Data Sheet
Table Of Contents
- Datasheet
- Preface
- About this Datasheet
- Product Features
- Regulatory Approval
- Physical Characteristics
- 3.1 ECCN and Part Number
- 3.2 Electrical Operating Conditions
- 3.3 Environmental Operating Conditions
- 3.4 Auxiliary ADC Specification
- 3.5 Power Supply Dimensioning
- 3.6 I/O Characteristics
- 3.7 Package Description
- 3.8 Packing Information
- 3.9 Storage Conditions
- 3.10 Mounting Considerations
- 3.11 Component Reliability
- 3.12 RF Performance
- Signals and Pins
- Acronyms
PHYSICAL CHARACTERISTICS
PACKAGE DESCRIPTION
SP150Q DATASHEET PROPRIETARY 18
SEQUANS Communications
Figure 3-2: Bottom Side View of the SP150Q Pads
Attention: T1 to T30 pads are used as both GND and thermal drops.
Table 3-9: SP150Q Dimensions and Tolerances
Mark Dimension and tolerance (mm)
L 22.53 ± 0.1
W 22.66 ± 0.1
A1 12 ± 1.0
A2 4.125 ± 0.5
A3 10.8 ± 1.0
A4 4.725 ± 0.5
A5 0.6 ± 0.05