Integration Guide
Table Of Contents
- Module Integration Guide
- Preface
- About this Guide
- Introduction
- Manufacturing Process
- Hardware Integration Recommendations
- PCB Layout Rules
- Bring-Up and Testing
- Hardware Test Preparation
- Abbreviations
MODULE INTEGRATION GUIDE PROPRIETARY 27
SEQUANS Communications
5
Bring-Up and Testing
5.1 Introduction
The purpose of this chapter is to describe what has to be done for board
bring-up, test and qualification.
The expectations at this stage of the product’s life are:
1. Consider any inconsistent and potentially hazardous manufacturing faults
to be eliminated.
2. Confirm that it is safe to proceed to further detailed calibration and
measurement steps.
3. Evaluate board performances.
5.2 Prerequisites
The following lists the necessary tools to perform all aspects of the Hardware
Qualification.
1. Device under test
a) Without VZM20Q assembled:
- to check RF extra loss between the VZM20Q RF ports and product RF
output
- to perform sanity check of connection with VZM20Q
- for debugging if necessary
b) With VZM20Q assembled: to do hardware qualification
2. External Host PC / Laptop for UART interface
Note: Detailed information will be provided in a future revision of
this document.