User Manual

MGC3030/3130
DS40001667E-page 36 Advance Information  2012-2017 Microchip Technology Inc.
6.5 Layout Recommendation
This section will provide a brief description of layout
hints for a proper system design.
The PCB layout requirements for MGC3X30 follow the
general rules for a mixed signal design. In addition,
there are certain requirements to be considered for the
sensor signals and electrode feeding lines.
The chip should be placed as close as possible to the
electrodes to keep their feeding lines as short as
possible. Furthermore, it is recommended to keep
MGC3X30 away from electrical and thermal sources
within the system.
Analog and digital signals should be separated from
each other during PCB layout in order to minimize
crosstalk.
The individual electrode feeding lines should be kept as
far as possible apart from each other.
V
DD lines should be routed as wide as possible.
MGC3X30 requires a proper ground connection on all
VSS pins, including the exposed pad (pin 29).
TABLE 6-1: BILL OF MATERIALS
Label Qty Value Description
R1, R4, R5, R6, R7, R8 3 10 k Res Thick Film 10 k
C1 1 100 nF Capacitor – Ceramic, 0.1 µF, 10%, 6.3V
C2 1 4.7 µF Capacitor – Ceramic, 4.7 µF, 10%, 6.3V
C3 1 4.7 µF Capacitor – Ceramic, 4.7 µF, 10%, 6.3V
R2, R3 2 1.8 k Res Thick Film 1.8 k
R9, R10, R11, R12, R13 5 10 k Res Thick Film 10 k