Integration Guide
Table Of Contents
- Sequans Monarch Go-GPS BLE
- Datasheet and Hardware Integration Guide
- Legal Notices
- Document Revision History
- Table of Contents
- Introduction
- 1. Product Datasheet
- 1.1. General Description
- 1.2. Applications
- 1.3. System Architecture
- 1.4. Mechanical Overview
- 1.5. Product Characteristics
- 1.6. Digital board-to-board connector
- 1.7. Electrical
- 1.8. Environmental
- 1.9. Mechanical drawings
- 1.10. Label
- 1.11. Certifications
- 1.12. Regulatory Approval
- 1.13. Export Control Certification Number (ECCN)
- 2. Integration guideline
- 3. Verizon SIM sign-up procedure to activate ThingSpace IoT SIM
- 4. Troubleshooting
Confidential and Proprietary
Monarch Go-GPS-BLE Datasheet and Hardware Integration Guide, Rev 1
3/28
Table of Contents
Introduction ............................................................................................................................................... 4
1. Product Datasheet ............................................................................................................................ 4
1.1. General Description .................................................................................................................... 4
1.2. Applications ................................................................................................................................. 4
1.3. System Architecture .................................................................................................................... 4
1.4. Mechanical Overview .................................................................................................................. 5
1.5. Product Characteristics ............................................................................................................... 6
1.6. Digital board-to-board connector ................................................................................................ 8
1.7. Electrical ...................................................................................................................................... 9
1.8. Environmental ............................................................................................................................. 9
1.9. Mechanical drawings ................................................................................................................ 10
1.10. Label ......................................................................................................................................... 11
1.11. Certifications ............................................................................................................................. 11
1.12. Regulatory Approval ................................................................................................................. 11
1.12.1. FCC statement ............................................................................................................................................... 11
1.12.2. IC Industry Canada Statement ....................................................................................................................... 12
1.13. Export Control Certification Number (ECCN) ........................................................................... 13
2. Integration guideline ........................................................................................................................ 14
2.1. Digital connector ....................................................................................................................... 14
2.2. Bluetooth Low Energy interface ................................................................................................ 16
2.3. Physical integration ................................................................................................................... 17
2.3.1. Placement without flex cable .......................................................................................................................... 17
2.3.2. Placement with flex cable ............................................................................................................................... 18
2.4. Functional testing ...................................................................................................................... 18
2.5. Configuration ............................................................................................................................. 19
3. Verizon SIM sign-up procedure to activate ThingSpace IoT SIM ................................................... 20
4. Troubleshooting .............................................................................................................................. 28
4.1. Replacing the SIM card ............................................................................................................. 28
4.2. Connecting a RF cable to LTE connector ................................................................................. 28