User's Manual

E
hong
T
10.
The sol
The da
t

210
217
℃
250
0
25
Pre-he
a
C/s.
T
This st
a
solvent
Equili
b
solder
p
elevati
o
elimina
t
tempe
r
Equili
b
recom
m
Reflo
w
referen
c
good
w
solderi
n
recom
m
second
Coolin
g
give a l
o
T
echnology C
o
Reflow
dering pro
f
t
a here is g
i
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a
t zone (
A
T
he purpos
e
a
ge is requ
i
to reduce
t
b
rium Zon
e
p
articles an
o
n of temp
e
t
ing oxide
r
ature is re
b
rium Zon
e
m
ended to
k
w
Zone (D)
c
e for othe
w
etting but
n
g time c
a
m
ended pe
a
when the t
g
Zone (E
)
o
ngerlastin
g
o
., Ltd 
Profile
f
ile depend
s
i
ven only f
o
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F
A
) — This z
e
of this zo
i
red to dist
r
t
he heat sh
o
e
1 (B) —
d spread o
v
e
rature and
film forme
d
commend
e
e
2 (c) (o
p
k
eep the te
m
— The p
r
r lead-free
not so hi
g
a
n lead t
o
a
k tempera
t
emperatur
e
)
— The co
o
g
joint. Ty
p
s
on variou
s
o
r guidance
B
2
F
igure 22:
R
one raises
ne is to pr
e
r
ibute the h
e
o
ck to com
p
In this st
a
v
er PCB b
o
liquefactio
n
d
on the
s
e
d to be 1
5
p
tional) —
m
perature i
n
r
ofile in th
e
solder. Th
e
g
h as to c
a
o
intermeta
t
ure (Tp) is
e
is above
2
o
ling ate s
h
p
ical coolin
s
paramete
r
on solder
r
3
R
ecommend
e
the tempe
r
e
heat the P
C
e
at unifor
m
p
onents.
a
ge the flu
x
o
ard, preve
n
n
of flux, ea
s
urface of
5
0 to 210
In order t
o
n
210 – 21
7
e
figure is
e
peak te
m
a
use com
p
llic growth
230 ~ 25
0
2
17 C.
h
ould be fa
s
g rate sho
r
s necessit
a
r
eflow.
C
4
e
d Reflow
P
r
ature at a
C
B board
a
m
ly to the P
C
x
becomes
n
ting them
ch activato
r
each sold
e
for 60 to 1
2
o
resolve t
h
7
 for abou
designed f
o
m
perature s
h
p
onent dis
c
which c
a
0
C. The
s
s
t, to keep
uld be 4 
C
B
a
ting a set
u
D
5
P
rofile
controlled
r
a
nd compo
n
C
B board
a
soft and
u
from being
r
and rosin
e
r particle
2
0 second
h
e upright
c
t 20 to 30
s
o
r Sn/Ag3.
h
ould be h
i
c
oloration
o
a
n result i
n
s
oldering ti
m
the solder
C
.
B
luetooth Au
d
u
p for each
5

r
ate, typic
a
n
ents to 12
0
a
nd comple
t
u
niformly e
n
re-oxidize
d
get activat
e
and PCB
for this z
o
c
omponent
s
econd.
0/Cu0.5.
I
i
gh enough
o
r damage.
n
a brittle
m
e should
b
grains sm
a
d
io Module
applicatio
n
6
mi
n
E
a
lly 0.5 –
2
0
~ 150 C
t
ely remov
e
n
capsulate
s
d
. Also wit
h
e
d and star
t
board. Th
e
o
ne.
issue, it i
s
I
t can be
a
to achiev
e
Excessiv
e
joint. Th
e
b
e 30 to 9
0
ll which wil
n
.
n
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2
.
e
s
h
t
e
s
a
e
e
e
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l