Integration Guide
Table Of Contents
- Module Integration Guide
- Preface
- About this Guide
- Introduction
- Manufacturing Process
- Hardware Integration Recommendations
- PCB Layout Rules
- Bring-Up and Testing
- Hardware Test Preparation
- Abbreviations
BRING-UP AND TESTING
FUNCTIONAL VERIFICATION WITHOUT ASSEMBLED MODULE
28 PROPRIETARY MODULE INTEGRATION GUIDE
SEQUANS Communications
3. LTE RF test equipments Setup
a) Shielding box to avoid any RF performances results degradation due to
environment
b) RF components such as: cable, splitter, 50 Ohm loads corresponding to
the RF working band
4. Power supply with current measuring ability
5.3 Functional Verification without
Assembled Module
Attention: If a fault is discovered, consider the impact of the issue observed
on all the manufactured samples.
The purpose of this section is to establish a sanity check of the board before
soldering the module, in order to avoid any damage due to a manufacturing
issue.
This test covers VBAT power supply.
5.3.1 Power Supply
5.3.1.1 Test Procedure
Figure 5-1 presents the equipment necessary to perform the next following
test steps and the required configuration for test.
Figure 5-1: Pre-Test Configuration (No Module on Board)