Data Sheet
Table Of Contents
- Datasheet
- Preface
- About this Datasheet
- Product Features
- Regulatory Approval
- Physical Characteristics
- 3.1 ECCN and Part Number
- 3.2 Electrical Operating Conditions
- 3.3 Environmental Operating Conditions
- 3.4 Power Supply Dimensioning
- 3.5 I/O Characteristics
- 3.6 Auxiliary ADC
- 3.7 Performance
- 3.8 Component Reliability
- 3.9 Package Description
- 3.10 Packing Information
- 3.11 Storage Conditions
- 3.12 Mounting Considerations
- Signal and Pins
- Acronyms
GM01Q DATASHEET PROPRIETARY 23
SEQUANS Communications
4
Signal and Pins
4.1 GM01Q Pinout
The signals and all the related details are listed in the MS-Excel companion
file delivered together with the present document in a PDF portfolio.
The pads listed in Table 4-1 are connected to ground.
Table 4-1: Ground and Thermal Pads
Pad # Pad Name Comment
1 20 22 24 26 28 30 31 32 33 34 42 43 45 46 53
55 62 63 64 65 66 68 69 70 71 72 73 74 86 87
GND All GND pads shall be connected to the same
copper.
T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12
T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
T23 T24 T25 T26 T27 T28 T29 T30
GND T1 to T30 pads are used as both GND and thermal
drops.