Data Sheet
Table Of Contents
- Datasheet
- Preface
- About this Datasheet
- Product Features
- Regulatory Approval
- Physical Characteristics
- 3.1 ECCN and Part Number
- 3.2 Electrical Operating Conditions
- 3.3 Environmental Operating Conditions
- 3.4 Auxiliary ADC Specification
- 3.5 Power Supply Dimensioning
- 3.6 I/O Characteristics
- 3.7 Package Description
- 3.8 Packing Information
- 3.9 Storage Conditions
- 3.10 Mounting Considerations
- 3.11 Component Reliability
- 3.12 RF Performance
- Signals and Pins
- Acronyms
PHYSICAL CHARACTERISTICS
STORAGE CONDITIONS
23 PROPRIETARY SP150Q DATASHEET
SEQUANS Communications
3.9 Storage Conditions
1. Calculated shelf life in sealed bag : 12 months at < 40°C and < 90% RH.
2. After the moisture barrier bag (MBB) is opened, devices that will be
subjected to reflow solder or other high temperature process must be:
a) mounted within 168 hours under factory conditions = 30°C/60%RH, or
b) Stored as per J-STD-033.
3. Devices require dry bake, before mounting, if
a) Humidity Indicator Card reads >10% for level 2a-5a devices or >60% for
level 2 devices when read at 23±5°C
b) 2a or 2b conditions above are not met.
4. If dry bake is required, refer to IPC/JEDEC J-STD-033 for bake procedure.
Note: Level and body temperature are defined by IPC/JEDEC
J-STD-020.