Data Sheet
Table Of Contents
- Datasheet
- Preface
- About this Datasheet
- Product Features
- Regulatory Approval
- Physical Characteristics
- 3.1 ECCN and Part Number
- 3.2 Electrical Operating Conditions
- 3.3 Environmental Operating Conditions
- 3.4 Power Supply Dimensioning
- 3.5 I/O Characteristics
- 3.6 Auxiliary ADC
- 3.7 Performance
- 3.8 Component Reliability
- 3.9 Package Description
- 3.10 Packing Information
- 3.11 Storage Conditions
- 3.12 Mounting Considerations
- Signal and Pins
- Acronyms
Table of Contents
Proprietary vii
SEQUANS Communications
3.12 Mounting Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Chapter 4
Signal and Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4.1 GM01Q Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4.2 UART Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.3 Power-up Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.4 LTE Low Power Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
4.4.1 General Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
4.4.2 Detailed Behavior of IO Pads of BIDIR Type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
4.4.3 Detailed Behavior of IO Pads of BIDIR_WAKE Type . . . . . . . . . . . . . . . . . . . . . . 28
Appendix A
Acronyms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31