Data Sheet

W M B T 0 1 ( - s , - s c ) D a t a s h e e t
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5.4.1 Preparation Before Welding：
5.4.1.1 Using irons and woven materials which are able to moisten soldering flux
to remove the old soldering flux on soldering pad.
5.4.1.2 Cleaning pad & remove flux residues
5.4.1.3 Soldering flux pre-fill：Before module is installed into the board, using the
appropriate way to add soldering tin on solder pads, it ensures the closeness of the
height of solder paste after it melts and re-solidifies.
5.4.1.4 It is suggested to make jig or small printed tin steel mesh to repair solder
paste printing
5.4.2 Installing modules into solder pads and ensure the correction of its direction.
In order to ensure the temperature of each assembly element stays same during
reflow, it is suggested to preheat modules. After heating soldering flux, it reflows to
ensure reliable connection. When the solder joint maintains the appropriate reflow
time at a predetermined temperature, it forms better IMC.
5.4.3 When the module is installed into the pad after printing, it is suggested to
use special jig to pick it up.
5.4.4 Special repair equipment is recommended to be either selected or designed
for repairing.