Datasheet

Datasheet [Page 25]
EMW3166
 The antistatic, high temperature resistant tray
 The antistatic high temperature resistant gloves
 Storage conditions as follows
 Moisture bag must be stored in a temperature < 30 ° C, humidity 85% RH of the environment.
 Dry packaging products, the guarantee period should be from 6 months from the date of packing seal.
 Sealed packaging is equipped with humidity indicator card, as shown in Figure13.
 Humidity indicator CARDS and baking several ways as follows:
Figure 13 Temperature and humidity indicator CARDS
 When opened, if the temperature and humidity indicator CARDS read 10%, 20%, 30%,40% three color
ring are blue, to continue to bake for 2 hours for module;
 When opened, if the humidity indicator CARDS read 10% color ring into pink, need to continue to bake
module 4 hours;
 When opened, if the humidity indicator CARDS read into 10%, 20%, color ring into pink, need to
continue to bake for 6 hours module;
 When opened, if the humidity indicator CARDS read into 10%, 20%, 30% are pink color ring, need to
continue to bake for 12 hours module;
 When opened, if the humidity indicator CARDS read into 10%, 20%, 30% ,40%are pink color ring, need
to continue to bake for 14 hours module;
 Baking parameters are as follows:
 Baking temperature: 125 ℃ + / - 5 ℃;
 Set the alarm temperature as 130 ℃;
 Under the condition of natural cooling < 36 ℃, SMT placement can be made;
 Dry times: 1 times;
 If opened the time more than 3 months, please ban the use of SMT process welding this batch module,
zedoary because PCB process, more than 3 months bonding pad oxidation, SMT is likely to cause virtual
welding, welding, the resulting problems we do not assume corresponding responsibility.
 Please to ESD（static discharge，static electricity discharge） protection module before SMT;
 Please according to the SMT reflow soldering curve, peak temperature 245 ℃, reflow
soldering,temperature curve as shown in figure 14, section 7.6;
 For the first time in order to ensure the qualified rate of reflow soldering, first SMT please extraction 10%
product to visual analysis, AOI inspection, to ensure that the furnace temperature control, device adsorption
method, the rationality of the put way; Suggestions：when batch production per hour 5-10 pieces of visual
analysis, AOI test;