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 2012-2017 Microchip Technology Inc. Advance Information DS40001667E-page 1

MGC3030/3130

Introduction

Microchip’s MGC3X30 are 3D gesture recognition and

motion tracking controller chips based on Microchip’s

patented GestIC

technology. They enable user-

command input with natural hand and finger

movements. Applying the principles of electrical near-

field sensing, the MGC3X30 contain all the building

blocks to develop robust 3D gesture input sensing

systems. Implemented as a low-power mixed-signal

configurable controller, they provide a large set of

smart functional features with integrated signal driver,

a frequency adaptive input path for automatic noise

suppression and a digital signal processing unit.

Microchip’s on-chip Colibri Suite obsoletes processing

needs at the host, reduces system power consumption

resulting in low software development efforts for short

time-to-market success. The MGC3XXX family

represents a unique solution that provides gesture

information of the human hand in real time. Dedicated

chip family members add position data, touch or multi

touch information to the free space gesture sensing.

The MGC3XXX allow the realization of a new

generation of user interfaces across various industry

markets.

Applications

• Audio Products

• Notebooks/Keyboards/PC Peripherals

• Home Automation

• White Goods

• Switches/Industrial Switches

• Medical Products

• Game Controllers

• Audio Control

Power Features

• Variety of Several Power Operation modes

include:

- Processing mode: 20 mA @ 3.3V, typical

- Programmable Self Wake-up: 110 µA @ 3.3V

- Deep Sleep: 9 µA @ 3.3V, typical

Key Features

• Recognition of 3D Hand Gestures and x, y, z

Positional Data (MGC3130)

• Proximity and Touch Sensing

• Built-in Colibri Gesture Suite (running on chip)

• Advanced 3D Signal Processing Unit

• Detection Range: 0 to 10 cm

• Receiver Sensitivity: <1 fF

• Position Rate: 200 positions/sec

• Spatial Resolution: up to 150 dpi

• Carrier Frequency: 44 kHz to 115 kHz

• Channels Supported:

- Five receive (Rx) channels

- One transmit (Tx) channel

• On-chip Auto Calibration

• Low Noise Radiation due to Low Transmit Voltage

and Slew Rate Control

• Noise Susceptibility Reduction:

- On-chip analog filtering

- On-chip digital filtering

- Automatic frequency hopping

• Enables the use of Low-Cost Electrode Material

including:

- Printed circuit board

- Conductive paint

- Conductive foil

- Laser Direct Structuring (LDS)

- Touch panel ITO structures

• Field Upgrade Capability

• Operating Voltage: 3.3V (+/-5%) (single supply)

• Temperature Range: -20°C to +85°C

Peripheral Features

•1x I

C™ Interface for Configuration and Sensor

output streaming

• Five Gesture Port pins for individual mapping of

gesture to EIOs

Note: This data sheet applies to parts MGC3030

and MGC3130. Throughout this

document the term MGC3X30 will be

representative for these two parts.

MGC3030/3130 3D Tracking and Gesture Controller Data Sheet

Summary of content (50 pages)

PAGE 1
MGC3030/3130 MGC3030/3130 3D Tracking and Gesture Controller Data Sheet Introduction Key Features Microchip’s MGC3X30 are 3D gesture recognition and motion tracking controller chips based on Microchip’s patented GestIC® technology. They enable usercommand input with natural hand and finger movements. Applying the principles of electrical nearfield sensing, the MGC3X30 contain all the building blocks to develop robust 3D gesture input sensing systems.
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MGC3030/3130 TABLE 1: MGC3X30 AVAILABLE PACKAGES Part number Available Package Pins Contact/Lead Pitch Dimensions MGC3030 SSOP 28 0.65 7.80x10.50 MGC3130 QFN 28 0.
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MGC3030/3130 Pin Diagrams FIGURE 1: 28-PIN DIAGRAM (MGC3130) V DD VSS1 NC TXD MCLR EIO7/SI3 EIO6/SI2 28 27 26 25 24 23 22 QFN VCAPS 1 21 EIO5/SI1 VINDS 2 20 EIO4/SI0 VSS2 3 19 EIO3 RX0 4 18 NC RX1 5 17 NC RX2 6 16 NC RX3 7 15 IS2 MGC3130 8 9 10 11 12 13 14 RX4 VCAPA VSS3 VCAPD EIO0/TS EIO1 EIO2 EXP-29  2012-2017 Microchip Technology Inc.
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MGC3030/3130 FIGURE 2: 28-PIN DIAGRAM (MGC3030) VCAPD VSS3 VCAPA RX4 RX3 RX2 RX1 RX0 VSS2 VINDS VCAPS VDD VSS1 TxD SSOP 28 27 26 25 24 23 22 21 20 19 18 17 16 15 DS40001667E-page 4 10 11 12 EIO7/SI3 Advance Information 13 14 NC 9 MCLR 8 EIO6/SI2 IS2 7 EIO5/SI1 EIO2 6 EIO4/SI0 EIO1 5 EIO3 4 NC 3 NC 2 NC 1 EIO0/TS MGC3030  2012-2017 Microchip Technology Inc.
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 2012-2017 Microchip Technology Inc. TABLE 3: PIN SUMMARY Pin Number Pin Name Pin Type Buffer Type 18 P — Reserved: Connect to VDD. 19 P — Reserved: Do not connect. Ground. 28-QFN 28-SSOP VCAPS 1 VINDS 2 VSS2 3 20 P — RX0 4 21 I Analog RX1 5 22 I Analog RX2 6 23 I Analog RX3 7 24 I Analog RX4 8 25 I Analog Description Analog input channels: Receive electrode connection. Advance Information VCAPA 9 26 P — External filter capacitor (4.
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PIN SUMMARY Pin Number Pin Name Pin Type Buffer Type 14 — — Reserved: do not connect. 27 16 P — Common ground reference for analog and digital domains. 28 17 P — Positive supply for peripheral logic and I/O pins. It requires an external filtering capacitor (100 nF). 29 — P — Exposed pad. It should be connected to Ground.
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MGC3030/3130 Table of Contents 1.0 Theory of Operation: Electrical Near-Field (E-Field Sensing).................................................................................................... 8 2.0 Feature Description ................................................................................................................................................................. 10 3.0 System Architecture......................................................................................................
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MGC3030/3130 1.0 THEORY OF OPERATION: ELECTRICAL NEAR-FIELD (E-FIELD) SENSING FIGURE 1-1: EQUIPOTENTIAL LINES OF AN UNDISTORTED E-FIELD FIGURE 1-2: EQUIPOTENTIAL LINES OF A DISTORTED E-FIELD Microchip’s GestIC is a 3D sensor technology which utilizes an electric field (E-field) for advanced proximity sensing. It allows realization of new user interface applications by detection, tracking and classification of a user’s hand gestures in free space.
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MGC3030/3130 1.1 GestIC Technology Benefits • GestIC E-field sensors are not impacted by ambient influences such as light or sound, which have a negative impact to the majority of other 3D technologies. • GestIC technology allows gesture/position tracking processing on chip – no host processing needed. Algorithms are included in the Colibri gesture suite which runs on chip and is provided my Microchip.
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MGC3030/3130 2.0 FEATURE DESCRIPTION 2.2.1.2 2.1 Gesture Definition The Colibri Suite’s gesture recognition model detects and classifies hand movement patterns performed inside the sensing area. A hand gesture is the movement of the hand to express an idea or meaning. The GestIC® technology accurately allows sensing of a user’s free space hand motion for contact free position tracking, as well as 3D gesture recognition based on classified movement patterns. 2.
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MGC3030/3130 2. AirWheel An AirWheel is the recognition of continuouslyperformed circles inside the sensing area and provides information about the rotational movement in real time. It provides continuously counter information which increments/decrements according to the movement’s direction (clockwise/counterclockwise). The AirWheel can be adjusted for convenient usage in various applications (e.g., volume control, sensitivity adjustment or light dimming).
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MGC3030/3130 FIGURE 2-4: SENSOR TOUCH DIAGRAM Touch detected Touch Max Tap Duration 0s-1s Tap detected Tap Max Tap Duration 0s-1s Max Double Tap Duration 0s-1s Tap detected Double Tap detected Double Tap 2.2.1.3 FIGURE 2: Gesture Port GESTURE PORT The Gesture Port enables a flexible mapping of Colibri Suite feature events to certain output signals at dedicated pins of the MGC3X30.
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MGC3030/3130 2.2.1.4 Approach Detection FIGURE 3: configurable. For typical applications, the scan cycle is in a range of 20 ms to 150 ms. During the Approach scan, the activated Rx channels are monitored for signal changes which are caused by, for example, an approaching human hand and exceeding the defined threshold. This allows an autonomous wake-up of the MGC3X30 and host applications at very low-power consumption.
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MGC3030/3130 3.0 SYSTEM ARCHITECTURE MGC3X30 are mixed-signal configurable controllers. The entire system solution is composed of three main building blocks (see Figure 3-1): • MGC3X30 Controller • GestIC® Library • External Electrodes 3.1 3.2 The embedded GestIC Library is optimized to ensure continuous and real-time free-space Gesture Recognition and Motion tracking (MGC3130) concurrently.
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MGC3030/3130 3.3.1 ELECTRODE EQUIVALENT CIRCUIT The hand Position Tracking and Gesture Recognition capabilities of a GestIC system depends on the electrodes design and their material characteristics. A simplified equivalent circuit model of a generic GestIC electrode system is illustrated in Figure 3-2.
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MGC3030/3130 Note: 3.3.2 are separated by a thin isolating layer. The Rx electrodes are typically arranged in a frame configuration as shown in Figure 3-3. The frame defines the inside sensing area with maximum dimensions of 14x14 centimeters. An optional fifth electrode in the center of the frame may be used to improve the distance measurement and add simple touch functionality. Ideal designs have low CRxTx and CRxG to ensure higher sensitivity of the electrode system.
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MGC3030/3130 4.0 FUNCTIONAL DESCRIPTION Microchip Technology’s MGC3X30 configurable controller uses up to five E-field receiving electrodes. Featuring a Signal Processing Unit (SPU), a wide range of 3D gesture applications are being preprocessed on the MGC3X30, which allows short development cycles, as no host processing is needed. Always-on 3D sensing, even for battery-driven mobile devices, is enabled due to the chip’s low-power design and variety of programmable power modes.
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MGC3030/3130 4.1 Reset Block The Reset block combines all Reset sources. It controls the device system’s Reset signal (SYSRST). The following is a list of device Reset sources: • MCLR: Master Clear Reset pin • SWR: Software Reset available through GestIC Library Loader • WDTR: Watchdog Timer Reset A simplified block diagram of the Reset block is illustrated in Figure 4-2. FIGURE 4-2: SYSTEM RESET BLOCK DIAGRAM • VDDA Domain: This domain is powered by VDDA = 3.0V.
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MGC3030/3130 4.2.2 POWER SUPERVISORS During the Power-up sequence, the system is kept under Reset condition for approximately 200 µs (Reset delay: tRSTDLY) after the VDD =1.5V voltage is reached (1.2V minimum). During this delay, the system Reset will remain low and the VDD should reach typically 2V. When the Reset delay is elapsed, the system Reset is released (high) and the system starts the Power-up/ Time-out (tPWRT) sequence. The system start depends on the used VDD voltage.
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MGC3030/3130 4.2.3 CLOCKS 4.2.4.2 Deep Sleep Mode The MGC3X30 is embedding two internal oscillators, high speed and low speed. The High-Speed Oscillator (HSO) is factory-trimmed, achieving high accuracy. During the Deep Sleep mode, VDDM and VDDA are turned off, and VDDC is still powered to retain the data of the SPU. • High-Speed Oscillator (HSO): The mode includes the following characteristics: The MGC3X30 is clocked by an internal HSO running at 22.5 MHz ±10% and consuming very low power.
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MGC3030/3130 4.2.4.4 MGC3X30 Power Profile The MGC3X30 power profile is illustrated in Figure 4-5.
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MGC3030/3130 Figure 4-6 and Figure 4-7 describe the Self Wake-up mode current consumption according to the Approach Scan and Calibration Scan period change. FIGURE 4-6: CURRENT CONSUMPTION FOR VARYING TIME INTERVALS BETWEEN APPROACH SCANS AND CALIBRATION SCANS 1.40 1.21 Current Consumption [mA] 1.20 1.00 0.86 0.77 0.80 Calibration Scan every 1024s Calibration Scan every 2s 0.60 0.57 Calibration Scan every 10s 0.40 0.20 0.20 0.11 0.
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MGC3030/3130 4.2.4.5 Table 4-2 modes. Operation Modes Summary summarizes TABLE 4-2: the MGC3X30 OPERATION MODES SUMMARY Mode Entry Exit I2C™0/IRQ0/Approach/ MCLR/WDTR/SW Reset Processing Self Wake-up Time-out/GestIC® Library Message GestIC® Library Message Deep Sleep 4.2.
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MGC3030/3130 Power-up Phases • Reset or Deep Sleep: The system is kept in Reset or is in Deep Sleep mode • Power-up: Phase when the system starts up after Reset/Deep Sleep has been released • Processing operation: Processing mode is started • Power-up Time-out TABLE 4-3: POWER-UP TIME-OUT (tPWRT) Delay in LSO Cycles Signal Symbol VREF Enable After Reset After Deep Sleep 0 0 tVREF HSO Enable SPU CLK Power-Up Time-Out tHSO 2 2 tSPUCLK 30 8 tPWRT 36 10 Signal References • • • • LSO: Low-S
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MGC3030/3130 Power-down Phases • Processing Operation: Processing mode is activated • Request: Request to enter Deep Sleep mode • Power-down: Power-down state (all analog signals are down) • Deep Sleep: Deep Sleep mode has been entered Signal References • • • • LSO: Low-Speed Oscillator clock HSO: High-Speed Oscillator clock VREF Enable: Voltage Reference enable signal HSO Enable: High-Speed Oscillator enable signal 4.
PAGE 26
MGC3030/3130 5.0 INTERFACE DESCRIPTION The MGC3X30 supports an I2C™ interface with Slave mode and the Gesture Port (five configurable EOIs). 5.1 Interface Selection The MGC3X30 interface selection pin, IS2, is used to select the I2C slave address. There are two different addresses. TABLE 5-1: IS2 MGC3X30 INTERFACE SELECTION PINS IS1 0 1 5.2 Mode (Address) 0 I2 0 2 C™0 Slave Address 1 (0x42) I C™0 Slave Address 2 (0x43) Extended Input Output (EIO) 5.
PAGE 27
MGC3030/3130 FIGURE 5-1: GESTURE PORT MAPPING Colibri Suite Events Action Selection [0:2] Permanent high Permanent low Toggle Pulse (100ms) High active Low active EventOutput1..
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MGC3030/3130 TABLE 5-3: COLIBRI SUITE EVENTS Gesture Port Mapping Parameter Description Gesture Selection Selects the gestures which will be used as event. Gesture Selection can be: • Flick West/East • Flick East/West • Flick North/South • Flick South/North • Circle Clockwise • Circle Counterclockwise • AirWheel Clockwise • AirWheel Counterclockwise Sensor Touch Selection Selects the sensor touch which will be used as event.
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MGC3030/3130 FIGURE 5-2: GESTURE PORT ACTION Event Permanent high Event Permanent low Event Pulse (100ms) Event Event Event Toggle Touch detected Touch released Touch detected Touch released High active Low active TABLE 5-4: GESTURE PORT MAPPING Action Event Permanent High Permanent Low Toggle Pulse X X X X X X Single Tap X X X X Double Tap X X X X Gesture Touch Approach AirWheel  2012-2017 Microchip Technology Inc.
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MGC3030/3130 5.5 Communication Interfaces The MGC3X30 offer an I2C™ interface for communicating with an application host.
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MGC3030/3130 I2C master receives eight data bits (MSB first) presented on SDA by the MGC3X30, at eight sequential I2C master clock (SCL) cycles. The data is latched out on SCL falling edges to ensure it is valid during the subsequent SCL high time. 7. If data transfer is not complete, then: - I2C master acknowledges (ACK) reception of the eight data bits by presenting a low on SDA, followed by a low-high-low on SCL. - Go to step 5. 8.
PAGE 32
MGC3030/3130 TABLE 5-9: USAGE OF TRANSFER STATUS LINE MGC3X30 Host Controller TS Line Status Released (H) Released (H) High Host finished reading data (Transfer end). No more data to be transferred to the host. MGC3X30 is allowed to update the data buffer. Asserted (L) Released (H) Low Data from MGC3X30 is available to be sent, but the host has not yet started reading.
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 2012-2017 Microchip Technology Inc.
PAGE 34
MGC3030/3130 6.0 APPLICATION ARCHITECTURE The standard MGC3X30 implementation is a singlezone design. This configuration is based on one MGC3X30 connected to an application host via I2C™ with MGC3X30 being Slave and Application Host being Master. The following lines are needed for full I2C communication (see Figure 6-1). Data reporting and flow-control scenarios described below for I2C communication: 6.4 Reference Schematic (3.3V VDD  3.
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MGC3030/3130 FIGURE 6-2: REFERENCE SCHEMATIC FOR MGC3X30 NC NC EIO7 R11 (10 kɏ) R12 (10 kɏ) SI1 MGC3X30 RX2 R3 SI0 RX1 1.8 kɏ RX0 R2 MCLR 1.8 kɏ EIO6 VDD TXD R10 (10 kɏ) South Electrode SDA RESET EIO0 RX3 GPIO/IRQ 10 kɏ R4 EXP1 VCAPA VDD IS2 4.7 μF VSS3 C2 4.7 μF VCAPD VCAPS C3 100 nF R7 (n.p) C1 R5 (n.
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MGC3030/3130 TABLE 6-1: BILL OF MATERIALS Label Qty Value R1, R4, R5, R6, R7, R8 3 10 k Res Thick Film 10 k C1 1 100 nF Capacitor – Ceramic, 0.1 µF, 10%, 6.3V C2 1 4.7 µF Capacitor – Ceramic, 4.7 µF, 10%, 6.3V C3 1 4.7 µF Capacitor – Ceramic, 4.7 µF, 10%, 6.3V R2, R3 2 1.8 k Res Thick Film 1.8 k R9, R10, R11, R12, R13 5 10 k Res Thick Film 10 k 6.
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MGC3030/3130 7.0 DEVELOPMENT SUPPORT Microchip provides software and development tools for the MGC3X30: hardware • Software: - Aurea Software Package - MGC3030/3130 Software Development Kit - MGC3030/3130 Host Reference Code • Schematics: - GestIC® Hardware References • Evaluation and Development Kits: - MGC3130 Hillstar Development Kit (DM160218) - MGC3030 Woodstar Development Kit (DM160226) 7.1 7.
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MGC3030/3130 7.5 Evaluation and Demonstration Kits A variety of demonstration, development and evaluation boards allow quick application development on fully-functional systems. The demonstration and development boards can be used in teaching environments, for prototyping custom circuits and for learning about various GestIC MGC3130 applications. The first development board is the Hillstar Development Kit.
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MGC3030/3130 8.0 ELECTRICAL SPECIFICATIONS 8.1 Absolute Maximum Ratings(†) Ambient temperature under bias......................................................................................................... -20°C to +85°C Storage temperature ........................................................................................................................ -55°C to +125°C Voltage on pins with respect to VSS on VDD pin ..............................................................................
PAGE 40
MGC3030/3130 9.0 PACKAGING INFORMATION 9.1 Package Marking Information 28-Lead QFN (5x5x0.9 mm) PIN 1 Example PIN 1 28-Lead SSOP (5.30 mm) MGC3130 MQ e3 1318017 Example MGC3030 SS e3 1318017 Legend: XX...
PAGE 41
MGC3030/3130 9.2 Package Details The following sections give the technical details of the packages. 28-Lead Plastic Quad Flat, No Lead Package (MQ) – 5x5x0.9 mm Body [QFN or VQFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A B N NOTE 1 1 2 E (DATUM B) (DATUM A) 2X 0.10 C 2X TOP VIEW 0.10 C 0.10 C C SEATING PLANE A1 A 28X A3 SIDE VIEW 0.08 C 0.10 C A B D2 0.
PAGE 42
MGC3030/3130 28-Lead Plastic Quad Flat, No Lead Package (MQ) – 5x5x0.9 mm Body [QFN or VQFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units Dimension Limits Number of Pins N e Pitch Overall Height A Standoff A1 Contact Thickness A3 Overall Width E Exposed Pad Width E2 Overall Length D Exposed Pad Length D2 b Contact Width Contact Length L Contact-to-Exposed Pad K MIN 0.80 0.00 3.15 3.15 0.18 0.35 0.
PAGE 43
MGC3030/3130 28-Lead Plastic Quad Flat, No Lead Package (MQ) – 5x5 mm Body [QFN] Land Pattern With 0.55 mm Contact Length Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Microchip Technology Drawing C04-2140A  2012-2017 Microchip Technology Inc.
PAGE 44
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PAGE 45
MGC3030/3130 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2012-2017 Microchip Technology Inc.
PAGE 46
MGC3030/3130 APPENDIX A: DATA SHEET REVISION HISTORY Revision A (11/2012) Initial release of this data sheet. Revision B (08/2013) Updated the Power Features section; Updated Table 1; Updated section 2, Feature Description; Updated section 4.2.
PAGE 47
MGC3030/3130 THE MICROCHIP WEBSITE CUSTOMER SUPPORT Microchip provides online support via our website at www.microchip.com. This website is used as a means to make files and information easily available to customers.
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MGC3030/3130 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. [X](1) PART NO.
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Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature.
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