Data Sheet

Datasheet SHT3x-DIS
www.sensirion.com May 2018- Version 5 18/22
Figure 15 Recommended metal land pattern (left) and stencil apertures (right) for SHT3x-DIS. The dashed lines represent the outer
dimension of the DFN package. The PCB pads (left) and stencil apertures (right) are indicated through the shaded areas.
6 Shipping Package
Figure 16 Technical drawing of the packaging tape with sensor orientation in tape. Header tape is to the right and trailer tape to the
left on this drawing. Dimensions are given in millimeters.
Recommended Land Pattern Recommended Stencil Aperture
1.7
0.25
0.55 1
0.5 0.5 0.5
2.35
0.2
0.9
1.6
0.5 0.5 0.5
0.25
0.55
2.55
0.3
TOLERANCES - UNLESS
NOTED 1PL ±.2 2PL ±.10
A = 2.75
B = 2.75
K = 1.20
0
0
0
NOTES:
1. 10 SPROCKET HOLE PITCH CUMULATIVE TOLERANCE ±0.2
2. POCKET POSITION RELATIVE TO SPROCKET HOLE MEASURED
AS TRUE POSITION OF POCKET, NOT POCKET HOLE
3. A0 AND B0 ARE CALCULATED ON A PLANE AT A DISTANCE "R"
ABOVE THE BOTTOM OF THE POCKET
A
0
K
0
B
0
R 0.25 TYP.
SECTION A - A
0.30 ±.05
A
R 0.2 MAX.
0.30 ±.05
2.00 ±.05 SEE Note 2
4.00
4.00 SEE Note 1
Ø1.5 +.1 /-0.0
Ø1.00 MIN
1.75 ±.1
12.0 +0.3/-0.1
5.50 ±.05
SEE NOTE 2
A
B
DETAIL B