Data Sheet
Table Of Contents
- Datasheet
- Preface
- About this Datasheet
- Product Features
- Regulatory Approval
- Physical Characteristics
- 3.1 ECCN and Part Number
- 3.2 Electrical Operating Conditions
- 3.3 Environmental Operating Conditions
- 3.4 Power Supply Dimensioning
- 3.5 I/O Characteristics
- 3.6 Auxiliary ADC
- 3.7 Performance
- 3.8 Component Reliability
- 3.9 Package Description
- 3.10 Packing Information
- 3.11 Storage Conditions
- 3.12 Mounting Considerations
- Signal and Pins
- Acronyms
PHYSICAL CHARACTERISTICS
STORAGE CONDITIONS
21 PROPRIETARY GM01Q DATASHEET
SEQUANS Communications
3.11 Storage Conditions
Note: Additional storage conditions impacting the mounting process
are provided in Section 3.12 Mounting Considerations on page 22.
The module is MSL3 compliant.
1. Calculated shelf life in sealed bag : 12 months at < 40°C and < 90% RH
2. Peak package body temperature: 250°C
3. After bag is opened, devices that will be subjected to reflow solder or other
high temperature process must be:
a) mounted within 168 hours of factory conditions ≤ 30°C/60%RH, or
b) Stored as per J-STD-033
4. Devices require bake, before mounting, if
a) Humidity Indicator Card reads >10% for level 2a-5a devices or >60% for
level 2 devices when read at 23±5°C
b) 3a or 3b above are not met
5. If baking is required, refer to IPC/FEDEC J-STD-033 for bake procedure.
Note: Level and body temperature are defined by IPC/JEDEC
J-STD-020.