Z-Power LED X10490 Technical Data Sheet Specification SFT722N-S SSC Drawn Approval CUSTOMER Approval Rev. 05 September 2009 www.ZLED.com 서식번호 : SSC-QP-7-07-24 (Rev.
Z-Power LED X10490 Technical Data Sheet CONTENTS 1. Feature & Application 2. Absolute Maximum Ratings 3. Electro Characteristics 4. Optical characteristics 5. Color & Binning 6. Rank of SFT722N-S 7. Outline Dimension 8. Packing 9. Lot Number 10. Soldering 11. Precaution for use 12. Reliability Test Item and Condition Rev. 05 September 2009 www.ZLED.com 서식번호 : SSC-QP-7-07-24 (Rev.
Z-Power LED X10490 Technical Data Sheet SFT722N-S Description This surface-mount LED comes in PLCC standard package dimension. It has a substrate made up of a molded plastic reflector sitting on top of a bent lead frame. The die is attached within the reflector cavity and the cavity is encapsulated by epoxy or silicone. The package design coupled with careful selection of component materials allow these products to perform with high reliability in a larger temperature range -40℃ to 100℃.
Z-Power LED X10490 Technical Data Sheet 2.
Z-Power LED X10490 Technical Data Sheet 3. Electric & Optical characteristics Parameter Symbol Red Forward Voltage Green VF Blue Red Reverse Current Green IR Blue Red Luminance Intensity *1 Green IV Blue *3 2.1 2.3 IF =20mA 3.0 3.2 3.8 IF =20mA 3.0 3.2 3.
Forward Current vs. Forward Voltage (per die) (Ta=25 OC ) 100 G re e n B lu e 50 Red 20 10 5 1 1 .6 2 .0 2 .4 2 .8 3 .2 3 .6 4 .0 4 .4 4 .8 F o rw a rd V o lta g e V F [V ] Relative Luminous Intensity vs Forward Current (Ta=25 OC ) 6 RED BLUE GREEN 5 Relative Luminosity (a.u.) Forward Current IFP [mA] Z-Power LED X10490 Technical Data Sheet 4. Optical characteristics 4 3 2 1 0 0 20 40 60 80 100 120 Forward Current IFP [mA] Rev. 05 September 2009 www.ZLED.
Ambient Temperature vs. Power Dissipation 280 260 3 CHIP ON 240 220 200 180 Power Dissipation PD(mW) Z-Power LED X10490 Technical Data Sheet 4. Optical characteristics 160 140 120 100 1 CHIP ON 80 60 40 20 0 0 20 40 60 80 100 Ambient Temperature Ta [OC] Radiation Diagram (Ta=25 OC ) 0 -30 -60 -90 30 60 90 Rev. 05 September 2009 www.ZLED.com 서식번호 : SSC-QP-7-07-24 (Rev.
Spectrum (TA=25℃, IF=20mA/chip) 1.0 Relative Intensity [a.u.] Z-Power LED X10490 Technical Data Sheet 4. Optical characteristics RED GREEN BLUE 0.8 0.6 0.4 0.2 0.0 400 500 600 700 800 Wavelength [nm] Rev. 05 September 2009 www.ZLED.com 서식번호 : SSC-QP-7-07-24 (Rev.
Z-Power LED X10490 Technical Data Sheet 5. Color & Binning 0.9 0.8 0.7 0.6 y 0.5 0.4 Green 520 525 515 530 535 540 510 545 550 555 505 560 565 570 500 575 580 585 590 495 595 600 0.3 0.2 A B Red 610 620 630 830 490 485 Bluish White 0.1 475 2 Blue 470460 1 480 0.0 0.0 0.1 0.2 0.3 0.4 0.5 x 0.6 0.7 0.8 0.9 Rev. 05 September 2009 www.ZLED.com 서식번호 : SSC-QP-7-07-24 (Rev.
0.30 g h 0.28 e f 0.26 y Z-Power LED X10490 Technical Data Sheet 5. Color & Binning c d 0.24 0.20 b a 0.22 0.22 0.24 0.26 0.28 0.30 x Rev. 05 September 2009 www.ZLED.com 서식번호 : SSC-QP-7-07-24 (Rev.
Z-Power LED X10490 Technical Data Sheet 6. Rank of SFT722N-S 1) Rank Name X1 Total Iv X2 Green Color X3 Blue Color X4 White Color 2) Test Condition Parameter Sy mbol Forward Current Reverse Voltage If Vr 3) Luminous Intensity [Iv ] R MIN MAX 460 1100 Rank Name N O P R 20 10 Value G 20 10 MAX 1600 MIN 200 G MIN 800 Total Iv MIN 1460 1900 2500 MAX 1900 2500 2880 4) Forward Voltage [Vf] R MIN MAX 1.8 2.3 MIN 3.
Z-Power LED X10490 Technical Data Sheet 7.Outline Dimension Package Outlines 5 6 Package Marking (Cathode) 4 1 2 3 Front View Right View Rear View ( Tolerance: ±0.2, Unit: mm ) Recommended Solder Pad Circuit Diagram Blue Anode Green Anode Red Anode 6 5 4 1 2 3 Green Cathode Red Cathode Blue Cathode * MATERIALS PARTS MATERIALS Package Heat-Resistant Polymer Encapsulating Resin Silicone Resin Electrodes Ag Plating Copper Alloy Rev. 05 September 2009 www.ZLED.
Z-Power LED X10490 Technical Data Sheet 8. Packing Package Marking ( Tolerance: ±0.2, Unit: mm ) (1)Quantity : 700 pcs/Reel (2)Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3)Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4)Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package Rev. 05 September 2009 www.ZLED.
Z-Power LED X10490 Technical Data Sheet ● Reel Packing Structure Reel QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. HUMIDITY INDICATOR DESI PAK Aluminum Vinyl Bag QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. Outer Box Structure Material : Paper(SW3B(B)) SIZE (mm) c a b 245 220 102 7inch 245 220 142 TYPE 1 SIDE c TUV QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD.
Z-Power LED X10490 Technical Data Sheet 9. Lot Number The lot number is composed of the following characters; SFT○□□◎◎ # ~ # SFT –First Part Name ○– Year (6 for 2006, 7 for 2007, 8 for 2008 ) □□ – Month ( 01 for Jan., 02 for Feb.,‥‥‥11 for Nov., 12 for Dec.) ◎◎ – Day ( 01, 02, 03, 04, ‥‥‥‥‥‥28, 29, 30, 31.) # ~# – The number of the internal quality control XXX QUANTITY : 700 LOT NUMBER : SFT70426 01 512 PART NUMBER : SFT722N-S SEOUL SEMICONDUCTOR CO., LTD. Rev. 05 September 2009 www.ZLED.
Z-Power LED X10490 Technical Data Sheet 10. Soldering (1) Reflow Soldering Conditions / Profile Lead Solder 1~5 oC / sec. Lead Solder Pre-heat 130~210℃ Pre-heat time 120 sec. Max. Peak-Temperature 240℃ Max. Soldering time Condition 10 sec. Max. 1~5 oC / sec. Pre-heating 130~210oC 240 oC Max. 10 sec. Max. cooling 6oC/sec. Max. 60sec. Max. Above 210oC 120sec. Max. Lead Free Solder Lead Free Solder Pre-heat 180~200℃ Pre-heat time 120 sec. Max. Peak-Temperature 260℃ Max.
Z-Power LED X10490 Technical Data Sheet 11. Precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 70%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop.
Z-Power LED X10490 Technical Data Sheet 12.
