Data Sheet

Datasheet SHT3x-DIS
www.sensirion.com May 2018- Version 5 16/22
5 Packaging
SHT3x-DIS sensors are provided in an open-cavity DFN
package. DFN stands for dual flat no leads. The humidity
sensor opening is centered on the top side of the
package.
The sensor chip is made of silicon and is mounted to a
lead frame. The latter is made of Cu plated with
Ni/Pd/Au. Chip and lead frame are overmolded by an
epoxy-based mold compound leaving the central die pad
and I/O pins exposed for mechanical and electrical
connection. Please note that the side walls of the sensor
are diced and therefore these diced lead frame surfaces
are not covered with the respective plating.
The package (except for the humidity sensor opening)
follows JEDEC publication 95, design registration 4.20,
small scale plastic quad and dual inline, square and
rectangular, No-LEAD packages (with optional thermal
enhancements) small scale (QFN/SON), Issue D.01,
September 2009.
SHT3x-DIS has a Moisture Sensitivity Level (MSL) of 1,
according to IPC/JEDEC J-STD-020. At the same time,
it is recommended to further process the sensors within
1 year after date of delivery.
5.1 Traceability
All SHT3x-DIS sensors are laser marked for easy
identification and traceability. The marking on the sensor
top side consists of a pin-1 indicator and two lines of text.
The top line consists of the pin-1 indicator which is
located in the top left corner and the product name. The
small letter x stands for the accuracy class.
The bottom line consists of 6 letters. The first two digits
XY (=DI) describe the output mode. The third letter (A)
represents the manufacturing year (4 = 2014, 5 = 2015,
etc). The last three digits (BCD) represent an
alphanumeric tracking code. That code can be decoded
by Sensirion only and allows for tracking on batch level
through production, calibration and testing – and will be
provided upon justified request.
If viewed from below pin 1 is indicated by triangular
shaped cut in the otherwise rectangular die pad. The
dimensions of the triangular cut are shown in Figure 14
through the labels T1 & T2.
Figure 13 Top view of the SHT3x-DIS illustrating the laser
marking.
SHT
3
x
XYABCD