Data Sheet

MECHANICAL CHARACTERISTICS
PACKAGE DESCRIPTION
24 PROPRIETARY GM02S DATASHEET (PRELIMINARY)
SEQUANS Communications
Figure 3-2: GM02S PCB View
Note: Gxx pads should be grounded to a large ground plane on
customer's PCB layer 1. It is also recommended to have the Gxx
pads area in the PCB through ground vias to improve thermal
dissipation efficiency.
Table 3-1: GM02S Dimensions (mm)
Dimension Value (mm)
L 16.3 ± 0.1
W 17.0 ± 0.1
T1.85 max
T0 0.5 max
L1 0.5 ± 0.1
W1 0.7 ± 0.1
L2 0.8 ± 0.1
W2 0.8 ± 0.1
a1 2.25 ± 0.1
a2 3.05 ± 0.1