Data Sheet

W M B T 0 1 ( - s , - s c ) D a t a s h e e t
24
/
36
4.5 Wave soldering of PCBA after module is mounted
4.5.1 If process requirements require PCBA which is mounted with modules do
wave soldering, please ensure special protection to the module in order to prevent its
elements from soldering shortcut or other unpredictable hidden risks which may be
caused by splash or other abnormity during wave soldering.
4.5.2 Wave soldering on PCBA which is mounted with module is not
recommended. Pls wave soldering PCBA at the first and then manually soldering
module on it.
4.6 Manual welding of other elements after module is mounted on PCBA
4.6.1 If some elements needs to be manually soldered onto PCBA after PCBA is
mounted with module, such as welding wires, please protect the module with the
cover during manual welding process, especially when the manual welding area is
close to the module.
4.6.2 PCBA should be placed in the upper part of the manual welding bench, or
quickly flows to the next bench. It is not suggested to place it in the lower part of
welding bench, such as under welding bench.
5. Repair Instructions
5.1 The process of rework depends on the condition of repair.
The recommended repair method in this document is not the only method. The
selection of repair operations depends on the actual hardware, and it should follow
the basic technique requirements during repair.
5.2 Repair Technique Instruction
5.2.1 No matter it is disassembly or welding, repairing requires for the condition
of the temperature ascension requirement ≤3°C /sec, highest temperature≤260°C
5.2.2 If repair elements exceed the storage period, it needs drying (refers to Table
2-1) before repairing
5.3 Module Disassembly
5.3.1 When disassembly, melting and reflowing soldering flux by proving fast,
controllable and even heating. It ensures all solder joints melt at the same time.
When disassembly, it should avoid any thermal or mechanical damage to modules,
PCB, adjacent elements, and their solder joints.
5.3.2 It is recommended to adopt infrared heating or hot air heating method; It is
recommended to design & use special jig for module disassembly or pickup
5.4 Module Welding/Replacement