAC access 106 There are several distinct tasks required to establish the TAC communications link to the coprocessor. • Configure the modem options using switches and internal registers. • Connect the modem to the WSI2 I/O board. • Connect the modem to a switched (dialable) telephone line. • The coprocessor software defaults to the proper configuration of Serial Port 1 and no coprocessor configuration actions are required.
TAC Access to Coprocessor – Communications Modem Description and Configuration 7.2 Communications Modem Description and Configuration Recommended modem Modem configuration switches Honeywell recommends the following modem for the TAC access communications link. U.S. Robotics Sportster 9600 This is a commercially available device and is not supplied by Honeywell. The configuration switches and registers for this modem are given later in this section. Other modems that are fully compatible with the U. S.
TAC Access to Coprocessor – Communications Modem Description and Configuration Modem configuration registers Terminal requirements for setting modem configuration registers 108 The internal configuration registers of the U.S. Robotics Sportster 9600 modem must be properly loaded to finish the modem configuration task. This is done by connecting a terminal to the modem and then entering the required configuration data into the registers. The configuration data for the U.S.
TAC Access to Coprocessor – Communications Modem Description and Configuration Required modem configuration register data The following table contains the required configuration register data to make it support the TAC access connection. Table 7-2 U.S.
TAC Access to Coprocessor – Modem Connection 7.3 Modem Connection Overview An interface cable must be connected between the optional modem and the WSI2 I/O board J1 (Serial Port 1). Locate J1 in the diagram below. BAR CODE ASSY NO.
TAC Access to Coprocessor – Modem Connection Modem interface cable schematic An example of the modem interface cable internal wiring details are shown in the diagram below. This cable is available from Honeywell logistics with the part number 51305073-100. It must be ordered separately.
TAC Access to Coprocessor – Modem Connection Table 7-3 Modem Connection Procedure Step Action 1 Make sure the modem is properly configured (switches and internal configuration registers). 2 Connect one end of the modem interface cable to the modem. 3 Connect the other end of the modem interface cable to the WSI2 I/O board for serial Serial Port 1 (connector J1). You will have to disconnect the coprocessor console terminal cable from this jack if the terminal is currently connected.
8. HP 712/60 PA RISC Desktop Workstation 8.1 HP 712/60 Workstation in AXM Environment Overview of HP 712/60 workstation functionality X supporting A M The optional System Administration and Development workstation (HP 712/60) provides several functions that support the AXM environment. They are as follows: • Provides an HP-UX workstation connected to the PIN (LAN). AXM system administration and application development can be accomplished through this PIN connection.
HP 712/60 PA RISC Desktop Workstation – HP 712/60 Workstation in AXM Environment HP 712/60 workstation connection Plant Information Network (Ethernet Cable) Media Access Unit (51191782-100) 51191783-100A Media Access Unit (51191782-100) 51191783-100A * The following diagram illustrates the connections required to provide all of the AXM support functionality as described earlier in this section.
9. DAT DRIVE 9.1 Introduction DAT drive purpose A directly connected Digital Audio Tape (DAT) drive is an optional feature for the AXM. It provides the capability to perform software “Backup” and “Restore” operations without a communication connection over the PIN network. It may also be used for software installation and software updates. This locally connected DAT tape can also be utilized to recover from a catastrophic failure of the coprocessor primary hard drive.
DAT DRIVE – DAT Drive Indicators 9.2 DAT Drive Indicators DAT indicator definition The DAT drive front panel has two bicolored indicators (left and right). The two colors are green and amber. Green is used to indicate normal conditions whereas amber is used to indicate that operator intervention is required or that an error has occurred. The table below identifies the possible indicator patterns and the associated definitions.
DAT DRIVE – Preventive Maintenance 9.3 Preventive Maintenance DAT head cleaning Head cleaning procedure The DAT drive heads require cleaning: • after every 28 hours of actual operation. • when the “Caution” indicator status on front of the drive is displayed. See the table above for details. The following table provides the procedure for using the DAT cleaning cassette. This cassette is available from Honeywell logistics under the number 51196257-200 (HP 92283K).
DAT DRIVE – DAT Drive Physical Configuration and Cabling 9.4 DAT Drive Physical Configuration and Cabling The SCSI address for the DAT drive must be pinned for an address of 1. The pinning is done in binary fashion as shown at the bottom right of the following diagram. This SCSI address pinning must be checked, and corrected if necessary, when installing a DAT drive as a new option or a replacement drive.
DAT DRIVE – DAT Drive Physical Configuration and Cabling The termination for the coprocessor SCSI bus must be provided by the device at the end of the cable when external peripherals are connected to the coprocessor. The DAT drive will always be at the end of the SCSI cable if a DAT exists. The terminator assemblies that provide this function within the DAT drive are mounted immediately above the SCSI interface cable connection. See the identified terminator assemblies on the following diagram.
DAT DRIVE – DAT Drive Physical Configuration and Cabling Internal DAT drive options are selected by 8 switches located on the bottom of the drive. The connection of the DAT drive to the AXM requires that these switches all be placed in the ON position. See the following diagram. These switches must be checked, and turned on if necessary, when installing a DAT drive as a new option or a replacement drive.
DAT DRIVE – DAT Drive Physical Configuration and Cabling The following diagram illustrates the SCSI cable connection for an optional AXM connected DAT drive without an optional AXM connected CD-ROM. Notice that the optional AXM connected DAT drive shares the common Universal Station drive enclosure. The cartridge drive shown would be connected to the US node in the common station furniture.
DAT DRIVE – DAT Drive Physical Configuration and Cabling DAT connection (with CD-ROM) The following diagram illustrates the SCSI cable connections for both an optional AXM connected DAT and optional AXM connected CD-ROM drive. Notice that the optional AXM connected drives consume the entire drive enclosure (both drive positions). The US node in the common station furniture would not be able to have a cartridge drive in this case.
DAT DRIVE – DAT Replacement 9.5 DAT Replacement Overview Node power must be turned off for the purpose of changing circuit boards in the AXM node. WARNING Damage can result—Circuit board damage can result if you do not practice proper ESD procedures or attempt to remove/ insert a circuit board with node power applied. CAUTION Mandatory steps—It is mandatory that appropriate X software shutdown procedures are followed for the A M coprocessor prior to removing power from the node.
DAT DRIVE – DAT Replacement Table 9-3 DAT Replacement Procedure Step Action 1 Perform an orderly shutdown of the coprocessor HP- UX software. 2 3 Perform an orderly shutdown of the A M node processor using the Node Status display. This includes a checkpoint save if required. X Power off the A M node power supply. 4 Remove the appropriate console furniture components to allow access to the DAT device.
10. Section 10—CD-ROM Drive 10.1 Introduction CD-ROM purpose CD-ROM drive location Physical drive A directly connected CD-ROM drive is an optional feature for the AXM. It provides the capability to access HP software documentation. Future uses may include installing software and software updates.
Section 10—CD-ROM Drive – CD-ROM Physical Configuration and Cabling 10.2 CD-ROM Physical Configuration and Cabling CD-ROM pinning (without DAT drive) The SCSI interface must be terminated by placing termination resistor assemblies at the drive located at the end of the cable (farthest from HDDT I/O board). The following illustration shows the proper pinning (device address 2) and terminators for the CD-ROM when the configuration does not include a DAT drive.
Section 10—CD-ROM Drive – CD-ROM Physical Configuration and Cabling CD-ROM pinning (with DAT drive) The SCSI interface must be terminated by placing termination resistor assemblies at the drive located at the end of the cable (farthest from HDDT I/O board). The following illustration shows the proper pinning (device address 2) and terminators for the CD-ROM when the configuration includes a DAT drive.
Section 10—CD-ROM Drive – CD-ROM Physical Configuration and Cabling CD-ROM power CD-ROM drive SCSI cabling CD-ROM connection (no DAT) Power to the CD-ROM drive is supplied by the AXM node power supply. This is done through a wire harness connected to J9 on the rear of the AXM node backplane. The optional CD-ROM drive connection may coexist with an optional DAT drive connection to the coprocessor. The possible SCSI interface cable connection schemes are illustrated in the following two diagrams.
Section 10—CD-ROM Drive – CD-ROM Physical Configuration and Cabling CD-ROM connection (with DAT drive) The following diagram illustrates the SCSI cable connections for an optional AXM connected CD-ROM drive coexisting with an otional AXM connected DAT drive. In this case, the CD-ROM must not have the termination resistors present. The DAT drive will provide the SCSI interface termination. Notice that the optional AXM connected drives consume the entire drive enclosure (both drive positions).
Section 10—CD-ROM Drive – CD-ROM Replacement 10.3 CD-ROM Replacement Overview Node power must be turned off for the purpose of changing circuit boards in the AXM node. WARNING Damage can result—Circuit board damage can result if you do not practice proper ESD procedures or attempt to remove/ insert a circuit board with node power applied. CAUTION Mandatory steps—It is mandatory that appropriate X software shutdown procedures are followed for the A M coprocessor prior to removing power from the node.
Section 10—CD-ROM Drive – CD-ROM Replacement Replacement procedure The following procedure outlines the steps that are required to replace a CD-ROM drive. Table 10-1 CD-ROM Replacement Procedure Step 1 Action Perform an orderly shutdown of the coprocessor HP- UX software using the shutdown command. 2 Perform an orderly shutdown of the A M node processor using the Node Status display. This includes performing a checkpoint save if required. 3 Power off the A M node power supply.
Section 10—CD-ROM Drive – CD-ROM Replacement 132 Application ModuleX Service Honeywell 12/01
11. Spare Parts 11.1 Overview Organization of this section CE Compliant/nonCompliant hardware New technology 12/01 This section lists the field replaceable parts for both versions of AXM node hardware. It is divided into the following categories: • Basic 5-Slot Module (does not include circuit boards). • Basic 10-Slot Module (does not include circuit boards).
Spare Parts – Basic 5-Slot Module Parts 11.2 Basic 5-Slot Module Parts Basic 5-slot parts list The table on the following page identifies the basic parts for an AXM node in a 5-slot chassis.
Spare Parts – Basic 5-Slot Module Parts Table 11-1 5-Slot Module Parts List for Normal Production Units Assembly Number Description 51308019-200 Non-CE Compliant 51308066-200 Power cord 220 V 50/60 Hz (ergonomic furniture) 51305282-100 Empty card slot filler plate (used in CE Compliant notes only) 12/01 Application ModuleX Service Honeywell 135
Spare Parts – Basic 10-Slot Module Parts 11.3 Basic 10-Slot Module Parts Basic 10-Slot parts list The following table identifies the basic parts for an AXM node in a 10slot chassis. Table 11-2 Basic 10-Slot Module Parts List for Normal Production Units Assembly Number Description CE Compliant 51196736-100 Non-CE Compliant 10-Slot Module assembly (card file) for rack mounting or classic furniture.
Spare Parts – LCN Node Processor Parts 11.4 LCN Node Processor Parts Node processor parts list The following table provides the part numbers for the Node processor components.
Spare Parts – Coprocessor and Related Parts 11.5 Coprocessor and Related Parts WSI2 and WSI2 I/O Table 11-4 WSI2 and WSI2 I/O Boards Assembly Number Description 51402083-100 WSI2 Board, includes 64 MHz coprocessor with no memory (requires the appropriate coprocessor memory daughter boards— ordered separately). 51402083-200 WSI2 Board, includes 100 MHz coprocessor with no memory (requires the appropriate coprocessor memory daughter boards— ordered separately).
Spare Parts – Coprocessor and Related Parts The optional coprocessor memory sizes and coprocessor battery part numbers are listed below. Table 11-5 Coprocessor Memory Boards and Battery Assembly Number Description 51196418-300 (order quantity of 2) 16 megabyte coprocessor memory daughter board. 51196418-301 32 megabyte coprocessor memory daughter board. (order quantity of 2 for 64 megabytes) 51196418-302 64 megabyte coprocessor memory daughter board.
Spare Parts – Coprocessor and Related Parts Coprocessor PIN connection hardware Table 11-6 PIN Connection Hardware Assembly Number Description 51191783-100 PIN (LAN) interface cable [between WSI2 I/O and the Media Access Unit] 51191782-100 Media Access Unit (MAU) [connects to the PIN (LAN) cable network] Coprocessor console terminal/ modem cables Table 11-7 Coprocessor Console Terminal/Modem Interface Cables Assembly Number Description 51305069-100 Serial Port interface cable (for connecting cop
Spare Parts – Hard Disk Drive Tray and Drive Parts 11.6 Hard Disk Drive Tray and Drive Parts Tray and Drive Parts list The following table provides the part numbers for the Hard Disk Drive Tray and the disk drives. Table 11-8 Drive Tray and Related Parts List Assembly Number Description 51402176-100 Hard Disk Drive Tray (includes internal circuit board and drive cables.
Spare Parts – DAT Tape and Associated Parts 11.7 DAT Tape and Associated Parts Introduction ATTENTION The DAT drive may be mounted in one of three (3) possible cabinet configurations. They are: • Ergonomic furniture Station • Classic furniture Station • Table-top work surface (adjacent to Station containing the A M node) X There are part differences associated with these configurations. Separate parts lists for each possible cabinet arrangement are provided.
Spare Parts – DAT Tape and Associated Parts DAT drive in Classic furniture station The following table provides the part numbers for the optional DAT tape drive and its associated parts as it appears in a Classic Furniture style station.
Spare Parts – DAT Tape and Associated Parts DAT drive in Ergonomic or Classic table-top work surface The following table provides the part numbers for the optional DAT tape drive and its associated parts as it appears in a table-top work surface which is adjacent to the station containing the AXM node.
Spare Parts – CD-ROM and Associated Parts 11.8 CD-ROM and Associated Parts Introduction ATTENTION The CD-ROM drive may be mounted in one of three (3) possible cabinet configurations. They are: • Ergonomic furniture Station • Classic furniture Station • Table-top work surface (adjacent to Station containing the A M node) X There are part differences associated with these configurations. Separate parts lists for each possible cabinet arrangement are provided.
Spare Parts – CD-ROM and Associated Parts CD-ROM in classic furniture station The following table provides the part numbers for the optional CD-ROM and its associated parts as they appear in a Classic furniture style station.
Index Dat drive purpose, 115 DAT drive replacement, 123 DAT drive replacement procedure, 123 DAT drive SCSI address pinning, 118 DAT drive SCSI interface termination, 119 DAT drive spare parts, 115 DAT option switches, 120 DAT Tape and Associate Parts, 142 1 10-Slot board placement, 14 10-Slot board replacement, 14 5 5-Slot board replacement, 13 F A Functionality Diagram, 10 AXM functionallity, 9 AXM Hardware block diagram, 11 H Hard Disk Drive Tray and Drive Parts List, 141 HMPU hardware version, 12
Requirements for coprocessor console, 97 Modem interface cable schematic, 111 N S Node power margin restrictions, 16 Shutdown procedure, 36 Spare parts, 133 Spare Parts, 133 Supports existing AM functionality, 9 O Operation and media handling, 115, 125 Overview of chassis types, 13 Overview of HP 712/60 workstation functionality supporting AXM, 113 P TAC access to coprocessor, 105 W Power Supply, 16 Preventive maintenance, 117 Procedure to to obtain a replacement Kinet license, 49 R T WSI board
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