Data Sheet

DocID024849 Rev 2 91/96

STM32F030x4/6/8/C Package characteristics

Figure 36. TSSOP20 - 20-pin thin shrink small outline

1. Drawing is not to scale.

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Table 62. TSSOP20 - 20-pin thin shrink small outline package mechanical data

Symbol

millimeters inches

(1)

Min Typ Max Min Typ

A - 1.2 - - 0.0472

A1 0.05 - 0.15 0.002 - 0.0059

A2 0.8 1 1.05 0.0315 0.0394 0.0413

b 0.19 0.3 0.0075 - 0.0118

c 0.09 0.2 0.0035 - 0.0079

(2)

6.4 6.5 6.6 0.252 0.2559 0.2598

E 6.2 6.4 6.6 0.2441 0.252 0.2598

(3)

4.3 4.4 4.5 0.1693 0.1732 0.1772

e - 0.65 - - 0.0256 -

L 0.45 0.6 0.75 0.0177 0.0236 0.0295

L1 - 1 - - 0.0394 -

k 0.0° - 8.0° 0.0° - 8.0°

aaa - - 0.1 - - 0.0039

1. Values in inches are converted from mm and rounded to 4 decimal digits.

2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed

0.15mm per side.

3. Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25mm per

side.