Product Data Sheet SDWx2F1C – Chip on Board Enable High Flux and Cost Efficient System Z Power Chip on board – ZC series SDW*2F1C (SDW02F1C, SDW82F1C, SDW92F1C) LM-80 MacAdam 3-Step RoHS Product Brief Description Features and Benefits • The ZC series are LED arrays which provide High Flux and High Efficacy. • It is especially designed for easy assembly of lighting fixtures by eliminating reflow soldering process.
Product Data Sheet SDWx2F1C – Chip on Board Table of Contents Index • Product Brief 1 • Product Performance & Characterization Guide 3 • Characteristics Graph 6 • Product Nomenclature (Labeling Information) 14 • Color Bin Structure 15 • Mechanical Dimensions 20 • Packaging Specification 21 • Handling of Silicone Resin for LEDs 23 • Precaution For Use 24 • Company Information 27 Rev5.0, October 29, 2014 2 www.seoulsemicon.
Product Data Sheet SDWx2F1C – Chip on Board Product Performance & Characterization Guide Table 2. Electro Optical Characteristics, Tj=25ºC CCT (K) Part Number [1] Typical Luminous Flux [2], ФV [3] (lm) Typical Forward Voltage, VF [4] (V) CRI [5], Ra Viewing Angle (degrees) 2Θ ½ Typ. 350mA 690mA* 350mA 690mA* Min. Typ. 5600 1830 3267 35.6 37.9 70 120 5000 1839 3282 35.6 37.9 70 120 4500 1878 3352 35.6 37.9 70 120 4000 1890 3373 35.6 37.9 70 120 5600 1650 2940 35.
Product Data Sheet SDWx2F1C – Chip on Board Product Performance & Characterization Guide Table 3. Electro Optical Characteristics, Tj=85ºC CCT (K) [1] Typical Luminous Flux [2], ФV [3] (lm) Typical Forward Voltage, VF [4] (V) Typ. 350mA * 350mA * 5600 1647 34.1 5000 1655 34.1 4500 1690 34.1 4000 1701 34.1 5600 1469 34.1 5000 1495 34.1 4000 1415 34.1 3500 1375 34.1 3000 1362 34.1 2700 1317 34.1 4000 1205 34.1 3500 1148 34.1 3000 1127 34.1 2700 1070 34.
Product Data Sheet SDWx2F1C – Chip on Board Product Performance & Characterization Guide Table 4. Absolute Maximum Characteristics, Tj=25ºC Value Parameter Symbol Unit Min. Typ. Max. Forward Current IF - 0.35 0.69 A Power Dissipation Pd - 12.6 27.6 W Junction Temperature Tj - - 140 ºC Operating Temperature Topr -40 - 85 ºC Surface Temperature TS - - 100 ºC Storage Temperature Tstg -40 - 100 ºC Thermal resistance (J to S) [1] RθJ-S - 0.
Product Data Sheet SDWx2F1C – Chip on Board Characteristics Graph Fig 1. Color Spectrum, Tj=25℃, IF=350mA (CRI70) 120 CRI70(5000K) CRI70(4000K) Relative Intensity(%) 100 80 60 40 20 0 400 450 500 550 600 650 700 750 800 Wavelength (nm) Fig 2. Color Spectrum, Tj=25℃, IF=350mA (CRI80) 120 CRI80(5000K) CRI80(4000K) CRI80(3000K) Relative Intensity(%) 100 80 60 40 20 0 400 450 500 550 600 650 700 750 800 Wavelength (nm) Rev5.0, October 29, 2014 6 www.seoulsemicon.
Product Data Sheet SDWx2F1C – Chip on Board Characteristics Graph Fig 3. Color Spectrum, Tj=25℃, IF=350mA (CRI90) 120 CRI90(4000K) CRI90(2700K) Relative Intensity(%) 100 80 60 40 20 0 400 450 500 550 600 650 700 750 800 Wavelength (nm) Rev5.0, October 29, 2014 7 www.seoulsemicon.
Product Data Sheet SDWx2F1C – Chip on Board Characteristics Graph Fig 4. Radiant pattern, Tj=25℃, IF=350mA Relative Intensity (%) 100 75 50 25 0 -100 -75 -50 -25 0 25 50 75 100 Angle (Degrees) Rev5.0, October 29, 2014 8 www.seoulsemicon.
Product Data Sheet SDWx2F1C – Chip on Board Characteristics Graph Fig 5. Forward Voltage vs. Forward Current, Tj=25℃ 0.7 0.6 Current (A) 0.5 0.4 0.3 0.2 0.1 0.0 28 30 32 34 36 38 40 Voltage (V) Fig 6. Forward Current vs. Relative Luminous Flux, T j=25℃ Relative Luminous Flux (%) 200 160 120 80 40 0.2 0.3 0.4 0.5 0.6 0.7 Foward Current (A) Rev5.0, October 29, 2014 9 www.seoulsemicon.
Product Data Sheet SDWx2F1C – Chip on Board Characteristics Graph Fig 7. Junction Temperature vs. Relative Light Output, IF=350mA Relative luminous flux (%) 120 100 80 60 40 20 0 25 50 75 100 125 150 o Junction Temperature ( C) Fig 8. Junction Temperature vs. Forward Voltage, IF=350mA 0.5 Foward Voltage (V) 0.0 -0.5 -1.0 -1.5 -2.0 -2.5 -3.0 25 50 75 100 125 150 o Junction Temperature( C) Rev5.0, October 29, 2014 10 www.seoulsemicon.
Product Data Sheet SDWx2F1C – Chip on Board Characteristics Graph Fig 9. Junction Temperature vs. CIE X, Y Shift, IF=350mA (CRI70) 0.03 CIE X(5000K) CIE Y(5000K) Relative Variation 0.02 0.01 0.00 -0.01 -0.02 -0.03 20 40 60 80 100 120 140 o Jinction Temperature( C) Fig 10. Junction Temperature vs. CIE X, Y Shift, IF=350mA (CRI90) 0.03 CIE X(3000K) CIE Y(3000K) Relative Variation 0.02 0.01 0.00 -0.01 -0.02 -0.03 20 40 60 80 100 120 140 o Junction Temperature( C) Rev5.
Product Data Sheet SDWx2F1C – Chip on Board Characteristics Graph Fig 11. Junction Temperature vs. CIE X, Y Shift, IF=350mA (CRI80) 0.03 CIE X(5000K) CIE Y(5000K) Relative Variation 0.02 0.01 0.00 -0.01 -0.02 -0.03 20 40 60 80 100 120 140 o Junction Temperature ( C) 0.03 CIE X(3000K) CIE Y(3000K) Relative Variation 0.02 0.01 0.00 -0.01 -0.02 -0.03 20 40 60 80 100 120 140 o Junction Temperature ( C) Rev5.0, October 29, 2014 12 www.seoulsemicon.
Product Data Sheet SDWx2F1C – Chip on Board Characteristics Graph Fig 12. Surface Temperature vs. Maximum Forward Current, Tj(max.)=140℃ Maximum Current (A) 0.8 0.6 0.4 0.2 0.0 20 40 60 80 100 120 o Surface Temperature ( C) Rev5.0, October 29, 2014 13 www.seoulsemicon.
Product Data Sheet SDWx2F1C – Chip on Board Product Nomenclature Table 5. Part Numbering System : X1X2X3 X4X5 X6X7 X8 Part Number Code Description Part Number Value X1 Company S X2 Package series D X3X4 Color Specification W0 CRI 70 W8 CRI 80 W9 CRI 90 X5 Series number 2 X6 Lens type F Flat X7 PCB type 1 PCB X8 Revision number C New COB type Table 6.
Product Data Sheet SDWx2F1C – Chip on Board Color Bin Structure CIE Chromaticity Diagram 0.42 Y 0.39 0.36 0.33 0.33 0.36 0.39 0.42 0.45 0.48 X Rev5.0, October 29, 2014 15 www.seoulsemicon.
Product Data Sheet SDWx2F1C – Chip on Board Color Bin Structure CIE Chromaticity Diagram, Tj=25℃, IF=350mA 0.38 4700K 5000K C1 5300K C0 0.36 5600K B1 C2 B0 B3 C4 B2 B5 Y 6000K 0.34 C3 C5 B4 0.32 0.32 0.34 0.36 X B0 B1 B2 CIE x CIE y CIE x CIE y CIE x CIE y 0.3207 0.3462 0.3292 0.3539 0.3212 0.3389 0.3212 0.3389 0.3293 0.3461 0.3217 0.3316 0.3293 0.3461 0.3373 0.3534 0.3293 0.3384 0.3292 0.3539 0.3376 0.3616 0.3293 0.
Product Data Sheet SDWx2F1C – Chip on Board Color Bin Structure CIE Chromaticity Diagram, Tj=25℃, IF=350mA 3700K 0.40 4000K E22 4200K E21 E11 4500K 0.38 Y E10 D22 4700K E24 D21 D11 E23 D10 0.36 D24 D23 0.34 0.34 ANSI MacAdam 3-STEP MacAdam 4-STEP 0.36 0.38 0.40 X 3-STEP 4-STEP D10 E10 D11 E11 CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y 0.3589 0.3685 0.3764 0.3713 0.3560 0.3557 0.3746 0.3689 0.3665 0.3742 0.3793 0.3828 0.3580 0.3697 0.3784 0.3841 0.3637 0.
Product Data Sheet SDWx2F1C – Chip on Board Color Bin Structure CIE Chromaticity Diagram, Tj=25℃, IF=350mA 0.44 3000K 0.42 3500K 0.40 H10 G11 G10 F21 F11 F10 H22 H11 G22 G21 F22 3700K Y H21 2100K 2600K 2700K 2900K G24 G23 H24 H23 F24 0.38 F23 ANSI MacAdam 3-STEP MacAdam 4-STEP 0.36 0.38 0.40 0.42 0.44 0.46 0.48 X 3-STEP F10 4-STEP G10 H10 F11 G11 H11 CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y 0.4006 0.3829 0.4267 0.3946 0.
Product Data Sheet SDWx2F1C – Chip on Board Color Bin Structure Table 7. Bin Code description Luminous Flux (lm) @ IF = 350mA Part Number Bin Code Min. Max. G1 1400 1600 SDW02F1C SDW82F1C SDW92F1C Color Chromaticity Coordinate @ IF = 350mA Typical Forward Voltage (Vf) @ IF = 350mA Bin Code Min. Max. D 32.0 34.0 E 34.0 38.0 Refer to page.15~17 G2 1600 1800 H1 1800 2400 F 38.0 40.0 F2 1250 1400 D 32.0 34.0 G1 1400 1600 E 34.0 38.0 G2 1600 1800 F 38.0 40.
Product Data Sheet SDWx2F1C – Chip on Board Mechanical Dimensions Circuit S2 Cathode Ts X 12 X 12 X 12 Anode Notes : (1) All dimensions are in millimeters. (2) Scale : none (3) Undefined tolerance is ±0.2mm Rev5.0, October 29, 2014 20 www.seoulsemicon.
Product Data Sheet SDWx2F1C – Chip on Board Packaging Specification Notes : (1) Quantity : 20pcs/Tray (2) All dimensions are in millimeters (tolerance : ±0.3) (3) Scale none Rev5.0, October 29, 2014 21 www.seoulsemicon.
Product Data Sheet SDWx2F1C – Chip on Board Packaging Specification Notes : (1) Heat Sealed after packing (Use Zipper Bag) (2) Quantity : 3Tray(60pcs) /Bag Rev5.0, October 29, 2014 22 www.seoulsemicon.
Product Data Sheet SDWx2F1C – Chip on Board Handling of Silicone Resin for LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched.
Product Data Sheet SDWx2F1C – Chip on Board Precaution for Use (1) Storage To avoid the moisture penetration, we recommend storing Power LEDs in a dry box with a desiccant. The recommended storage temperature range is 5℃ to 30℃ and a maximum humidity of 50%. (2) Use Precaution after Opening the Packaging. Pay attention to the following: a. Recommend conditions after opening the package - Sealing - Temperature : 5 ~ 40℃ Humidity : less than RH30% b.
Product Data Sheet SDWx2F1C – Chip on Board Precaution for Use (11) Long time exposure of sun light or occasional UV exposure will cause silicone discoloration. (12) Attaching LEDs, do not use adhesive that outgas organic vapor. (13) The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the reverse voltage is applied to LED, migration can be generated resulting in LED damage.
Product Data Sheet SDWx2F1C – Chip on Board Precaution for Use Ⅱ. EOS (Electrical Over Stress) Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is subjected to a current or voltage that is beyond the maximum specification limits of the device.
Product Data Sheet SDWx2F1C – Chip on Board Company Information Published by Seoul Semiconductor © 2013 All Rights Reserved. Company Information Seoul Semiconductor (www.SeoulSemicon.com) manufacturers and packages a wide selection of light emitting diodes (LEDs) for the automotive, general illumination/lighting, Home appliance, signage and back lighting markets.
