Data Sheet

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4.4 Reflow Soldering
4.4.1 When PCBA which is mounted with Bluetooth module and it enters reflow,
please strictly ensure PCBA boards to pass through furnace via track path. Passing
through furnace via the net cover of reflow oven is prohibited.
Since Bluetooth contains BGA elements, the net cover vibration may lead to high
rates of BGA solder welding defects.
4.4.2 During reflow, if it is not double-side board, it shouldn’t place the side which
is mounted Bluetooth as the first side to proceed. Mounting Bluetooth on the second
Sid is suggested. Note: During reflow, since BGA type components are downwards,
BGA solder joints are stretched. This may lead to the vulnerability of solder joints. It
may eventually result in the brokenness of solder joints and other hidden dangers
under the influence of external forces.
4.4.3 Interference Design which may lead to offset of module’s elements should
be avoided during reflow soldering technique design (i.e. designing furnace jig).
4.4.4 No need to add red glue or other adhesive on the lower part of module.
Module recommended pad design can ensure the good solder ability of module PIN
foot. Even for any special reason, modules are designed on the first side and need to
be reflowed.