JETSON NANO DEVELOPER KIT DA_09402_004 | January 15, 2020 User Guide
DOCUMENT CHANGE HISTORY DA_09402_004 Version Date Authors Description of Change 1.0 March 18, 2019 plawrence Initial release 1.1 July 8, 2019 plawrence Updates concurrent with Jetson Linux Driver Package release 32.2. Added and corrected carrier board information; added information about NVIDIA Container Runtime; added information about first boot configuration process. 1.2 January 7, 2020 ssheshadri Updates concurrent with Jetson Linux Driver Package release 32.3.1. Added references to VPI.
TABLE OF CONTENTS Note ........................................................................................... ii Developer Kit Setup and Hardware..................................................... 1 Included in the Box ............................................................................. Developer Kit Setup ............................................................................ Developer Kit Interfaces .......................................................................
DEVELOPER KIT SETUP AND HARDWARE The NVIDIA® Jetson Nano™ Developer Kit is an AI computer for makers, learners, and developers that brings the power of modern artificial intelligence to a low-power, easyto-use platform. Get started quickly with out-of-the-box support for many popular peripherals, add-ons, and ready-to-use projects. A Jetson Nano Developer Kit includes a non-production specification Jetson module (P3448-0000) attached to a reference carrier board (P3449-0000).
INCLUDED IN THE BOX • A Jetson non-production Jetson Nano module (P3448-0000) with heatsink • A reference carrier board (P3449-0000) • A small paper card with quick start and support information • A folded paper stand for the developer kit DEVELOPER KIT SETUP Before using your developer kit, you need to set up a microSD card with the operating system and JetPack components.
Developer kit carrier boards: rev A02 top view Developer kit module and carrier board: rev B01 top view Interface Details This section highlights some of the Jetson Nano Developer Kit interfaces. See the Jetson Nano Developer Kit Carrier Board Specification for comprehensive information. Module • [J501] Slot for a microSD card.
• The passive heatsink supports 10W module power usage at 25° C ambient temperature. If your use case requires additional cooling, you can configure the module to control a system fan. See the Jetson Nano Supported Component List for fans that have been verified for attachment to the heatsink. Carrier Board • [DS3] Power LED; lights when the developer kit is powered on. • [J2] SO-DIMM connector for Jetson Nano module. • [J6] HDMI and DP connector stack.
• • Pins 3 and 4 put the developer kit into Force Recovery Mode if they are connected when it is powered on. [J41] 40-pin expansion header includes: • Power pins. Two 3.3V power pins and two 5V power pins. These are not switchable; power is always available when the developer kit is connected to power. Two 5V pins can be used to power the developer kit at 2.5A each. • Interface signal pins. All signals use 3.3V levels.
Power Guide Jetson Nano Developer Kit requires a 5V power supply capable of supplying 2A current. Micro-USB Power Supply Options Out of the box, the developer kit is configured to accept power via the Micro-USB connector. Note that some Micro-USB power supplies are designed to output slightly more than 5V to account for voltage loss across the cable. For example, Adafruit’s GEO151UB-6025 Power Supply (validated by NVIDIA for use with the Jetson Nano Developer Kit) is designed to provide 5.25V.
JETPACK NVIDIA JetPack SDK is the most comprehensive solution for building AI applications. It includes the latest OS images for Jetson products, along with libraries and APIs, samples, developer tools, and documentation. SUMMARY OF JETPACK COMPONENTS This section briefly describes each component of JetPack. For additional details about these components, see the online documentation for JetPack at: https://docs.nvidia.com/jetson/jetpack/index.
Sample Applications JetPack includes several samples which demonstrate the use of JetPack components. These are stored in the reference filesystem and can be compiled on the developer kit.
• • • • • • • NVIDIA Jetson Linux Driver Package Developer Guide Tegra NVIDIA Jetson Linux Driver Package Release Notes TensorRT Documentation cuDNN Documentation CUDA Toolkit NVIDIA Container Runtime OpenCV Documentation • • • • • • • • • VisionWorks Documentation Nsight Eclipse Edition Documentation CUDA-GDB Documentation CUDA-MEMCHECK Documentation Nsight Systems nvprof Visual Profiler Nsight GraphicsNsight Compute CLI VPI–Vision Programming Interface HOW TO INSTALL JETPACK There are two ways to inst
INITIAL CONFIGURATION UPON FIRST BOOT Whether you use the SD Card image or use SDK Manager to flash your developer kit, upon first boot it will prompt you for initial configuration information like keyboard layout, username and password, etc. Headless initial configuration If no display is attached to the developer kit during first boot, the initial configuration process is “headless.” That is, you must communicate with the developer kit through a serial application on the host computer (e.g.
WORKING WITH JETSON LINUX DRIVER PACKAGE NVIDIA® Jetson™ Linux Driver Package (L4T) is the operating system component of JetPack, and provides the Linux kernel, Bootloader, Jetson Board Support Package (BSP), and sample filesystem for Jetson developer kits. L4T is included on the Jetson Nano SD Card image. Alternatively, you can use SDK Manager to install L4T along with all the other JetPack components to your developer kit.
COMPLIANCE INFORMATION The NVIDIA Jetson Nano Developer Kit is compliant with the regulations listed in this section. UNITED STATES Federal Communications Commission (FCC) This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including any interference that may cause undesired operation of the device.
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. FCC Warning: The FCC requires that you be notified that any changes or modifications to this device not expressly approved by the manufacturer could void the user’s authority to operate the equipment.
EUROPEAN UNION European Conformity; Conformité Européenne (CE) This device complies with the following Directives: Electromagnetic Compatibility Directive 2014/30/EU Low Voltage Directive 2014/35/EU RoHS Directive 2011/65/EU The full text of EU declaration of conformity is available at the following internet address: www.nvidia.com/support A copy of the Declaration of Conformity to the essential requirements may be obtained directly from NVIDIA GmbH (Floessergasse 2, 81369 Munich, Germany).
Japan RoHS Material Content Declaration 日本工業規格JIS C 0950:2008により、2006年7月1日以降に販売される特定分野の電気および 電子機器について、製造者による含有物質の表示が義務付けられます。 機器名称: Jetson Nano Developer Kit 開発者コンポーネント 特定化学物質記号 主な分類 PCBボード パッシブ電子部品 アクティブ電子部品 コネクター / ケーブル Pb Hg Cd Cr(VI) PBB PBDE 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 除外項 目 除外項 目 除外項 目 プロセッサー 0 0 0 0 0 0 メモリ 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 機械部品 はんだ付け材料 フラックス、クリームはん だ、ラベル、その他消耗品 除外項 目 注： 1.
2.「除外項目」は、特定化学物質が含有マークの除外項目に該当するため、特定化学物質につ いて、日本工業規格JIS C 0950:2008に基づく含有マークの表示が不要であることを示しま す。 3.「0.1wt%超」または「0.01wt%超」は、特定化学物質の含有率が日本工業規格JIS C 0950:2008 に記載されている含有率基準値を超えていることを示します。 A Japanese regulatory requirement, defined by specification JIS C 0950: 2008, mandates that manufacturers provide Material Content Declarations for certain categories of electronic products offered for sale after July 1, 2006.
not required to display the marking for that specified chemical substance per the standard, JIS C 0950: 2008. 3. “Exceeding 0.1wt%” or “Exceeding 0.01wt%” is entered in the table if the level of the specified chemical substance exceeds the threshold level specified in the standard, JIS C 0950: 2008. SOUTH KOREA Radio Research Agency (RRA) R-R-NVA-P3450 R-R-NVA-P3448 이 기기는 가정용(B급) 전자파적합기기로서 주 로 가정에서 사용하는 것을 목적으로 하며, 모 든 지역에서 사용할 수 있습니다.
엔비디아의 그래픽 카드제품은 전기 전자제품 및 자동차의 자원순환에 관한 법률 시행령 제 11조 제 1항에 의거한 법 시행행규칙 제 3조에에따른 유해물질함유 기준을 확인 및 평가한 결과, 이를 준수하였음을 공표합니다. 구비서류 : 없음 작성방법 ① 제품의 종류는 "전기.전자제품 및 자동차의 자원순환에관한 법률 시행령" 제 8조 제 1항 및 제 2항에 따른 품목별로 구분하여 기재합니다. ② 전기 전자 제품의 경우 모델명 (번호), 자동차의 경우, 제원관리번호를 기재합니다. ③ 해당제품의 제조업자 또는 수입업자를 기재합니다. Confirmation and Evaluation Form Concerning the Adherence to Acceptable Standards of Hazardous Materials Contained in Products Statement Prepared by Company Name: Nvidia HongKong Holding Ltd.
① Please indicate the product category according to the categories listed in Article 8, Items 1and 2 of the ‘ Enforcement Ordinance of the Statute on the Recycling of Electrical, Electronic and Automobile Materials’ ② For electrical and electronic products, please indicate the Model Name (and number). For automobiles, please indicate the Vehicle Identification Number. ③ Please indicate the name of manufacturer and/or importer of the product.
印刷電路板 PCB 處理器 Processor 主動電子零件 Active components 被動電子零件 Passive components 存儲設備 Memory 機械部件 Mechanicals 連接器/線材 Connectors/Cable 焊接金屬 Soldering material 助焊劑，錫膏，標籤及耗材 Flux, Solder Paste, label and other consumable materials 铅 (Pb ) 汞 (Hg) 镉 (Cd) 六價铬 (Cr(VI)) 多溴聯 苯 (PBB) 多溴二苯 醚 (PBDE) O O O O O O O O O O O O - O O O O O - O O O O O O O O O O O - O O O O O - O O O O O O O O O O O O O O O O O 備考1：O：系指該限用物質未超出百分比含量基準值 Note 1： O：indicates that the percen
部件名称 Parts 有害物质 Hazardous Substances 铅 (Pb) 汞 (Hg) 镉 (Cd) 六价铬 (Cr(VI)) 多溴联苯 (PBB) 多溴二苯 醚 (PBDE) 印刷电路板 PCB 处理器 Processor O O O O O O O O O O O O 主动电子零件 Active components X O O O O O 被动电子零件 Passive components X O O O O O 存储设备 Memory 机械部件 Mechanicals O O O O O O X O O O O O 连接器/线材 X O Connectors / Cable 焊接金属 O O Soldering material 助焊剂，锡膏，标签及耗 材 O O Flux, Solder Paste, label and other consumable materials 本表格依据SJ/T 11364-2014 的规定编制 The table according to SJ/T 11364
INDIA India RoHS Compliance Statement This product, as well as its related consumables and spares, complies with the reduction in hazardous substances provisions of the “India E-waste (Management and Handling) Rule 2016”. It does not contain lead, mercury, hexavalent chromium, polybrominated biphenyls or polybrominated diphenyl ethers in concentrations exceeding 0.1 weight % and 0.01 weight % for cadmium, except for where allowed pursuant to the exemptions set in Schedule 2 of the Rule. Sr. No . i.
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